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Structure diagram of MEMS package test

Structure diagram of MEMS package test

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Figure 1. Structure diagram of MEMS package test
Figure 2. Schematic diagram of bonding principle
Figure 4. Microscope diagram of glass surface bonding
Bonding void fraction of 395℃-485℃ temperature Sample Area mm 2...
Bonding void fraction of 20s-180s Sample Area mm 2 Pressure N Time s...
Research on the Glass Silicon Anodic Direct Bonding Parameters
Article
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  • Nov 2015
p>By MEMS packaging test platform for bonding process of bonding temperature and bonding time,and test silicon specifications experimental study.Firstly,according to the anodic bonding principle,the main factors to detemine the effect of bonding quality.Secodly,change the bonding temperature,bonding time,and test wafer size and other parameters,gla...
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Context 1
... package test platform is mainly used for packaging materials clean dry environment. The main structure shown in Figure 1, including the tray feeding mechanism; manipulator automated handling module; furnace combination; trays clamping motion mechanism; microscopy; Trays out of the feeding mechanism etc. ...