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Dear Profs/ Scientist, if any one is interested or have plan to publish a good quality books/ book edited , I can contribute/help such type of research works . My research interest is : Integrated Circuits, Microelectronics, VLSI, Advanced Circuit Design , Low power electronics, Ferroelectric based Device and Development . My/our latest publications :
Handbook of Emerging Materials for Semiconductor Industry
Advanced Ultra Low-Power Semiconductor Devices: Design and Applications
Interested expert can email : sbrahi@gmail.com
Details will be discuss step by step
More details about my publications are avialble:
Google scholar links:
Amazon link:
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yes sir, i am interesting .
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I really want to be an IC designer but I haven't found a course related to that. Should I purchase a special book or do something else.
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The standard route to becoming a designer of integrated circuits is to study electronic engineering, and find a course that includes semiconductor physics and semiconductor device and integrated circuit manufacturing manufacturing.
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IEEE International Conference on Omni-Layer Intelligent Systems (COINS-2024) is excited to announce a special session on the Use of Microelectronics in IoT and AI ecosystem Sustainability as part of our upcoming conference, scheduled to take place at King's College, London, 29-31 July 2024. This special session offers a unique opportunity for graduate students, researchers, scholars, supervisors, experts from diverse fields, and industrialists to present their work and engage in discussions focused on Microelectronics applications in IoT and AI ecosystem sustainability.
Special Session Theme:
We welcome original research papers, case studies, innovative practices, and work in progress that contribute to advancing knowledge and understanding within the scope of IoT and AI Ecosystem Sustainability. Submissions may explore empirical, conceptual, or practical aspects, including various perspectives, disciplines, and methodological approaches toward IoT and AI Ecosystem Sustainability. The topics of interest include but are not limited to:
➢ Semiconductor,
➢ Electronics devices,
➢ Microelectronics
➢ Nanotechnology
➢ Nanomaterials
➢ e-waste
➢ Bio-degradable in electronics
➢ VLSI/ULSI.
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Important Dates:
➢ Technical Papers: March 31, 2024
➢ Acceptance Notification: May 31, 2024
➢ Camera-Ready Submission: June 20, 2024
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Kindly help me by providing the values of electronic properties (bandgap, electron and hole density of states, dielectric permittivity and electron and hole mobilities) of Niobium Nitride (NbN) at room temperature and cryogenic temperature application. It would be of great help for my study.
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I'm looking for NQR properties of Niobium Nitride in various phase (crystal structure).
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Greetings everyone,
Field: VLSI/Microelectronics/Solid State Electronics
I am from the VLSI field, and many times, a comment comes regarding the fabrication process flow of surrounding gate MOSFET structures. I wonder how to draw the 3D MOSFET (concentric cylinders) or the fabrication process flowchart with block diagrams. Which software do you use to draw similar things? I am attaching a picture for reference.
Any response is appreciated.
Thanks and regards
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You can use "Solidworks" or "google Sketchup"
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Is system operating with low frequency dissipates higher leakage power than system operating with high frequency?
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Leakage power is mostly due to subthreshold conduction. BTBT and DIBL are quite obvious in deep nanometer devices.
In case of memories, if the hold time is more, more will be the leakage. Of course, there might be some leakage path in the circuit.
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Both SRAM and Flip-flop are volatile memory element. Is there any applications where both are used?
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Flip-flop are the bricks from them more complex functional units can be built. These can be, for instance, registers, counters, frequency dividers, state machines, or SRAM modules that you mentioned. Complex state machines are CPUs, integrated in microcontrollers, they contain a plenty of flip-flops. Some of them are used in the CPU to process the instructions or store data. Other ones build CPU's RAM or I/O registers, counters, etc.
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critical path analysis of digital VLSI circuit, any tools for finding it?
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It depends on your project,
If you want to implement Arithmetic circuits, then the PSO-based transistor sizing method and Simple Exact Algorithm (SEA) based transistor sizing has been specially designed for arithmetic circuits.
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Hi, Looking for your kind reply.Thanks in Advance.
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Scopus Indexed Journals
1. IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2. Integration, the VLSI Journal
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Like MPFP, important sampling etc.
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You should perform Monte Carlo simulations with at least 10,000 iterations at worst process corner and temperature.
For HSNM and RSNM: FS corner and 125 'C
For WSNM: SF corner and -40 'C
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When we measure voltage across a isolated diode, what will the voltmeter read?
1) 0 V but voltmeter shows a non zero value which is approximately equal to built-in voltage.
2) Built in voltage but if it's the case then why can't we use diode as a voltage source?
PS : I was taught in my bachelors that we get a 0V reading across diode which is the algebraic sum of built in voltage and the voltage across metal(wire)-semiconductor interface.
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Yes, certanly 0V just from point of energy conservation. Of course, you will get some in illuminated diode or diode subjected to significant thermal gradient (thermocouple effect). When usual multimeters probes the diodes in the 'diode mode' it sources small constant current e.g. 0.5mA and that current forces some voltage drop across the diode.
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I found that, latches can capable to hold the correct data even the data changes slightly before the falling edge of the clock.
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Denis' answer is correct. Sequential cells can have negative hold properties. This is counterintuitive at first (we tend to think of hold as time after a clock edge, not before an edge), but it is entirely possible and does not cause any problems.
This is not the same as having a negative hold timing during Static Timing Analysis of a full design, which would for sure be a problem.
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What is the major difference between the pre-layout and post-layout simulation?
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Generally the main difference is the difference in performance of the circuit. However it depends on the circuit you care about. In some cases parasitic resistance is much more important than cap i.e. the voltage drop across power line is dominant over degraded GBW because it may jeopardize the proper operation of the circuit. Also in some cases parasitics act for your favor i.e. current mirrors and the parasitic capacitance on the gates acts like decap.
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how one can estimate the drain area?
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Using the Electric VLSI design software, you can design any MOSFET by defining the main parameters such as the length and width of your device. Drain area extraction and many other parameters can then be performed using the desired technology node and the Spice simulator.
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Hey guys,
Please suggest the list of scopus list of journals for VLSI, Wireless networks and Wireless communications (Unpaid and paid)
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Hello venkataraman,
You can check the following link for free and fast publication of scopus journals.
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Hi all,
Does PUF stop side channel attacks?? If so, how does PUF stop side channel analysis based on timing differences or power differences??
Thanks in advance..
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It does not stop side channel attack. In contrast, one of the problems of PUF is the side channel attack itself.
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How variation of Vth and Tox impact on performance of the mos circuit?
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Sandeep Kumar The MOSFET's threshold voltage is a function of oxide layer thickness, which means that as the oxide layer thickness increases, so does the device's threshold voltage.
The Effects of Voltage Scaling on Power and Delay Although lowering the power supply voltage decreases dynamic power dissipation dramatically, the inherent design trade-off is an increase in latency.
The charge trapping caused by the defect in the oxide layer adds to the leakage current in the drain current ID. As the gate voltage increases, so do the impact of gate leakage. The formation of defects in the oxide is most likely affected by the thickness of the oxide layer.
Wet oxidation produces a lower-density oxide with lower dielectric strength. Dry oxidation is impractical because of the long time necessary to build a thick oxide. Thick oxides are typically formed via protracted wet oxidation followed by brief dry oxidation (a dry-wet-dry cycle).
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Hello everyone,
I had written two papers. One of the paper is on analog performance of GAA MOSFET and second one is on bio sensing performance of GAA MOSFET.
Both these papers are simulation based. I had sent them to various journals but unfortunately got rejected due to absence of any device physics( I am working on device physics in my current work-next paper).
I want to know if any Scopus or SCI based journal that can possibly accept these papers. I am really depressed since its been more than a year but its getting rejected. Any Scopus journal will also work but should be recognized.
Please, suggest me some journals seniors and respected people. Kindly help me.
DOMAIN- Electronics(VLSI) and MOSFET based Biosensors
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You can try Silicon.
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I have made a current mode Flash ADC which works at around 100MHz. I need to design a S&H circuit for sampling the input current.
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Thanks Afaq, this was helpful.
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I am plotting the graphs in MS EXCEL. But after seeing IEEE papers, I noticed that the figures are small with a better clarity. I am wondering if there is any other software that may be used for the same. I know there are many free softwares but which software do you prefer.
When I try to reduce my figure size(plotted in EXCEL), it looks distorted.
PS: I need to plot graphs with loads of data (related to MOSFET and TFET).
Any suggestion will be appreciated.
EDIT (10/10/2022): I have used ORIGIN for the recent papers and the results are quite satisfactory.
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I have been working with Floating Gate MOSFET(FGMOS) to see its performance on different parameters for different dielectrics(including stack and engineered dielectrics) I could not find any software or any particular method of simulation for getting the data. Can anyone suggest a way to do it?
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Sentarus TCAD or Silvaco can be used.
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CMOS is used in VLSI. Can advancement in CMOS nanoscale increase the endurance life of VLSI?
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It is so that the bipolar transistor is distinguished in linear integrated circuits as it has much higher speed, greater linearity and dynamic range as well as smaller area to achieve the same gain.
It was also distinguished by the very high speed logic circuits such as emitter coupled logic or the current mode logic.
As for the technology it is also scaled down using advanced bipolar transistors such as SiGe transistor and the widegap emitter transistor.
It may be then that CMOS transistors was scaled down further to nanometer scale such as FINFET. These transistors outperforms the other types of transistors in speed, power consumption and area.
But there is an observation: Any new device can not render the others comletely obsolete. There will be some application ranges where they outperform the others.
It is the high power and high frequency.
In spite of an old paper you may find it useful as it presents the evolution of the bipolar technology in the past.
please give me feedback about this paper!
Thank you!
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with HDL coding, we can do functional verification. what else can we do with the help of other tools may be like chipscope pro, FPGA board etc
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welcome!
What do you mean with front? Front end of what system?
In case of rf radio transceivers that are now software defined, the functions are divided into analog rf part, data converters (A/D andD/A converters) and digital subsystem. The digital subsystem can be divided into two main functions, the frequency conversion and modem subsystem as well as the base band processing. The high speed digital subsystem can be termed the digital subsystem frontend while the base band processing with lower speed can be termed the backend digital subsystem.
The tools are:
Hard ware platforms such as fpgas, dsps, dedicated processors, and general purpose processors.
The software is operating systems, device drivers, middle ware and application software.
As for the fpga tools are VHDL design suit such as the ISE design suite from XILINIX.
One can use MATLAB/SIMULINK also for system and preliminary design.
Such designs can be compiled to VHDL using system generators.
The same is valid for design using DSPs. MATLAB codes can be compiled on DSPs by code composer studio from Texas instrument.
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In my design I require some transistors with high threshold voltage. At schematic level, what changes should I do so that I can get transistors with high threshold voltage.
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I would suggest few points for MOSFET transistors, hope this will help.
1. You can use a material with high permittivity in the fabrication of transistor (conventional approach).
2. Keep doping of source and drain very high compared to the doping of the channel (practical approach).
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"Self-fulfilling prophecy" is Moore's own definition, while "a convenient fiction" is somebody else's...
I have decided that, giving some excerpts from two relevant articles will be more helpful than trying to explain my personal views in detail.
A.Z.
Excerpts from the article "Was Moore’s Law Inevitable?" by Kevin Kelly:
(...) Writing in 2005, (...) Moore says, “Moore’s Law is really about economics.” [Moore's colleague] Carver Mead made it clearer yet: Moore’s Law, he says, “is really about people’s belief system, it’s not a law of physics, it’s about human belief, and when people believe in something, they’ll put energy behind it to make it come to pass.”
(...) Finally, in a another reference, Mead adds : “Permission to believe that [the Law] will keep going,” is what keeps the Law going. Moore agrees in a 1996 article: “More than anything, once something like this gets established, it becomes more or less a self-fulfilling prophecy. The Semiconductor Industry Association puts out a technology road map, which continues this [generational improvement] every three years. Everyone in the industry recognizes that if you don’t stay on essentially that curve they will fall behind. So it sort of drives itself.”
(...) Andrew Odlyzko from AT&T Bell Laboratories concurs: “Management is *not* telling a researcher, ‘You are the best we could find, here are the tools, please go off and find something that will let us leapfrog the competition.’ Instead, the attitude is, ‘Either you and your 999 colleagues double the performance of our microprocessors in the next 18 months, to keep up with the competition, or you are fired.'”
Excerpts from the article "A Moore’s Law Mystery" by Rose Eveleth:
(...) Moore’s Law probably didn’t start as a marketing ploy. Even Carlson will admit that. But it then became, what he called, “a convenient fiction.”
Thomas Haigh, a historian of technology at the University of Wisconsin, had a similar idea. “[Moore’s Law] has always been more of a self-promotion for the wondrous accomplishments of the semiconductor industry than a law of nature,” (...) “It’s also been a kind of self-fulfilling prophecy, since it’s taken ever larger investments of research and development money to keep it coming true."
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The so-called Moore's laws are distinguished by the fact that they are formulated in such a way as to serve as a "self-fulfilling prophecy."
Regards,
Dariusz Prokopowicz
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I've required of one best software name by which I can design the layout of ICs. Help me.
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Dear Soudip Sinha Roy,
Check out the links below
2. LASI (LAyout System for Individuals) : https://lasihomesite.com/
and the list of other open-source CAD tools can be found at
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Recently, IBM have made the claim that they achieved the world's first 2 nm process node using nanosheet technology.
The media -as expected- jumped right into it, and some started comparing transistor size to the atom and "Fingernail" sizes!
While the research is (obviously) very remarkable and exciting, why does the industry still use such inaccurate descriptions, that even experts in the field get wrong.
Why not -at least- talk about transistor density !
How the interconnect could be handled?
What about the yield?
What does this mean for the final chip performance and pricing?
Notes: Some say that EUV is adopted at all levels of the process.
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For a nominal fingernail 1cm x 1cm = 0.0001m2
So, one transistor per 0.0001 / 50,000,000,000m2 = 2 x 10-15 m2 = 2000 nm2
No idea in terms of cells.
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Currently, I'm working with Adiabatic Logic, I have found few quality papers, most of the papers just discussed some adiabatic logic families but haven't compared them with conventional CMOS logic. While I was simulating some adiabatic logic gates and measured power then compared with corresponding conventional CMOS logic gates, I have seen conventional logic dissipates less power. My question is, why adiabatic is then considered a good methodology for low power VLSI?
I have used 16nm PTM LP model in LTspice to run the simulation.
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Adding to colleague U. Dreher you have to feed the adiabatic logic with a dynamic power power supply to satisfy the adiabatic condition which means that one has to preserve the total charge in the circuit.
The main issue is that you on the transistor when its VDS=0 and you off the transistor when the current through it is zero.
You have to be sure that these conditions must be satisfied in you logic.
If you satisfy this condition the dynamic power will be zero.
I will give you a very simple example of adiabatic circuit.
Assume that you have an ideal inductor in parallel to a capacitor both are lossless.
Assume that we charged the capacitor, then this charge will alternate between the capacitor and the inductor indefinitely and this is a similar condition to that prevails in the adiabatic logic.
Best wishes
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Hi all,
Can anyone suggest how to execute a Perl Script on windows 10 ???
I am using Strawberry 🍓 Perl for this.
When I am trying to execute as below under C drive in command prompt ,I am getting error.
C: perl hello_world.pl
Can anyone one help me out.
Thanks.
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Thanks a lot. Its working now.
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It is a general practice to introduce Ground Plane in FDSOI devices under the BoX. The Ground Planes are introduced by Ion Implantation through Top Si layer and Buried Oxide. I wanted to know that by doing this implantation, don't they harm the crystalanity of the Top Si layer in which the FDSOI MOSFET will be formed ? Since in FDSOI, they prefer very Low doped or even undoped Si channel, so by doing Ground Plane implantation, don't they affect the intrinsic/undoped/low-doped nature of top Si layer.
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Now every thing is very clear and I can answer your question.
Yes you can produce the p+ GP layer by Boron ion implantation.
All what you consider is that you must adjust the range of the implantation to be below the BOX by about three times the deviation of the ion implantation range.
In this way the top silicon layer will not be doped.
After the implantation you need to make rapid thermal annealing only to heal the damage by the ion implantation.
Please report the results of this proposal please.
Best wishes
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Digital Twin NEWS! -ISO-IEC-JTC1-SC41-IoT has launched its Digital Twin framework standardisation at its Nov. Plenary. -Edge Computing & Networking, from VLSI to AI and back, in real time when needed, is essential in this endeavour, with specifications from ETSI (ETSI-ISG-MEC: Multi-Access Edge Computing), 3GPP and One M2M supporting this goal. Cyberphysical systems benefit highly of Digital Twins for optimised fault-tolerant operation, verification and validation, simulation, in particular. -Combining functionalities tightly is a must: software, efficient/secure and sustainable data handling, computing and networking may have to be jointly managed, and possibly integrated at every node of a system using fully Digital Twins.
Speed and energy efficiency are available from VLSI chips integrating two functional layers as the IMX500 from Sony: -Data layer: interfacing to the real world (analogue to digital sampling, and digital to analogue rendering, "data I/O" layer)
-Processing layer ("logic" layer) e.g. with AI algorithms to build or prepare decisions from the data acquired, and conversely to manage and implement decisions into the physical world.
Use cases include smart city functionalities, cognitive design/manufacturing, autonomous systems/vehicles.
What is your view on Digital Twin, in what role is it best positioned? Design? Operation? Fault correction? Other?
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Good Q
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For research purpose.
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Dear @Sivaiah,
You can develop a platform for software defined radio and software defined network. Such platforms can be used for prototyping and implementing base band and the medium access control functions.
I think developing such plat forms will spread such systems among the engineers.
Best wishes
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In bist(built-in-self-test) how to calculate the known good signature pattern which is used to compare with test pattern result . I am designing bist implementation for multiplier circuit using cbilbo registers in VHDL. Please help me any one .
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i generated signature by using LFSR as misr and prpg. Now I want to compare it with known good signature .So I wanted to know how to calculate known good signature
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1. Please Enlighten me if u have any idea?
2. Please could you help in sorting the same issue?
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Thanks but it does not support for N-bit Generalization of Quotient and Remainder Formulae for Binary Division
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In our current design of linear binary current steering low-noise CMOS slowDAC, we converged in the use of long channel NMOS transistors. Indeed, a low noise, lower than 10pA/√Hz at 100µA, and good matching of the weights of the binary DAC leads to the use of long channel NMOS transistor in the design of binary coded current mirrors.
It seems better to increase L than W to improve the current mirror matching looking at Monte Carlo Simulations.
NMOS sized with L as long as 20 µm for a W of 8 µm is considered. Assuming that such long channel NMOS transistors are unusual (?) in VLSI design ... have you experienced the use of long-channel transistors in VLSI DAC design? Any papers, or review about the use, and justifications, of long channel MOS transistors for ASIC design?
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There is no unusual dimension in analog design. The question is what is constrained by technology.
In classic CMOS (would say process older than 130nm) channel can be any long. Lower nodes (but not modern ones) like 28-130nm might has limit for channel length and also pocket/halo doping. In such case matching is length dependent and the best approach is to use stack of large number minimum length MOSFETs. Modern technologies (FinFET and FDSOI) has more constraints.
Nevertheless, DAC resolution is determined by matching and for given current designer has to maximize inversion region of current source and the only way to achieve it is by decrease W/L ratio and increase area.
So, back to your consideration 8um/20um dimensions are common rather than unusual.
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Trends concerning research in Digital VLSI domain.
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Thank you Radwa!
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after making the layout using Electric VLSI CAD tool i am trying to find some parameters
and i have a problem finding the input capacitance using spice
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Dear Mohamed,
Ramdan Kareem,
After making the physical lay out you have to extract the geometrical parameters of your transistors such that the width of the transistor, its channel length the perimeter length of the source and drain.
Then you can use these data together with the technology file supplied by the fabricator of the chip you can get the spice parameters of the transistor. This is the dot model cared of the device. So having this dot model parameters you can analyse your circuit by LTspice or any other spice solver.
The input capacitance can be obtained by applying a ramp input voltage V and measuring the current withdrawn by the circuit sat I.
then apply the relation to get the capacitance C= I/(dV/dt)
For measuring the SPICE parameter of a MOST please follow the link:
Best wishes
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Hello sir/mam
i am using Cadence virtuoso design tool
i have generated symbol of CNTFET ( n and p type) as per Standford compact veriloga code by NCFET_L3.va
then i designed inverter.
I want to ask you >>
1. there are five terminals Gate, Drain, Source, Sub and couple node.
i have shorted to Couple Node and Sub ,,>>>for nCnFet connected to ground via source and for pCnfet these terminal connected to vdc via Source
Is it correct?
2. Next i got accurate transient response but when i start to plot for power consumed of this inverter then i am getting no curve just straight line over 0 zero.
Help Me please.
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Dear Kumar,
You are utilizing the older version of Stanford compact model for CNTFET transistors. This model is based on numerical calculations and consumes a lot of run time !!. Therefore, I recommend you to utilized Stanford Virtual-Source model for CNTFET transistors. This model is implemented with Verilog-A Language and it is very compatible with HSPICE, CADENCE and ADS. I have utilized this model for three years and no failure has been observed during execution.
For more information, You can reach me at :
Whats app:
+989125725809
Email:
Best Regards.
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Both long-channel and cascode MOS transistors are used in VLSI design to increase output impedance of current sources (for instances : AE_Lecture8_PartB_Incremental Model of FET or Bias circuit design for low-voltage cascode transistors DOI: 10.1145/1150343.1150372).
Moreover, self-cascode MOS transistors can be definitely seen as a single long-channel MOS transistor (Self-cascode composite transistor Analog and Mixed-Signal Center - ELEN 607 ESS).
So, to improve the output impedance of a current sources, what are the pro/cons reasons to choose a longe-channel or a cascode MOS output transistor?
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Adding to the colleagues above, I think the cascode current mirror configuration is basically outperforms the long channel transistors as the output transistor in the cascode is common gate transistor where the long channel transistor is still common source suffering from channel shortening due to the an increase in VDS. This effect is called Early effect. But it may have an area penalty against the cascode current mirror where a lower output resistance is acceptable for the current mirror.
Best wishes
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HDL - VLSI Circuits
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any SPICE supporting simulators shall take switch level modeling of CMOS circuit design and produce both DC and transient response. XILINX mainly focuses on FPGA design for which neither switch level modelling nor CMOS circuit topology is needed.
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I am looking for a circuit which can generate an emf oscillating at frequency of 2.5Ghz.
My setup is in such a way that, I am passing particles (negligible mass) from a tunnel and want an emf perpendicular to the flow. The emf should have frequency of 2.5Ghz
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Adding to the colleagues above there are many structures of the such oscillators where they can be built from discrete elements using one transistor such as colpitts oscillator or integrated oscillators with controlling voltage to tune them.
I would propose that you use an integrated voltage controlled oscillator at 2.5 Ghz. You can search the web for data sheet. If the output power is not sufficient to drive your load then you can use a class E or F amplifier tuned at the 2.5GHz .
If you want crystal stability you can use an frequency synthesizer FS with crystal reference as George hinted.
Best wishes
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Please tell me some research oriented books for low power VLSI and low power Semiconductor Memory technology.
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Adding to Aparna,
I think that there is now the ultra low power cmos circuit design using nanometer scale transistors. Such research oriented book are normally multi author books.
Best wishes
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A book or some set materials are not even close to enough for CMOS Layout design. But to start with, I require a good book and some relevant materials. I have done the layouts of some basic static CMOS circuits. Now it is the time to make the layout of the design I am working with (an architecture of ternary CAM with some control and gating circuitry).
Which books or materials I can refer for an optimised layout? I am going to use virtuoso layout suite for the design.     
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Old books but may be useful for learning
-VLSI Design Techniques for Analog and Digital Circuits by Geiger
- Principles of CMOS VLSI Design by Weste,Neil H. E.; Eshraghian,Kamran
Best wishes
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Hi everyone, I don't under this layout figure (5.c) in pic attached .
This is a screenshot from research paper in this link:- https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7573442
My basic Curiosity is that layout are generally in shape of squares and rectangles, but in this layout what is that blot (ink drop) like thing in fig 5.c
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I second Samuel Pagliarini's answer above. In fact if you search in the manuscript there is no explicit citation to Fig. 5c, however when Fig. 5 is referenced it states:
" ... were assessed with a design synthesis flow on a multi-million gate industry test case (Fig. 5). "
So what we are seeing on the Fig. 5c is a printout of the said synthesis flow tool (possibly Cadence Encounter as Samuel Pagliarini mentioned) highlighting something. What is highlighted remains unclear, but we can assume it has to do with the RC effect estimation!
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I am trying to extract the effective channel length of a MOS transistor in 130 nm CMOS technology (Lmin = 120 nm). Or I should say the measure of lateral gate/drain (or gate/source) overlap using DC current methods described in "MOSFET modeling for VLSI simulation" by Narain Aroa. My problem is that each method yields a (vastly) different number.
Could somebody please help, shed some light or suggest some new methodology?
Lukas
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Lukas: Best regards. I am attaching a pdf textbook of Professor Dr. Dieter K Schroder book where in Chapter 4 you will find the standard methods to extract channel length of MOSFET which are industry-practiced. I am also attaching couple of articles in order of importance or relevance. I hope the book and articles will be helpful to analytically derive the value of channel length from measured experimental data.
If my answer is helpful for your question or research, please recommend my answer. Thank you.
Sincerely,
Dr. Nabil Shovon Ashraf
Associate Professor
SAC 932
Department of ECE
North South University
Dhaka, Bangladesh.
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What are application areas in which VLSI and MEMS work together?
How MEMS devices play vital role in VLSI industry?
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Dear Dr. Anuj Goel,
Application areas in which VLSI and MEMS work together.
  1. Very Large Scale Integration (VLSI) of electronics components on a silicon chip is now a mature technology. Continuing development of electronics systems of increasing complexities in silicon and communication systems in fiber optics has brought us to the era of Information Technology. MicroElectroMechanical Systems (MEMS) are micrometer scale mechanical devices that are being used in growing number of application such as communications, computers, entertainment etc. MEMS bring together the fabrication and manufacturing technologies of both VLSI and precision engineering fields.
  2. The VLSI technology was advanced by the time real interest in MEMS picked up in the 80s. A variety of materials used in VLSI were of immense importance to the MEMS designers because these were already available in the technology. The MEMS technology could, therefore, include these in its own processes.
  3. The main result of scaling down is that the mechanical devices will become smaller and smaller as a natural consequence of linking of MEMS technologies to VLSI technology.
  4. The MEMS technology has evolved from the initial start as a subset of the VLSI technology. It maximised the advantages of using the basic processes from the IC technology that were meant for microelectronics devices. Naturally, very good physical sensors were made in silicon. With more mechanical structures becoming available after the advent of surface micromachining, the MEMS technology has now pushed ahead on its own. However, the ideal goal of integrating both micromechanical as well as microelectronics components on the same chip keeps these two technologies together.
I hope I have answered your question.
With Best Wishes,
Samir G. Pandya
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Please suggest me list of scopus indexed journals with rapid publication and low publication charges in the field of electronics/VLSI/Circuit design? plz reply asap
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Mehedi Hasan 's provided various journals according to different categories. However, each of them have at least 2 month review time. So if you intend for fast review process, it would be better for you to find some Indian journals instead
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I am trying to write my dissertation about automatic quantification of algorithms. These algorithms are written as a C function, which represents the behaviour of a VLSI circuit. The main purpose of the dissertation is to maximize the number of removed bits from the word-lengths of the signals describing a VLSI circuit, by finding a sub-optimal combination which fits a rule. The rule is that any combination must cause an error less or equals to a boundary error.
In order to find this suitable combination which is close to the error boundary and maximize the removed bits, my dissertation supervisor suggested to use local search algorithms. Due to the execution of the quantification will be made over a GPU (CUDA), I have found that the differential evolution and cellular genetic algorithm are suitable for a SIMD machine and easy to implement and execute in parallel. The constraints of the problem are: use of fixed point quantification, error produced at the outputs = fitness function and word-lengths from 1 to 22 bits (integer values). Actually, I have implemented the canonical DE (DE/rand/1/bin) and cGA (NEWS, 2D toroidal grid) over CUDA for any number of signals describing the VLSI circuit.
Before testing the algorithms with real VLSI circuits, I am testing them with a synthetic benchmark to confirm the related work and suggestions made about DE. This benchmark returns an output error (1 output circuit) based on this formula: sum in j elements of [ (element_j_of_individual_i - element_j_of_local_optimum) * 2 * factor ] with factor selected randomly for each element for 0,5 to 0,9 . Hence, if an individual of the population is an exact match of the pre-selected local optimum, the error returned by this fitness function will be 0. For an individual who has at least one element under the corresponding element of the local optimum will be discarded (and if it belongs to the initial population, will be regenerated until obtaining a valid individual).
Using this schema, the parameters of the benchmark are:
- population size of 5D, 10D, 15D and 20D (with D = number of signals describing the VLSI circuit), with each element in the population set randomly from 16 to 22 for each execution. ex: for D = 5, individual_number_0 = {14, 17, 21, 19, 20}
- randomly pre-selected local optimum from these values: {6,7,8,9,10}. ex: for D = 5, local_optimum = {7, 10, 6, 9, 6}
- ten executions trying to eliminate someway the bias caused by a pre-selected local optimum
- F = 0.5 and CR = 0.1
- the algorithm will stop when the local optimum is found or when all the generated offsprings are not valid and/or not better than their parents
For this set-up, I have found that for 50, 100 and 150 signals, the DE found the exact pre-selected local optimum for populations of 5D, 10D, 15D and 20D in the ten executions in several iterations (if requested, I could upload the iterations, timings, etc). For 200 signals the DE only found the local optimum for 10D, 15D and 20D. For 250 signals, only one execution of the ten for 20D found the local optimum; not founding it for any iteration of 5D, 10D or 15D. I have tried to relax the termination condition of the search by establishing an error boundary some way close to 0 (like 50, 70, 100 values) to find sub-optimal solutions for population sizes of 5D, 10D, 15D and 20D (D = 250). Although I have relaxed the termination condition, the algorithm stops without founding the local optimum.
I have found the Q&A from Stephen Chen: 'What is the optimal/recommended population size for differential evolution? ' but I do not know if these questions will fit my needs a priori, because I would like to use DE for VLSI circuits up to 400 signals in a first approach.
(Edit): added some examples: one randomly initialized individual in the initial population and one randomly pre-selected local optimum.
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Papers report that DE is sutable for optimization problems from low dimensional spaces to high decisión variables.
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I want to know about extraction of barrier height using silvaco atlas tool for schottky barrier mosfet simulation.
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By varying temperature for fix voltage and extracting current out of the diode and plotting Richardson graph can give barrier height.
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In pattern-recognition applications is common the use of log-sigmoidal neurons at the output of the NN to indicate a sort of "probability" of occurrence for events. Nevertheless, in a scenario in which the possible events must be ordered to select the most probable ones, linear activation functions could reproduce the same order (in fact, any monotonic function would maintain the same order). Therefore, the difference could be the simplicity since a linear neuron is easily implementable in a VLSI circuit, as an example, rather than a log-sigmoidal. Does this mean that log-sigmoidal can be replaced in any case? I think that probably no, since back-propagation training could be performed easily when a log-sigmoidal function is used so that training is performed with log-sigmoidal but for the final application, a linear one replaces this function.
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The choice essentially depends on the type of the problem being solved, on the required performance and speed, on the accuracy of the calculations, on the data coding method, on the method, the learning algorithm, on the neural network model itself, etc. For many tasks, especially clustering, recognition, where determine the winning neuron, and ensure high speeds and very fast convergence of processes, the most appropriate, in my opinion, equivalence nonlinear activation functions, and for simplicity of their hardware implementation, their simplified piecewise-linear nye approximation. Try to read my publications.
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While drawing the layouts in VLSI, we use layers like HVT (High threshold voltage layer) and LVT (Low threshold voltage layer). How are they fabricated?
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How to select Vt-cells in physical design?
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The main functional block of a microprocessors is the ALU (Arithmetic and Logic Unit) because of its involvement in all computing activities. The important tasks of ALU are arithmetic and logical operations. Speed of the microprocessor mainly depends on ALU’s performance. Most of the processors are included with stand alone design for arithmetic operations. In very large-scale integrated circuits (VLSI), ALUs with various bit-widths are required to perform operations efficiently.
Papers:
S.M. Swamynathan, V. Banumathi “Design and Analysis of FPGA Based 32 Bit ALU Using Reversible Gates,” International Conference on Electrical, Instrumentation and Communication Engineering (ICEICE2017), 2017.
Mohammed F. Tolba, Ahmed H. Madian and Ahmed G. Radwan “FPGA realization of ALU for mobile GPU,” 3rd International Conference on Advances in Computational Tools for Engineering Applications (ACTEA), 978-1-4673-8523-7/16/31.00, IEEE, 2016.
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It depends upon the application for which the digital system is designed.
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This is a question without a single answer, since there are many variables and dependencies here which are impossible to pin down, and will change according to design parameters, technology generation/features, logic/circuit design methodologies and capabilities, and (very importantly) the design of the memory hierarchy, and the workload(s) under consideration. Even the basic metrics (power, and performance) are subject to much discussion: how should one trade off power vs performance to make a "fair" comparison? Nonetheless, it would be interesting to hear folks' opinions and analysis on this topic. To start things off, let's assume that you need to meet a certain ("relatively high") performance level, measured as performance per thread in a multi-core/multi-threaded microprocessor, but you are also subject to a per-thread power constraint (typical of today's high-performance processors). Obviously, the deeper the pipeline, the higher the operating frequency. Or, frequency can be traded off for power, by lowering the operating voltage. However, lowering the design FO4 and deepening the pipeline will impact the power-performance of the design in a variety of ways:
1) Number of flops in the design increases, driving up power, especially power used for clocking. Also, the delay overhead of the flop and any clock uncertainty takes a relatively larger bite out of the cycle time.
2) "Design difficulty" increases since logic has to be divided more finely to achieve the higher cycle time. Also increased timing/device modeling accuracy is called for. Tighter signal slews will be required, and number of repeaters/buffers will increase.
3) CPI will increase, since miss penalties (measured in numbers of cycles) will increase. Also, in light of #2, the design may be pushed towards a simpler microarchitecture.
4) There may be many other costs, depending on the design, ranging from SER impacts, power/current density issues, cache design issues, etc.
I'll start by suggesting that, given where most commercial designs seem to be landing, that 10FO4 is probably well below the ideal cycle time (despite considerable literature which might suggest otherwise). Also, something like 50FO4 is probably too high. Comments anyone?
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I know for sure my designs are not making use of all that the technology can provide. The limitation comes from IP that I use. Let me explain...
One important consideration is that the industry is driven by miniaturisation. For consumer electronics, what companies care about is # of chips per wafer. However, the most miniaturised cells do not necessarily present the best trade-off. It certainly is area optimal, but not necessarily delay optimal. This relates to cell height (in number of tracks) and cell width (presence of dummies, local layout effects, etc). My point is that the industry is not necessarily adjusting for optimal FO4, but it is giving area a higher priority because of business-related reasons.
Aparna, this discussion is way beyond simplistic logical effort or off-chip loads.
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Hi All,
It is well known that Hardware Trojans known so far actually have knowledge of the algorithm and use side channel analysis to leak the keys. To prevent side channel analysis, logic obfuscation techniques are used. I just wanna know that "is there a side channel analysis known in literature which reveals the entire algorithm or IP core or HDL code?"
Thanks in advance.
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There is no way to leak IP or HDL as those are physical or logical representations, they are not data present in the circuit. Imaging/delayering techniques are more adequate for IP theft.
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A monostable circuit can be typically implemented using an EXOR Gate with delayed pulse train as inputs. This way we can generate very sharp pulses at the Leading edge and trailing edge of the leading input pulse. The output can be ANDed with either of the input Square wave to generate only the Leading edge /Trailing Edge pulse as required........
But am envisaging the implementation of ONLY Leading edge pulse without any extra circuitry such as AND gate.
Can anybody suggest!!
Thanks in Advance.
Muralidhar.M
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@ Joerg Fricke
Thanks for the suggestion of using AND gate with delayed inputs than EXOR gate. But the minimal size AND gate using two NMOS devices would not pass a full Power supply voltage(a perfect logic 1). Hence my reset circuit will not function appropriately. I have already two cascaded CMOS inverters(for buffering purpose) hence all the possibilities of Delayed - positive and negative pulses are readily available. But if I use PMOS instead of NMOS with delayed negative going pulses the reset pulse is not narrow at the rising edge of the Input. Looks like a Two device (NMOS+PMOS) EXOR gate does the job, with shortened trailing edge pulse and a narrow Leading edge pulse widt of ~20ps with 45nm MOS devices.
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I want to plot Transfer curve for NMOS Depletion load inverter using Cadence virtuoso tool, for that from where i can get depletion mode NMOS?
i have GPDK 45, 90 and 180nm and using Cadence virtuoso tool .
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Dear Hemant,
which i meant is to add a dot model card for the depletion NMOS and a symbol for it in the device model iiberary. As a proposal you can copy the model parameters of the enhancement nMOS with changing its threshold voltage as i hinted before.
Best wishes
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DFT related projects which can include ATPG,Scan chain technics etc.
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As an application i would propose to investigate the testing of system on chip for soft ware defined radios.
Best wishes
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See above
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Now 7nm SOC (system on chip) has been launched by MediaTek (as M70) in china using FinFET by TSMC ( https://www.mediatek.com/news-events/press-releases/mediatek-announces-worlds-first-complete-56g-pam4-serdes-silicon-proven-on-7nm-for-asic-services). In future plan of Samsung they are also going to make 7nm FinFET by December 2018 - January 2019, 5nm in 2019 and 3nm by 2022 (https://www.anandtech.com/show/12795/samsung-updates-foundry-roadmap-euvbased-7lpp-ready-for-2018-3-nm-incoming)
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as i am searching for research problem in the combination of these two technologies.
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Dear Hari, we have summarized some reported SDR platforms to integrate wireless communication nodes to VLSI programmable circuits. Maybe you may find additional info, ckeck for the references also, on the conference paper from our team:
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i am working on VLSI inetrconnects and need to calculate the the crosstalk overshoot and undershoot for capacitively coupled lines using the output waveform in tanner software.for overshoot there is rising signal on aggressor and static 1 on victim. we get spikes at the output of victim line. this is crosstalk-noise. plz tell how to calculate crosstalk-noise peak and duration.
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Dear Tajinder,
welcome,
Your question is a conceptual one and occurs when you have coupled transmission line. You put a stimuli on one line and see its interference on the nearby intended line. Say you have a stimulation waveform s(t) and the signal coupled to the receiving line is r(t). One normally has to purposely specify s(t) such that in case of digital signal s(t) will be in the form of rectangular pulses of duration equal to the bit time Tb. In case of analog signal s(t) will be purposely sinusoidal wave with specific frequency or frequencies.
The receiving line will react with a signal r(t) in case of digital circuits so long r(t) < the threshold value of the logic value the receiver digital circuit at its output will correctly interpret the logic value say one, otherwise it will coin falsely logic one. Therefore one has to keep interference signal level always within the threshold value of the intended logic.
In case of analog circuits r(t) will be sinusoidal and seen as interference I to the original signal Sor in the receiving line.
In this case it is the Sor/N+I which is the quantity to be evaluated. It is so that the allowed interference is set by the allowed signal to noise plus interference ratio.
Best wishes
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In VLSI design software such as cadence how can we calculate the delay between two different outputs and delay between input and output?
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you have use calculator for it, there is function called delay present in it.
you have to send two signals between which u want to calculate delay to calculator.
so, summary is u have find function delay in the calculator, after that your smartness will get u result.
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I am looking for the microchannel's most important applications between:
- Micro-electronic Thermal Management
- Solar Collectors
- Space Machines Cooling
- Drilling Devices
and etc ...
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Dear Karam Mohammed
your comment is useful, thanks.
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What are the available tools for spintronic device simulation?
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Please check out our website:
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VLSI research:
Shall i use Tanner ? What will be your recommendations.
I need to vary the transistor dimensions.
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A parametric simulation permit To simulate a circuit with different dimensions of transistor. I propose Spectre from Cadence.
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Many work in VLSI area, it is mentioned about iso-area concept. What it meant by?
Thanks in advance
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Dear Sreekala and colleages
welcome,
The section ISO is added to some words with the meaning of equal. Here ISO- AREA means EQUAL AREA. This makes sense since if one compares two vlsi designs, one has to lay them out in the same area for fair performance comparison.
Best wishes
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Need to publish the research work in indexed VLSI journals. May I know the list. Can any one guide me.
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Thank you Dibakar,
These will take time I have gone through them.
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I would like to have some knowledge sharing on power budget estimation at top level.
Basically as a block level pd engineer I have been given a power budget(say 200mW) and allowable drop threshold (say 6%). I have some rough idea on how do they arrive it, but how do they freeze those values early in the design flow for a block at top level? It would be helpful if you can share some knowledge on this.
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Hi Sabarinathan Natarajan,
Although it's an old post, but did you succeed to find something useful. Could you please share your knowledge. Thanks.
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To implement the FIR filter using VLSI techniques, we need to map the difference equation to block level representation which include delay, adder and multiplier as prime blocks, are these block a floating point operation or fixed point operation blocks. how do we optimise these blocks. is there any method to convert a floating point number to a fixed point number.
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Thank You all, I will come back with some work and more preparations with questions on the same soon.
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I'm doing my research in VLSI floor planning. I wanted the source code for VLSI floor planning optimisation in MATLAB. 
Also, if possible the MATLAB code has to process MCNC benchmark circuits
Can any one help me with this ?
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I have no expertise in VLSI. But I can suggest you that you can use Genetic Algorithm (single or multi-objective) for optimization or other popular techniques. But the thing is that you have to formulate your problem the way GA takes the input. Like set required number of nodes in Floor Plan problem as '1' and rest are '0' (suppose you have 'n' number of nodes among which m (m<n) number of nodes are sufficient for your problem). GA would decide optimal value of 'm' ultimately. Take initial population (some possible solutions). Apply crossover and mutation operators. Set your objective function. After few iterations (generations) you would get the optimal number of nodes. Hope this helps.  I'm Matlab Code for GA is easy to access.
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At present how many logic gates are required for half adder and full adder which consists of only AOI ( AND, OR and NOT) gates only? As i know, for full adder is required 6 AND gate,3 OR gate and 4 NOT gate. Any circuit less than 13 AOI logic gates?
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Sorry it is 12 for full adder
For carry c =xy +yz+zx
4 gates , 3A and one O
For sum S   = x'y'z + xy'z' + x'yz' + xyz
3 I, 4A , 1 O = 8
So total 8 + 4 = 12
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our project( comes under vlsi hardware security) aims to detect trojans by measuring current signature of a process corner in different time windows for same set of state transitions..thus if a trojan is present an anomaly would be found.  we need a tool to measure this current signature.
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Consider a Filter design (DSP system block), what are the different methods to implement, test and design the same. Effectiveness of such a block is determined by what all parameters ?
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In terms of area and speed, IIRs tend to be superior - due to requiring lesser stages for comparable filter performance (as compared to FIR filters).
It's quite some time that I saw them, but google should be useful to find discussions about different filter architectures for IIR as well as FIR - addressing filter complexity and structure.
When it comes to area vs. speed, pipelined designs address the speed issue while requiring more area to control the pipelining.
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HI
I just found an bootstrapped sample/hold circuit from a text book. I have simulated the same. I need to calculate SNR, SNDR and ENOB for the same
Input at 5MHz, sampled at 100MHz
How can I do that on cadence?
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Dear Anush,
I would like to add to  the Vladimir answer, that the error due to sampling is considered as a noise and distortion. To be more clear the sample and hold circuit outputs at a sampling time instant  nTs a value y(nTs) while the inpu is x(nTs) . As clear from you waveform the two values are different. They are only approximately equal.
So, the noise and distortion is the difference y(nTs) )=y(nTs) - x(nTs) ,
So building a difference time sequence extending a number of complete cycles of the input wave form can be used to evaluate the noise and distortion simply by by squaring and averaging the difference function along the observation time T=MTs.
That is N+D= sum y(nTs) ^2 over all Msamples /M,
The signal to noise and distortion can be determined by dividing the signal power to the noise and distortion power as defined by the above equation. That is,
SNAD RATIO=  sum x(nTs) ^2 over Msamples/M / N+D,
In order to separate the noise from distortion you need only to transform the output sampled sequence to frequency domain using the discrete fourier transform or the fast Fourier transform. The input tone and its harmonics will be apparent in this domain in addition to the noise floor. One can then determine the mean square value of the fundamental and the mean square value of the harmonies and the  mean square value of the noise floor. One can get also the spurious free difference
which represents the ENOB. However, the effective number of bits has only meaning for a complete A/D converter.
Wish you success
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With referring to the topic below
  • If the test-bed I used is not a proper one to test driving capability of full adders, can the attached test bed provides the sufficient conditions? Or can I use a ripple carry adder test bed instead of that?
  • Last question: Can I use same input pattern for all of the A1, A2...An or B1,B2,...Bn  inputs in RCA test-bed?
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Dear Madam,
This is a gate-level issue. You can expect issues like this in deep-submicron technology. What you see in the diagram, is that the propagation through the ripple chain of each full adder, slows down the slew rate of the signal. This is typical in deep submicron, where only the inverters and to a limited extend, the NAND2 gates are able to keep the slew rate of the propagating signals. All other gates tend to lose slew rate.
This issue should be prevented in logic synthesis. Logic synthesis should be done such that, the minimum slew rate is respected. (this is a logic synthesis constraint.)
Obviously, here it went wrong !. You should not debug this in simulation, but in logic synthesis, and in running timing check tools. So, the question to you obviously is:
(1.) How did you run logic synthesis ?. (If at all, if you did not, please do.)
(2.) What timing check tool did you use ?.
(3.) What minimum slew rate did you specify ?.
Best Regards,
Henri.
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I have been trying to design compressors using MUX instead of XOR's. The method I tried to infer a MUX instead of XOR is using a case statement to sum up two signals. But after synthesizing the design, I found no difference in the later and the former designs (former one being with XOR's). Also, I found that in many research article, their delays differ from mine to a discernible extent. Added to it, Later I found out that some people had different results for different voltages at which the system was ran. How is this possible? What should I further do to reduce the delay of the system?
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Dear Raiyyan,
I gave you an answer in my first comment but it seems that you did not take care of it.
In order to reduce the delay time you have to shorten the number of cascaded logic operations by redesigning the logic circuit. Pipe lining and parallel processing are used to increase the speed of operation. The idea is based on increase the hardware to decrease the processing time.
wish you success
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 can i apply any VLSI Circuits to improve resolution?
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uncompressed images dont use JPEG format it dilute the edges and then segmentation will become difficult you can study my papers on segmentation and can ask your related queries  
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VLSI system design
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Hi Nikita, 
Lets' start with Planar MOSFET. 
Planar MOSFET was very good and we all benefited from it, until we scaled it too much.
SCE and DIBL came in to picture which is dependent many parameters all of which are fixed for a particular technology except the body thickness. Hence we needed to reduce the body thickness, because there is a depletion region formed before the channel is inverted. 
Therefore we scaled the body thickness resulting in partially depleted SOI and eventually fully-depleted SOI.
Then we needed a better gate control which led us to double gate and finally tri-gate by wrapping the width of the planer, also called FinFETs.
This has made us happy because DIBL and SCE reduced. SS (sub-threshold swing) also reduced considerably making the FETs faster and power efficient.
TFETs are different type of devices which works on the separate principle, it is just a gated PIN structure. The main advantage of TFETs is that they have promising SS. Many of the recent research has shown TFETs to have sub-60mv/dec SS. (60mV/dec being the theoretical limit of the SS for planar MOSFETs)
To get more info on these, please refer to:
1) Taur and Ning - Fundamentals of Modern VLSI Devices
2) J.P. Colinge - FinFETs and Other Multigate Transistors
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In My simulation, the Electron current hole current and conduction current is reaching infinity as attached file.
tcad vlsi
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you may want to attach testbench to explain the problem.
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I want to simulate inverter using finfets at 32nm in cadence virtuoso. which finfet model i can use and how? Relating to vlsi, electronics
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I don't think there are any good publicly-available models for 32nm FinFETs. Additionally Intel introduced the FinFET at 22nm node and the rest of the foundries followed at 14nm. Hence, I think it makes sense to use a more advanced technology node for your study. We did create 20nm  through 7nm FinFET models and they can be downloaded at ptm.asu.edu. The models are set up for HSPICE simulations, though they can be modified to work with Cadence Spectre as well.
Recently, we developed a 7nm process design kit called ASAP7, which includes all the technology files (Cadence Virtuoso) as well as transistor models for a 7nm FinFET node. You can download the PDK from http://asap.asu.edu. The restriction being you should be affiliated to an academic institution.
Hope that helps.
Regards,
Saurabh Sinha
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An EMG data series was obtained and I am really eager to find a solution and equation in excel instead of MATLAB.
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Hi,
You might want to try this link, googling your query also provides some relevant links.
Best regards,
Patrick
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How and why CMOS VLSI DESIGN  consumes less power and VLSI DESIGN consumes more power ?Scaling is possible both in cmos vlsi and vlsi than why we go for cmos vlsi ?what is the most importance difference and advantage in cmos vlsi with proper reason. Expalin?If low power why and how?
Is there something that we can do in cmos vlsi that we cant do in simple Vlsi design?Is there any differences in scaling properties of both?
If we tell die area reduction that we can also do in vlsi because scaling is possible.
nmos and pmos together gives low power
but if we put anyone it consumes more power why and how?
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There are two types of power dissipation in CMOS circuits.
One is Static power dissipation (DC power) which occurs when transistors are operating in quiescent mode. This is due to reduction in transistor's channel length, higher doping level (increases dynamic power dissipation too), reduced gate oxide thickness (tunnelling) and reverse biased junction leakage.
In static condition a transistor is either ON or OFF as they are not switching from one state to another. Thus, V or I = 0 in these two states, hence net power dissipated = 0. But, practically there is a leakage current between source and drain even if the transistors are OFF. This current is called sub-threshold current and is significant with process technology scaling. MTCMOSs are used to reduce leakage current. 
Pstatic = VDD*Ileak.
To reduce static power dissipation, reduce VDD and the number of transistors involved.
Dynamic power dissipation occurs when transistors are switching from ON to OFF or vice-versa. The wire used to connect one output to another input acts as load capacitors and requires to be charged and discharged when the transistors are switching. The capacitors dissipate power and with billions of transistors on board operating in GHz, dissipates huge amount of AC power. And higher the switching, more the heat produced. Also, short circuit power dissipation in intermediate states both PMOS and NMOS transistors find paths to ground causes power dissipation due to short circuit current. Another form of dynamic power dissipation is crowbar power.
Pdynamic = CVDD2 f
By reducing parasitic and load capacitance one can reduce power consumption at high frequencies in addition to low VDD.
1. Obviously, basic VLSI design will consume more power as it doesn't use CMOS technology.
2. Scaling is possible both in cmos vlsi and vlsi than why we go for cmos vlsi : https://en.wikipedia.org/wiki/CMOS. Excerpt: "Two important characteristics of CMOS devices are high noise immunity and low static power consumption."
3. What is the most importance difference and advantage in cmos vlsi with proper reason. Explain?If low power why and how?: "Since one transistor of the pair is always off (CMOS), the series combination draws significant power only momentarily during switching between on and off states. Consequently, CMOS devices do not produce as much waste heat as other forms of logic, for example transistor–transistor logic (TTL) or NMOS logic, which normally have some standing current even when not changing state. CMOS also allows a high density of logic functions on a chip. It was primarily for this reason that CMOS became the most used technology to be implemented in VLSI chips. CMOS circuitry dissipates less power than logic families with resistive loads. Since this advantage has increased and grown more important, CMOS processes and variants have come to dominate, thus the vast majority of modern integrated circuit manufacturing is on CMOS processes. As of 2010, CPUs with the best performance per watt each year have been CMOS static logic since 1976. Commercial CMOS products are integrated circuits composed of up to billions of tansistors of both types, on a rectangular piece of silicon of between 10 and 400 mm2.CMOS logic dissipates less power than NMOS logic circuits because CMOS dissipates power only when switching ("dynamic power"). NMOS logic dissipates power whenever the transistor is on, because there is a current path from Vdd to Vss through the load resistor and the n-type network. Static CMOS gates are very power efficient because they dissipate nearly zero power when idle." - source - wikipedia.
4. Is there something that we can do in cmos vlsi that we cant do in simple Vlsi design?Is there any differences in scaling properties of both?: https://en.wikipedia.org/wiki/MOSFET#MOSFET_scaling
5. Nmos and Pmos together gives low power, but if we put anyone it consumes more power why and how?: "The first case is CMOS which has very low static power dissipation and higher dynamic power dissipation but NMOS, TTL logic has high static power dissipation than dynamic power dissipation.  Latching memory addresses can help reduce power consumption."
TO SUMMARIZE, CMOS CIRCUITS CONSUME LESS POWER COMPARED TO NMOS AND TTL LOGIC!
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what are the other differences in CMOS high frequency and low frequency circuits except lumped and distributed?What are the other differences in VLSI and CMOS  VLSI except low power?
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As the colleague Dreher said, the main difference between the high frequency and low frequency is transistor size. As the transistor size shrinks especially the channel length, the transit time which is ultimate limiting factor  of the speed of the tranistor, decreases.
It is so that the CMOS technology has gone tremendous evolution since the realization of the MOS transistors and the invention of the mos integrated circuits. High speed is a requirement to speed up the logical and mathematical operations of the digital circuits and systems.
That is high speed and more high speed is a permanent t target of the digital circuits. Not only speed but also the no of transistors that can be fabricated on the chip measured by the integration density. So higher integration density matches the requirement of higher speed. Unfortunately the consumed power density increases consequently. So, scaling down of the transistor size lead to higher speed and higher integration density but increased power consumption density. The main losses in the CMOS circuits is dynamic losses in charging and discharging the parasitic capacitors of the transistors including the gate to source resistance. As the frequency increases the the rate of charging and discharging increase leading to more power consumption. In fact the power consumption is proportional to the frequency.
The integration density is classified into small scale, medium scale, large scale very large scale ultra large scale,... etc., according to the the number of the transistors on the chip.
To scale down the transistor size, there is  a tremendous development in the int grated circuit technology especially photo-lithography,patterning, and doping and depression technology.
The process of down scaling is still going on.
Best wishes
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I have a code in verilog. How can I convert these to Hspice. Please specify the link from where I can get the corresponding software.
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 Hello, 
I noticed some of the above users were asking for steps on how to run simulation using HSPICE with a verilogA code. Just to help the new users- Below are the steps to do that:
1) Create a .sp file and include the verilogA file as ".HDL file.va". Include the portnames as xi port1 port2 ... modulename. Please note that the modulename is in verilogA file.
2) Include the test circuit in hspice file to test the functionality of the veriloga file. 
3) Make sure your verilogA file is in the same working directory. 
4) Run DC or transient analysis to test the code.
That should successfully compile the code and like Patrick said, a .valog file and a .pvadir directory is created.
Please let me know in case you face any issues!
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i am working on different protocols which i need to design with hdl languages.can someone help in finding the protocols which are used frequently in vlsi industry.i mean which protocols have high demand in industry now a days.
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Hi, this depends on required bandwidth, response time and robustness. For low bandwidth I would suggest the I2C protocol (a few 10 kBit efficient transfer rate) , there are many implementations (FPGA and peripheral components) available. Another solution is CAN (a few 100 kBit efficient transfer rate), also very flexible, widely supported and very reliable.  
Higher bandwidth provides SPI and the SDcard protocoll (a few MBit efficient transfer rate) which is also used for device-to-device communication. 
For high speed interconnect you may also check Ethernet, PCIe and USB. The protocoll is complex, but you can easily use already implemented peripherals ans communication stacks (see Xilinx Zynq for instance), this may be the most efficient solution (short development time, high functionality) in many cases. FPGA vendors provides wizards and example projects which help you to have a fast breakthrough. 
Hope this helps...
Alexander
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I work on CORDIC-based DCT Structures and I want to know the main difference between Unfolded CORDIC and Lookahead CORDIC structures. Is there any difference between these structures?. These structures have been described in the following references.
[1]  M.-W. Lee, J.-H. Yoon, and J. Park, "Reconfigurable CORDICbased low-power DCT architecture based on data priority," VeryLarge Scale Integration (VLSI) Systems, IEEE Transactions on, vol. 22, pp. 1060-1068, 2014.
[2] C.-C. Sun, S.-J. Ruan, B. Heyne, and J. Goetze, "Low-power and high-quality Cordic-based Loeffler DCT for signal processing,"Circuits, Devices & Systems, IET, vol. 1, pp. 453-461, 2007.
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Dear Sir,
- The cordic algorithm is typically used to
  (a.) given (z, alfa) calculate x = z cos(alfa) and y = z sin(alfa)
  (b) given x = z cos(alfa) and y = z sin(alfa), calculate z and alfa
- During the cordic algorithm, there are 3 variables maintained:
  x1, y1, alfa1, and then there are transforms done that leave atan(y/x) + alfa constant, and result is a fixed amplitude growth during the transform. - The transformations done are rotations over a certain angle:
  x1 = x1*cos(angle1) - y1*sin(angle1)
  y1 = y1*cos(angle1) + x1*sin(angle1)
  alfa1 = alfa1 - angle1
- this is then modified into:
  x1 = cos(angle1) * (x1 -y1 *tan(angle1))
  y1 = cos(angle1) * (y1 + x1 * tan(angle1))
  alfa1 = alfa1 - angle1
- There are two forms in which this algorithms is used.
  (a) start with x1 = z, y1 = 0, alfa1 = alfa, and then iterate until alfa1 = zero
  (b) start with x1 = x , y1 = y, alfa1 = 0 and iterate until y1 = zero
- The iterations will use different angles, wherefor tan(angle1) are powers of 2.
   - 1. + or - 90 degree
     2. + or - 45 degree
     3. + or - atan(0.5)
     4. + or - atan(0.25)
- The sign is selected so that either y or alfa go to zero (convergence). The angles are selected such that the multiplication with the tangent is trivial.
- As the +/- sign has no effect on the value of the cos, and the cos only results in a fixed growth of the magnitude of the vector (which is independent of the rotation angle), it is omitted, and the algorithm is simplified to:
x1 = x1 - y1 * tan(angle1)
y1 = y1 + x1 * tan(angle1)
alfa1 = alfa1 - angle1
Now, an 'unfolded cordic' has hardware for every iteration. It has three full adders (one for X, one for Y, one for alfa) for each step of the algorithm. It can execute the algorithm in one clock (when not pipelined.)
A 'folded cordic' maps more steps of the algorithm on the same full adders, and has registers and feedback for this, and also the atan value is selected by a multiplexer as one set of full adders need to represent multiple atan values.
The drawback of the 'unfolded' cordic is the cascade of full adders. If you have eg a 10 iteration cordic, there is a cascade of 10 full adders, and their carry is slow. A 'lookahead' cordic has means to speed up the carry. (I did not find details there.)
Please note, that while the cordic looks nice on paper, the multiple carry paths in the  'unfolded' cordic are a problem. To do the transform x = z cos(alfa) and y = z sin(alfa), you should also consider alternate methods using multipliers. Using multipliers means more logic, but less carry propagation, and this may be faster than the cordic.
Cheers ,
Henri
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apart from modelsim,questasim which others tools can be used which is best suited for verification.
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just chk edaplayground an online tool for simulation and verification
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I have simulated my verilog code and verified it on simulator as well as FPGA.
Now I have sythesized that verilog code into Cadence RC .
I have done the functional verification using NC SIM.
But now how do I simulate the sythesized code for timing verification by attaching the 65nm standard cell library ?
Is there a way to do this in virtuoso or any other tool inside cadence ?
Also I have done RTL to GDSII in Cadence SoC encounter and have a gds file ready . Now is there a way to simulate this gds file in virtuoso ? I am able to import this gds file into virtuoso but is there a way to simulate this gds file ?
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As the result of logic synthesis you can obtain:
  1. netlist built of  standard cell instances from the technology library,
  2. SDF file containing timing data of every cell in the design.
To simulate the design you need:
  1. original test bench files you used to simulate model,
  2. Verilog file that contains models of the standard cell - Verilog description of the technology library
  3. the files created by RTL Compiler.
To simulate the design use the NC  Sim as usual but replace the DUT model with the netlist and add to the project Verilog description of the technology library. In order to utilize the SDF timing data you need to configure back annotation procedure  which is part of elaborator configuration.  
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I found only these: "A Spherical Camera Sensor
A stretchable circuit allows researchers to make simple, high-quality camera sensors." http://www.technologyreview.com/news/410562/a-spherical-camera-sensor/
"The Boston Retinal Implant Project": http://www.bostonretinalimplant.org/
"Stretchable silicon nanoribbon electronics for skin prosthesis" Jaemin Kim et al.
Nature Communications 5, Article number: 5747 doi:10.1038/ncomms6747
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It was many years ago (in 90-ies) when I have heard about the project of company Ball Semiconductor (Allen, Texas) in spherical IC manufacturing. It was declared that they invested about 100 M$ in the development of this technology. They claimed to have got some successful results. See, for example, the article "MEMS applications of Ball Semiconductor Technology" (http://asia.stanford.edu/events/spring01/slides/takedaSlides.pdf).
I do not have information about the current staus of their project.
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Hi all,
I would like to know if someone know the data from a white paper/report/research paper about
-> SoftErrors: Failure in Time (FIT) rate (neutron/meoun/proton etc.) for some Flip-Flops which are based on FinFET and/or FDSOI technologies. As there are few papers available on SRAM FinFET FIT rate. Furthermore, there are few papers on CMOS FIT rate for flip flops are also available.
Thanks.
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Hi,
I don't have direct access to any white papers on flop SEU and FIT rates but I can say that in typical designs, the FIT rate of sequential logic, at least in terms of retention cross-section (without accounting for logic or timing derating - if you want to include this, and assuming a flop has the same fail rate as SRAM, derating will reduced the actual flop error rate to 5-10% of the measured retention value in most logic designs), is about the same as that of the SRAM - in other words if you put and array of flops in a neutron beam/alpha source and an SRAM array with the same number of elements as the flop array, the failure rate will be similar. It is true that flops with higher drive transistors (wider gates) can have a reduction in failure rate but we usually see all flops from a technology library from the weakest to the strongest are about 2x higher than SRAM (in the same technology) to about 15x lower failure rate, In a FIINFET technology I would expect the same trend to be followed since the sensitive element in the SRAM and the flop is the same or similar FinFET transistor.
Sorry if this is to general for you needs, but if you are trying to design experiments, the rule of thumb above has worked for many generations of bulk and SOI devices and I assume will work for FinFET as well.  
One note, I am assuming you are referring to standard flops and not DICE or some other redundant flops which, of course, would have a much, much lower failure rate.  
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In VLSI IC fabrication, a metal such as aluminium is used for the final metalization. Since conductivity of gold is better than aluminium, why gold is not being used ? What is the advantage of aluminium over gold for final metalization layer ?
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The usage of gold is generally avoided in semiconductor technology, since it acts as a deep-level trap and recombination center, i.e. charge carriers of opposite sign do recombine at Au defects in Si and get lost to the current. Gold is also effectively diffusing from a deposited thin film into the underlying substrates even at moderate temperatures. This makes gold rather poisonous to semiconductors. More information can be found in textbooks on semiconductors or on Wikipedia “Carrier recombination”. However, gold layers are often applied to immobilize organic molecules and biomolecules on solid supports via thiol bonds. If semiconductors are used as substrates for bioelectronics applications, for instance, special precautions have to be taken to block the Au diffusion.
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What are the types of VLSI researches that can be done in relation to the Signal Processing Applications ? Can any one please suggest?
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All the Signal Processing systems can be designed using VLSI System Design. One has to simulate the circuit initially using FPGA or ASIC  to be able to operate at the desired frequency  and trasfer the same using VLSI System design
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I want to measure the frequency of ring oscillator circuit I inserted in my design. I made circuit schematic using xilinx ISE. During behavioral simulation, my circuit is switching its output, but I could not see its waveform. Hence I could not measure its delay i.e. frequency.
When I select the mode of simulation as post-route, it shows my design is not yet instantiated (question mark near design), when I try to instantiate, its not doing so. Finally I could not measure ring oscillator frequency.
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The following page might be helpful
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If not, what are the other arithmetic circuits with high speed and low power which are still a research issue?
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Dear Professor,
First, on digital vlsi research, there are not many academic papers. I mean, what is being done in industry is much more advanced than what is described in the papers. In my opinion, this is because it is not common to write papers on small aspects of a digital circuit, it usually is done over a complete functional block, and as such, the adder itself is quite small part of it.
Second, more on depth, let me describe how an adder is designed:
The most important (the only non-trivial) part of the adder design is the carry-chain. Now, the carry-chain works as follows:
1. The carry chain input consists for each bit out of a generate[i] signal, and a propagate[i] signal. If the generate is high, it means that the carry[i] will be high, if the propagate is high, and the generate is low, the carry[i] is equal to the carry[i-1], if both are low, the carry[i] is low.
2. Now, you need to combine these generate and propagate signals, in the fastest possible way to create the carry for each bit. In other words, you need to design the carry-lookahead system.
3. For this, you need library cells that compute generate, and propagate.
eg a carry2-cell, having inputs generate_0, generate_1, propagate_1, and as output generate_01, meaning it combines generate, propagate over 2 stages,
Likewise, you can have carry-3 and carry-4 cells.
4. Then, you need to design a carry architecture that is as fast as possible. Now, this is non-trivial task, as the delay of the cells is dependent on their load, and the load is dependent on the placement. So, in fact, you need synthesis tools like Synopsis and Cadence that do placement-driven adder design. (for ASIC) (Well, you can assume non-load dependent delay, and then you can calculate the adder with a C-program.)
Note that this problem is non-trivial, and quite important. (not for the adders, its more relevant for multipliers), and the standard tools totally fail at this (for the multipliers, at least.) (Synopsis, Cadence), as they incrementally optimize the critical path in a structure, and they totally fail on structures like this, that have many, many critical paths, all (nearly) equal in length. (that's for the multilplier.)
Cheers,
Henri.
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I am working on chemical sensitive transistor using PCDTBT as active layer with NO2 as analyte.
PCDTBT is p type conductive polymer. NO2 is oxidising in nature. So in the presence of test gas, drain current increases at a fixed VDS and VGS.
Larger the VGS, more is the accumulation of charge carriers in the channel. That means the base current of sensor is increasing with increase in VGS.
We are keeping the gas concentration fixed as we want to see the effect of gate voltage.
The charge carriers generated by test gas should be the same for every VGS.
So with increase in gate voltage, response percentage ((Ig-Ia)/Ia) should fall.
Ig =drain current in presence of gas
Ia=drain current in air (no test gas)
What I am getting is not this trend.It is showing some zigzag behaviour at lower voltages.
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Dear Ashwini Kumar,
Check for repeatability of the measurement and reproduction at different rates of change of the gate bias. The Id-Vg curves of organic TFTs usually have peculiar behaviors. Compare to observations in
C. Feng, O. Marinov, M. J. Deen, P. Selvaganapathy, Y. Wu, "Sensitivity of the Threshold Voltage of Organic Thin-Film Transistors to Light and Water", Journal of Applied Physics, 117(18), 185501-1 to -9, 2015;  DOI:http://dx.doi.org/10.1063/1.4919829
Your response formula is valid at condition for reproducible static characteristics without temporal variations. If so, and as Mentioned by Maarten Swanenbrg, you have to find change dVT of threshold voltage induced by the gas, then to find the charge induced by the gas as dVT*Cox, and then to relate this charge sheet concentration to volume concentration of the gas. Note the other detail mentioned by Maarten Swanenbrg, that your formula should give different values at different gate biases.
However, all the above is valid at quasi-equilibrium, both "electrical" and "chemical". Thus, check the repeatability and reproduction of the measurements. There are some guidelines in the reference above to evaluate differential sensitivity when the static equilibrium is not present.
Sincerely,
Dr. O. Marinov 
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My question is related to drawing diagonal wires/links in VLSI layouts. I have found the following reference, which proposes a method of drawing diagonal links that are 45o to both horizontal and vertical axes.
S. L. Teig, “The x architecture: Not your father’s diagonal wiring,” in 2002 International Workshop on System-level Interconnect Prediction (SLIP), Apr. 2002, pp. 33–37.
My question is that is 'X Architecture' being used in drawing VLSI layouts by semiconductor industry? If so, can anyone provide me with the details of those designs, with documents if available? If not, are there any other techniques to draw diagonal wiring, in addition to regular Manhattan wiring?
Thanks in advance...
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As an attempt of finding the answer, I referred to the articles citing the above mentioned article in Google Scholar. The link has been given below. I also list few papers that have given technology dependent information in realizing X Architecture based VLSI design.
  1. Robin C. Sarma ; Michael C. Smayling ; Narain Arora ; Toshiyuki Nagata ; Michael P. Duane ; Santosh Shah ; Harris J. Keston ; Shiany Oemardani; Taking the X Architecture to the 65-nm technology node. Proc. SPIE 5379, Design and Process Integration for Microelectronic Manufacturing II, 47 (May 3, 2004); doi:10.1117/12.536130.
  2. Michael C. Smayling ; Robin C. Sarma ; Toshiyuki Nagata ; Narain Arora ; Michael P. Duane ; Shiany Oemardani ; Santosh Shah; Manufacturability of the X Architecture at the 90-nm technology node. Proc. SPIE 5379, Design and Process Integration for Microelectronic Manufacturing II, 39 (May 3, 2004); doi:10.1117/12.536027.
  3. Robert Dean ; Vinod K. Malhotra ; Nahid King ; Michael Sanie ; Susan S. MacDonald ; James D. Jordan ; Shigeru Hirukawa; Design-to-process integration: optimizing 130-nm X architecture manufacturing. Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, 197 (July 8, 2003); doi:10.1117/12.485258.
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Through control of switching current so that it can store a logic '0' or a logic '1' 
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Executing write operation in MTJ simply sets the MTJ to exhibit either a high resistive (antiparallel or logic '1') or low resistive (parallel or logic '0') state. STT (spin-transfer torque) phenomenon is used to configure MTJ to exhibit different states by passing a spin polarized current through it. However, the value to switching current vary from model to model of MTJ and also depends upon the configuration states of MTJ. 
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I am designing a CS Amplifier in CADENCE Virtuoso with 2 nmos and 2pmos.The lower nmos is used for amplification and the upper nmos for casoding.The upper 2 pmos are used for current source and cascoding to improve output resiatance . But how do I bias the upper 3 trasistors in an IC  ? In current mirror i need to give a reference current source .How do we make a reference current source in an IC ?
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Hi O-P.,
Several years ago, I also questioned myself about the same like you now. So I can summary the answer below:
(*) In the IC design using MOSFET, when bias the MOS device (NMOS and PMOS), we usually use the current mirror. And the question here is: in the current mirror, we need the "ideal current source". So how can we have this "ideal current source"? In fact, we have 2 basic techniques generate this "ideal current source" . Before entering the explain in detail,  you should remember about the characteristic of a "ideal current source" (also named as: "reference current"): that is the independence of the output current with both of TEMPERATURE and SUPPLY VOLTAGE.
1. With the variation of supply voltage, we have a very well-known technique: SELF-BIAS current source (please see the book of Razavi: Analog CMOS Integrated Circuit - Chapter 5). This technique can be used to bias the other MOS devices basing on the fundamentals of current mirror. Remember that this technique generate a voltage reference (current reference) with a nice characteristic (quite insensitive with the supply variation), but owns a large dependence as temperature changes. However, if we use this technique in several applications such as design the OPAMPs, ... it is still OK.
2. The second technique is Bandgap Reference, this techniques generate a voltage reference whose characteristics are very good with supply voltage variation and temperature variation. However, the circuit is a little more complex as compare to the SELF-BIAS technique that I mentioned above. The bandgap reference circuit usually be used in the critical applications which requires a high quality of reference circuit such as: Converters, LDO,...
I hope my answer makes you understand a bit about the bias techniques.
BRs,
Nguyen Ha