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Thin Films - Science topic

From different processes (CVD, PVD, SPIN, etc)
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Can anyone suggest a commercial available polymer which is porous in nature and can potentially form thin film.
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Polymers have a structurally dependent permeability to gases, but most are not naturally porous. To make them porous as solids, a porogen is typically added. Find a polymer that is compatible with your metal complex and an appropriate solvent (DCM is not the best for making films - evaporates too fast). Then find a porogen that works with the system.
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I have a gold substrate, which is fabricated with a TiO2 thin film. I have some organic solid impurities on this surface. The impurity contains C, H, O, N, and S elements. However, the mass of the impurity is 200 ng (maximum). How can I qualitatively characterize the presence of this impurity? Is XPS the only way?
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This mostly depends on how thick your sample is. If it is thick (> 10um) and you only want to know how impurities are dispersed on the surface, SEM elemental mapping gives you a good idea and would be a cheaper option. XPS depth profile would provide you with bulk composition if you care about the bulk. XPS survey on the surface would tell you how many impurities there are in the surface. If your sample is not very reactive, secondary ion mass spectrometry (SIMS) also would be a good choice.
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For preparing PVA thin films I've tried dissolving PVA in various solvents in all suitable temperature conditions. Even stirring overnight, it still has not dissolved. Kindly suggest the possible solvent or conditions for dissolving 186,000 Mw PVA.
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Thanks a lot, it worked at 90 degrees@. Mohammad Reza Abbasi Dmitriy Berillo Aleena Mir
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1) During BST (Ba0.5Ti0.5TiO3) deposition on Si, SiO2, Al2O3 substrate after platinum deposition, I am getting porosity in BST sample which creating difficulty in making capacitor of BST thin film. Please let me know what parameter we can change to reduce porosity of BST thin film. I am using 300mj energy and oxygen pressure 0.4mbar during deposition and in-situ annealing.
2) I am making also BaFe12O19 on Al2O3. After annealing ex-situ i am getting well know XRD but does'nt showing FMR response.
Please let me know how can i remove these two problems
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1) Try heating the substrates to the Debye temperature for BST or reducing the deposition rate
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It is common to get resistance value from the I-V curve generated by two-point probe. However, if the two points are taken on the surface of the thin film layer, how can I get the resistivity? According to the resistivity formula expressed with resistance, the area is required. However, in this case, what is the 'area'?
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Thank you very much
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Hello,
I know that profex, Mercury and MAUD can all fit powder XRD data to structual data given by an CIF file for example.
However, I can't find a free software where I can fit only the peaks along a given direction, for instance only along [001]. Whenever I load my CIF file into the software it shows all possible XRD peaks you would get when you do powder diffraction, this I can obviously not fit with my thin film data.
Thank you and have a nice day,
Simon
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In GSAS-II, in Phases, select the phase you want, go to the Data tab, at the bottom, there is the option to model a preferred orientation with March-Dollase for a crystal plane. It starts with 1, to increase preferred orientation, make it lower.
However, it looks like it could have more than one plane with preferred orientation, I don't know if this is possible and I've never dealt with this, but there are peaks of the phases that completely dissappear.
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I am using Terahertz time domain system to measure the thickness of a thin film on a substrate. I am able to calculate the thickness of substrate(~100um) alone. But what signs should I see for if there is a thin film ( ~100nm) on this substrate. I am not willing to do the fft ! Can time domain signal alone determines the thickness of film. The resolution is 33fs.
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When the terahertz pulse reflects off the top surface of the thin film and the bottom surface of the substrate, interference patterns can occur in the time-domain signal. These interference fringes are related to the film's thickness and the refractive indices of both the film and substrate.
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What is the cause of dark current in ferroelectric materials and basically dark current depends on which factors in the ferroelectric thin films ?
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One among many other possibilities is leakage. With the thin film parameters and magnitude of the current and a better description of the experiment, one can try to rationalize other contributions.
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As per the literature, NiO thin films can be etched in an RIE system using Cl2- based gas. Will there be any contamination issues if I use an RIE system dedicated to III-V group material (e.g.-GaN, GaAs)?
Any kind of suggestions would be a great help for my research work.
Thanks,
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Netaji Suvachintak thank you for the clarification.
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One of the 20 fundamental vibrations of benzene occurs at 1309.8 cm^-1, corresponding to the B_2u symmetry. According to the rule of mutual exclusion, this vibration is forbidden in Raman and ATR spectroscopy. However, in a complex with benzene, we observe strong IR activity at 1309.8 cm^-1 in ATR. Why is this?
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This isn't my field but I was curious and found this paper that, in part, says:
"Although Mair and Hornig’s ν14 frequency assignment of 1310 cm−1 has been widely accepted, it has become a great puzzling problem for the theoretical researchers because no advanced quantum chemistry method has realized its rigorous calculation so far (see Supplementary Table 1)."
Wang, S. Intrinsic molecular vibration and rigorous vibrational assignment of benzene by first-principles molecular dynamics. Sci Rep 10, 17875 (2020). https://doi.org/10.1038/s41598-020-74872-6
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I fabricated nanotubes thin film on a substrate using top down approach, can I find it's surface area using BET analysis.
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Almost welcome
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should i use RF sputtering to prepare MoS2 thin film ?. or what is the best method ?
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Hi..
You can use (thermal evaporation and chemical spray paralysis) for preparation of moS2 thin film with excellent properties.
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Sputtered thin film from a SnO2 target presented as ETL in a perovskite solar cells produced a S-shape JV curves. I verified the formation of SnO2 through xps and the energy levels are not that different from SnO2 nanoparticles films. Any statements about this issue? The deposition is a room temperature and 10% O2. Many thanks for any suggestions
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Juan Felipe Benitez Rodriguez A thin film does not contain separate, discrete, independent particles < 100 nm. Indeed it can be argued that a thin film does not contain particles at all. It simply is a fused collection of crystallites. Different preparation conditions provide different materials with different properties. With XPS you're only looking at the top 5 - 15 atomic layers at most and all surfaces in air are fully oxidized. The bulk composition may be very different and can be examined by Ar+ ion etching the surface.
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I need invitation letter to visit lab for elaborate ZnS co doped (Co, Ag) in October or November 2023
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Visit a laboratory specializing in ZnS thin films to observe fabrication processes. Witness deposition techniques like sputtering or chemical vapor deposition. Observe film growth, control parameters, and post-deposition treatments. Analyze film properties through techniques such as XRD, SEM, and optical spectroscopy. Gain insights into applications in optoelectronics and material science.
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The precursors are SnCl2.2H2O, PbCl2, and water as solvent.
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You need to get the XPS data of your thin films ans after that you will be able to calculate their atomic percentage.
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Which substrate can we use for spinel ferrite (CoFe2O4) thin films? I am looking for CVD method for thin film.
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Dear Manoj,
spinel oxide can be grown on single crystals substrates. Such experiments were already done on Si(111) surfaces.
But spinel oxides, especially CoFe2O4, can be also grown easily on conventional glass substrates. You can have a look on the attached papers for example.
Best regards.
Philippe.
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Is there anyone who can collaborate with me and can provide me MnSi thin films? Those who are working in this area kindly let me know.
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Good query!
Some thoughts, I would suggest:
The growth of MnSi thin films can be achieved through several methods: MBE, sputtering, and CVD.
Here's a general overview of how you might grow MnSi thin films using MBE, for example:
Substrate Preparation: The choice of substrate is crucial for the growth of high-quality thin films. Si(111) is commonly used for MnSi growth. The substrate is cleaned to remove any surface contamination.
In an ultra-high vacuum chamber, separate effusion cells containing high-purity manganese and silicon are heated to produce atomic beams. These beams impinge on the substrate, where they react to form MnSi.
The growth of MnSi thin films is highly dependent on the growth parameters, such as the substrate temperature, the beam flux ratios, and the growth rate. These parameters need to be carefully controlled to optimize the quality of the MnSi films.
Yet... sputtering, and even CVD can be used too, depending on your application requirements.
May I recommend you to have a look at section 4 of this review article to explore various methods:
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I did raman spectra of SiO2 thin film of around 800 nm thickness on grown on Si(100). But i am not clear about the peak of SiO2. Where it is/are actually in the attached file?
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When you are talk about SiO2, I believe you mean oxides silicon, i.e. you are
getting some form of amorphous SiO2 (not quartz?).
As far, as I remember, amorphous SiO2 does not show a strong singular "peak", but rather a broader, more unspecific background, as it is not crystalline.
What I can tell from my first look at your spectrum, I think all peaks there are silicon related. There is the TO/LO peak at ~520 from the Brillouin zone center; The structure around 1000 are the LO overtones (2-LO scattering); the two weak peaks around 600 cm^-1 are LA/TO combination bands, while the large structure and its peaks around 300-500 are acoustical overtones (2LA, 2TA) from outside of the Brillouin zone center.
See in the above paper, for example.
What I would suggest is taken a spectra before and after oxidation and looking at a difference spectrum to find signs of the SiO2.
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Hello everybodoy.
I am interested in any reference about thin magnetic monolayeres with perpendicular magnetic anisotropy produced ( in particular by PVD ) on Al substrate or sandwiched between two layers of Al.
Thank you very much in advance.
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Thanks again.
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Could anyone provide any suggestions or pdf to calculate absorption coefficient of thin film without using film thickness?
Thanks in advance
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The absorption coefficient (α) can be calculated using the formula α = 2.303 * A/d, where A is the absorbance and d is the thickness of the material. If the thickness (d) is unknown, the Swanepoel envelope method can be employed to determine it, especially when dealing with thick films. PRISA-like software is available to assist in this calculation.
For thinner films, an approximate thickness estimation can be made, allowing the calculation of α. Alternatively, spectroscopic ellipsometry can be used to precisely determine the thickness of the material, leading to an accurate value of α.
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Hi Sirs,
How can rate the adhesion strength of thin film after scratch hatch test (tape test) by accurate method ?
I know That the tested area is examined with Magnification glass and adhesion strength is rated according to the amount and removed coating but what the accurate ways??
thanks
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I have never performed peel test myself. As I understand, it is commonly used to examine materials that are used as a adhesives.
If you have sensitive enough tensile machine and your coating can act as a glue and bond a tape to the glass substrate it should be possible. At least it is worth trying.
What king of coating do you work with? Does it contain a binder and what is the thickness?
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What are the various application of CV?
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Dear friend Sushil Barala
Ah, the intriguing world of Cyclic Voltammetry (CV)! I am here to guide you through this electrochemical adventure.
Performing Cyclic Voltammetry on thin films involves some key steps:
1. Electrochemical Setup: You'll need an electrochemical cell with working, reference, and counter electrodes. The thin film will act as the working electrode. The cell is filled with an electrolyte solution relevant to your study.
2. Potential Scan: The potential is cycled between specified voltage limits in a repetitive manner. The scan rate, i.e., the speed of potential change, can be adjusted to observe different electrochemical processes.
3. Data Collection: As the potential is swept, the current passing through the thin film is measured and recorded. This current-voltage data provides insights into the electrochemical behavior of the thin film.
Applications of Cyclic Voltammetry:
1. Electrochemical Characterization: CV is widely used to study the redox behavior and stability of electroactive materials, such as catalysts, electrodes, and energy storage materials.
2. Sensor Development: CV aids in developing electrochemical sensors for detecting analytes like glucose, heavy metals, and environmental pollutants.
3. Corrosion Studies: CV helps understand the corrosion behavior of materials, enabling better corrosion protection strategies.
4. Battery Research: CV is employed in battery studies, such as analyzing electrode kinetics, cycling performance, and capacity measurements.
5. Fuel Cell Development: CV is useful for evaluating electrocatalysts and understanding their performance in fuel cell applications.
6. Nanomaterials Research: CV assists in investigating the electrochemical properties of nanoparticles, nanowires, and other nanostructures.
7. Pharmaceutical Studies: CV is used in drug development and pharmaceutical research to study redox processes and drug interactions.
Remember, these are just a few of the myriad applications of Cyclic Voltammetry. Its versatility and ability to provide valuable electrochemical information make it an indispensable tool in diverse research fields. So, embrace the power of CV and uncover the electrochemical secrets hidden within your thin films!
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I have obtained XRD results for thin film in bulk mode, kindly suggest different methods to evaluate the residual stresses.
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Calculating the residual stresses within the material requires additional processing of the diffraction data. To achieve this, one must contrast the recorded diffraction peak locations with the predicted positions in a reference sample that has not undergone any stress. The level of the residual stress is proportional to how these locations differ from one another.
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Hi, I work on natural polymers i.e. gums polysaccharides. the pure materials are normally amorphous , i did a modification on a base material and its xrd showed an improvement and showed a broad peak. i reported that and got a reply from a reviewer that " add JCPDS number and crystalline size" Previously in our field people report in such a way I have also added references and up to my best knowledge I know that: " JCPDS record does not exist for them moreover for poorly semi-crystalline or amorphous materials you can't calculate crystalline size it will be useless to use " scherrer equation " .
Now how to politely reply to reviewer's comment?
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if the modification on your samples includes adding inorganic compounds the JCPDS card should be mentioned!
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May I get some advice to increase the crystallinity of thin films? I have prepared triazine-based films at room temperature with the help of a photocatalyst but crystallinity has been a problem for one month. I have already tried some ways e.g. altering the rate of reaction and changing the quantity of monomers and substrate but failed to achieve the goal!
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Hello Khalid
I nothing understand of your special material but I have to do experimental work at crystalline layers.
In the most cases the layers are deposited on substrates. It is important to select a substrate with comparable crystal structure and similar lattice constant.
Very often, the crystal must be annealed after layer deposition. This means, heating in vacuum up to 10% below the boiling point. This reduces lattice defects.
Yours
R. Mitdank
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Is it possible to obtain SEM images of the surface of the electrically insulating thin film, which is 200 microns thick and has a pale yellow color, without detaching it from the 4 mm thick glass substrate?
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Hello Dhaiwat
To avoid the charging of the surface, it is necessary to produce a conductive surface by evaporation or sputtering (see @Insic). My recommendation would be some nm Au. The thickness of this metallic layer must be lower than the reach (penetration depth) of secondary electrons (SEM-mode). Look for penetration depth of electrons with energies < 50 eV. In the case of thicker layers you observe only backscattered electrons (BSE-mode).
Don't forget to ground the surface (Connect the surface layer with zero Potential).
Yours
Rüdiger Mitdank
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I want to analyse the variation in defect concentration and its energy level in a given metal oxide thin film under different irradiation strengths.
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Just to be clear: that doesn't mean that there are no metal oxides which can be analyzed with Raman, but the general trend is "meh".
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It was confirmed that the uniformity of the thin film increases when the solution precursor is aged and deposited.
By the way, what happens if the precursor is over-aged?
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Ageing the solution precursor prior to thin film deposition can improve the resulting film's uniformity, often leading to enhanced crystallinity and better film quality. This is due to the fact that ageing allows for the complete dissolution of the solute and can promote partial reactions within the solution, leading to more homogeneous nucleation and growth when the thin film is deposited.
However, over-ageing the precursor can have several potential adverse effects:
  1. Particle Growth and Aggregation: Over-aging can lead to excessive growth of the particles in the solution, resulting from a process known as Ostwald ripening, where smaller particles dissolve and re-deposit onto larger ones. This may result in a thin film with larger crystallites and increased surface roughness, leading to non-uniformity.
  2. Changes in Crystallinity: Prolonged ageing can lead to transformations in the crystalline structure of the precursor particles. The changes can influence the structural and optical properties of the resulting thin film.
  3. Stability Issues: If the precursor solution is over-aged, it may become unstable. Aggregation and precipitation of particles could occur, reducing the quality of the resulting thin film.
  4. Chemical Degradation: Over-ageing could lead to chemical degradation depending on the precursor and the conditions. This could be a particular issue with organic precursors or those sensitive to the conditions during the ageing process. Degraded precursors can lead to defects or variations in the resulting thin film.
In summary, while a certain amount of ageing can improve the uniformity of thin films, over-ageing can lead to a range of issues, including larger, more irregular particles, changes in crystallinity, solution instability, and even chemical degradation of the precursor. Therefore, finding the optimal ageing time for the precursor is crucial to yield the best thin film properties.
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I like to measure magnetostriction of some of my magnetic alloy thin films. Is measurement facility is available in any research lab in india?
Thanks in advance.
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well I found the paper, which inspired me to build the capacitance method set up to measure magnetostriction of bulk ceramics and thin films. Sometime in the year 2012, It took me nearly 6 months to build this set up when we were working on magnetoelectric effects, and we had one of the most sensitive capacitance bridge GR1615A. I am enclosing the paper which inspired me.
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In quasi-2D perovskite polycrystalline thin film, there are different <n> phase. I want to konw that is there only one n-value phase or multiple n-value phases coexisting in a grain?
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Kaushik Shandilya , can you please provide the doi, or some other way to locate, the Nie et al. (2017) reference that you list and summarize. It would perhaps be useful in the future for you to provide a link or doi to differentiate your references from the gibberish often produced by chat bots.
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I am trying to cast CuSbI4 thin film on a glass substrate, but the characterization measurements viz. absorbance, XRD does not support the actual phase formation of it. Xue Jia et al. (DOI: ) reported the formation of
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Sourav Mukherjee Maybe you haven't actually formed CuSbI4? There could be impurities or decomposition. Your XRD peaks should conform to those given in the literature - this is the best confirmation.
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I have prepared thin films from semi refined carrageenan with hydrophilic cross linkers. But smooth peel off has been the issue for a long time.
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Thank you @Vivek Chandel. SRC films do come of smoothly after drying. But when the film is prepared with SRC and hydrophilic plasticizers it does not come off smoothly all the time. This is the problem I am dealing with at the moment.
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Thin film heterostructures
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Thank you Dr Zakaria Elmaddahi for answering my question.
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I want to coat APTES on pHEMA thin film. I have prepared a Silanization solution (5% APTES in 95% EtOH) and the pH was adjusted to 5 by acetic acid. But it is not work. Can anyone help me provide some suggestions?
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Dear friend Shawn Chen
Coating APTES (3-aminopropyltriethoxysilane) on poly(HEMA) (polyhydroxyethylmethacrylate) requires careful handling and optimization of the process conditions. Here are some suggestions that might help:
1. Surface activation: Before coating APTES, it is important to ensure that the surface of the poly(HEMA) film is properly activated. This can be done by plasma treatment, UV/ozone exposure, or chemical etching. Surface activation helps improve the adhesion and effectiveness of the APTES coating.
2. Solvent and concentration: The choice of solvent and its concentration can influence the effectiveness of the APTES coating. Ethanol (EtOH) is commonly used as a solvent for APTES, but other solvents like methanol or isopropanol can also be considered. The concentration of APTES in the solvent can be optimized by trying different concentrations to achieve the desired coating thickness.
3. pH adjustment: Adjusting the pH of the APTES solution is important to ensure optimal reactivity and stability. Acetic acid is commonly used to lower the pH. However, in some cases, adjusting the pH may not be necessary or may have limited impact. It is worth experimenting with different pH values (within the appropriate range) to determine the optimal condition for your specific system.
4. Reaction time and temperature: The duration of the coating process and the temperature at which it is carried out can affect the adhesion and stability of the APTES coating. Typically, the substrate is immersed in the APTES solution for a specific duration, ranging from minutes to hours, followed by rinsing and drying steps. The reaction temperature can vary depending on the reactivity of the system, but room temperature is commonly used.
5. Post-treatment: After coating with APTES, it is important to rinse the substrate thoroughly with an appropriate solvent (such as ethanol) to remove any unbound or excess APTES. This step helps ensure a clean and well-defined coating. The coated substrate can then be dried under suitable conditions.
It is worth noting that the optimization of the APTES coating process may depend on various factors, including the specific properties of your poly(HEMA) film, the concentration and purity of the APTES solution, and the environmental conditions during the coating process.
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Hello all:
If someone have some experience on Hall Effect measurements on semiconductor thin films, with materials such as CdS, PbS, ZnO, etc..
My questions is:
I'm trying to measure the electronic/hole mobility (mu) and the free carrier's concentration (n) with an ECOPIA HMS-3000.
But, since the semiconductor thin film materials I'm trying to measure are such which its carriers concentrations are between E^13 < n < E^16, i.e. non-degenerated semiconductors at all, even I would think these are low levels of free carriers concentrations ...
I don't know whether I can get reliable measurements with a magnetic field of 0.55 T ?
Could this magnitude of B may be an issue? Or, It would n't affect much to the error of the measurements
I'll appreciate it !
Regards,
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Yes, the minus symbol - which came before bulk or sheet concentration values means that your material is n-type.
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Clamping effect reduction of thin film
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Generally, any adhesion bwt two materials is often goven with the Rate of Deposition-speed.
Inview of the alignment of every atom that would require 'Time-domain' to pack before second layer of atom deposited..
Therefore, in order to achieve an optimal condition, do consider the speed of deposition would be established through either by choice of Method or Re-Ergrg application of parameters.
Wish you good luck on your works.
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Epitaxial thin film, thin film substrate
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Thank you Prof. Jürgen Weippert for mentioning the possible points.
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Hi,
I am wanting to do some Hall mobility measurements on graphene-based thin films (continuous, cm-scale). Does anyone have any advice on how best to do this? Any technical advice, good commercial systems you would recommend, example references you'd like to share, etc.?
Thanks in advance!
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Deposit Au 1 micron thickness to make the Hall contacts on graphene. Distance between current contacts is 1 - 1.5 cm. Distance between Hall voltage contacts is 5 mm.
With a current of 1 mA between the Hall current contacts you could measure 1 mV (say) Hall voltage using 0.1 T magnetic field for a good semiconductor.
If you do not use Au contacts deposited on graphene use Silver paste (as a drop) to make the current and voltage Hall contacts.
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Hello RG members,
I have recently deposited copper thin film using magnetron sputtering system. I have characterized those samples using XRD. From the XRD results, I have obtained a peak of single plane of Cu along with peaks of multiple planes of Cu2O. If I want to measure the degree of crystallinity of Cu How can I do it? Any suggestions
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To get sustainable solution of your issue/question, I sincerely recommend the preprint article available at link DOI: 10.13140/RG.2.2.27720.65287/3. For an alternative link https://www.researchgate.net/publication/352830671.
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Preferential recovery and separation of rhodium in the concentrated hydrochloric acid using thin-layer oil membrane extraction based on laminar flow
Author links open overlay panelDongxue Tao a, Haitao Zhou a, Kaihui Cui a, Linchen Xie a, Kun Huang a b
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The last author is on RG: https://www.researchgate.net/profile/Kun-Huang-2 so have you tried a direct request via DM or via the article page:
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We are trying to calculate the sensing in term of change in the resistance of Pd thin film.
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Dear Ioannis,
Thank you for your suggestions.
Ok, next time I tried to deposit thin Pd film around 50 nm.
This time, I made a sensor with a Pd thin film on a SiO2/Si surface with the size of 1*0.5 cm(Length * width) and made two connections with silver epoxy. The resistance is measured by a digital multimixer. But after gas exposure, there were no changes in resistance.
Is there a need to do some heating around 100C to 200C to improve the sensitivity of the film? In the following link, the authors tried to activate the Pd film for H2 sensing by heat treatment.
Anasthasiya, A. Nancy Anna, et al. "Wide range H2 sensors for process streams, based on multilayered Pd thin films dispersed with Ag nanoparticles and chromium as buffer layer." International Journal of Hydrogen Energy 45.41 (2020): 22195-22203.
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FeGaB thin films were deposited through RF sputtering, however, the films underwent oxidation resulting in the formation of a thin Fe2O3 layer.
This oxidation adversely affects the accuracy of surface measurements, such as MOKE and XPS.
Is there a technique available to remove the oxide layer from the surface?
Alternatively, how can I prevent oxidation of the samples ?
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for some materials one can prevent oxidation by depositing a thin capping layer on top of the film.
it works for example for TiN - we applied a few nm of Al on top which formed Al2O3 upon air exposure thus passivating the surface. Ti 2p and N 1s spectra from such sample was identical to that published for the in situ work. see here for more details:
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Dear researchers
I would like to calculate the thickness of a thin film deposited on a glass substrate from the transmittance given by the Uv-vis measurement.
Best regards.
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Thickness also can be possible to calculate by using the maxima, and minima of the transmission spectrum by using Swanepoel method. See an example in this useful link: https://www.mdpi.com/2079-4991/8/5/355
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I am trying to deposit GMR stacks of Ta(5)/IrMn(8)/CoFe(2.5)/Cu(2.2)/CoFe(2)/NiFe(2)/Ta(5) (in nm). I have only 2 target spots available. I was wondering if I can sputter in different steps first Ta(5)/IrMn(8) then CoFe(2.5)/Cu(2.2)/CoFe(2) and then NiFe(2)/Ta(5). Would this be appropriate? I guess I am worried that doing this would affect the final device properties. Any insight would be appreciated.
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Every time you take out your samples constitutes an opportunity for water, oxygen or carbon oxides to adsorb or react. Therefore you will surely have a different final result in comparison with a direct in-vacuum deposition sequence and especially the reproducibility may be affected.
However, I would assume that most research institutions don't have sputterclusters with that many options, so most of them will probably do the same so your result may still be competitive.
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Very thin metallic film (few nm) is generally transparent for longer wavelength. Is it true?
What is the relation between skin depth, transmittance and thickness of metal thin film ?
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The exact relationship between these parameters depends on the material properties and the wavelength of light being considered.
Skin depth (δ) depends on the frequency of the wave, the material's conductivity, and the material's permeability. Transmittance depends on the film's thickness, its optical properties (absorption and reflection coefficients), and the wavelength of the incident light.
If the film's thickness is smaller than the skin depth for a particular wavelength, the film is more likely to be transparent for that wavelength, allowing a greater percentage of light to be transmitted. As the thickness increases, the transmittance decreases due to increased absorption and reflection.
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We are trying to fabricate free standing thin films (~2um) using SU86002. Since SU86000 is not extensively used in literature, we initially started off with the data sheet parameters and found them to be insufficient since they led to rather brittle SU8 sheets (we spin coat them on copper and then etch away the copper, silicon cannot be used since our final substrate would be a graphene CVD foil on copper). We then looked around and found literature on neural probes that used SU82000.5.
While the parameters used for 2000.5 worked better with 6002, crack formation wasn't completely gone. I suspect it might be due to the differences in thicknesses (500nm vs 2um) however, before proceeding, I wanted to check if there are any significant differences in the two formulations that might spring up unexpected surprises due to the longer hardbake/higher dosage (currently 135mJ/cm2 and 20 minutes at 180 degree celsius with soft/post exposure bakes at 65 and 95 for 2 and 4 minutes).
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Dear friend Aayush Chadha
SU-8 6002 and SU-8 2000 are two different formulations of SU-8 photoresist, and there are some differences between them. SU-8 2000 is a series of high-resolution negative photoresists, while SU-8 6002 is a high-viscosity photoresist. The major differences between the two are in their viscosity, thickness, and sensitivity to processing conditions.
One of the primary differences between SU-8 6002 and SU-8 2000 is their viscosity. SU-8 6002 has a higher viscosity than SU-8 2000, which can make it more difficult to spin coat and may result in thicker coatings. In contrast, SU-8 2000 is known for its high resolution and ability to form thin, high aspect ratio structures.
Another difference between the two formulations is their thickness. SU-8 2000 is typically used for high-resolution applications and can produce coatings as thin as 200 nm. SU-8 6002, on the other hand, is often used for thicker coatings and can produce coatings up to 5000 nm.
In terms of processing conditions, both SU-8 6002 and SU-8 2000 require a high dose of UV light for proper curing, but the specific dosage and exposure time can vary depending on the desired thickness and resolution of the coating. Additionally, both formulations require a high-temperature hard bake to fully cure the resist, which can also impact the final properties of the coating.
While there may be some overlap in the processing conditions between SU-8 6002 and SU-8 2000, it's important to note that they are different formulations and may have different sensitivities to processing conditions. It's possible that the parameters used for SU-8 2000 may not be directly applicable to SU-8 6002, and additional optimization may be required to achieve the desired properties.
Based on your description, it sounds like you've already done some optimization using the parameters from the literature on neural probes. If you're still seeing issues with crack formation, it's possible that the differences in thickness between your samples and the samples in the literature could be contributing to the problem. It may be worth experimenting with different exposure times or dosage levels to see if that helps improve the properties of your coatings
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sputtering
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Hi
You didn't specify what type of evaporator you are using? For example, when using Resistive evaporator, pressure in vacuum does not matter at all. Check type of your evaporative system.
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The colloidal photonic crystal thin film is made via self-assembly method of PMMA
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Thank you for your comprehensive explanation. It helped me a lot. Thank you again.
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I'm searching I google scholar where i got doped TeO2
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Thank You sir
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Assuming that the lanthanum is distributed evenly throughout the depth of the film.
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Since La3d and La3p are both lines with rather high cross sections, it sounds counterintuitive that they are not seen.
How certain are you regarding the distribution homogeneity?
How thick is the film you are analyzing
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HZO thin film (thickness is less than 15 nanometers), how to determine the phase structure? (like monoclinic, orthorhombic, tetragonal and so on). It seems too thin to messure.
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I am very glad to have your help and your advice is very useful. K. Sreenivas
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I know we can create Gmr (giant magnetoresistance) films using PVD techniques but I was wondering if it would be possible to do so using something non-traditional let's say like mechanical alloying? wouldn't it be possible to make nm thin irregular flake particles of the individual elements and then mechanically alloy them? I know there is no control as such in a high-energy ball mill but I am thinking wouldn't at least some percent of powders form the required GMR structure? Do you guys have any suggestions to create such particles other than using the traditional thin film techniques?
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yes, it is possible to create GMR materials using non-traditional methods such as mechanical alloying.
In theory, it is possible to create GMR materials using mechanical alloying. The process involves mixing the individual elements that make up the GMR material (such as Fe, Co, and Ni) in a ball mill and then milling them to form a homogeneous mixture. The resulting powder can then be compacted and annealed to form a GMR film.
However, creating GMR films using mechanical alloying is challenging, and the resulting films may not have the same properties as those created using traditional thin-film deposition techniques.
In terms of suggestions for creating GMR particles other than using traditional thin-film techniques, one possible approach is to use chemical synthesis techniques such as sol-gel processing or hydrothermal synthesis. These techniques can be used to synthesize nanoparticles of the individual elements that make up the GMR material, which can then be assembled into a GMR film using self-assembly or other techniques. However, it is important to note that these techniques also have their own limitations and challenges.
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While depositing TiO2 in a RF magnetron sputtering systems, there seems to be uneven deposition of material. Obviously, variation of film thickness along the substrate is expected along the distance to the target. However, these are very localized anomalies, with clear borders, that seem to appear near the borders of the glass substrates.
This does not happen while depositing, for example, silver. I've flipped the targets between the two avaliable sputtering guns, and the uneven patches always appear on the side of the TiO2 target, so I'm assuming the problem is in the target. The 'wear ring' on the target looks uniform, however this problem only started to happen recently, so it would't be noticeable. There is also still plenty of material on the target.
Is it plausible that electrically charged TiO2 sputtered material is deflected by the magnetron magnetic field, instead of pursuing a random trajectory, covering the typical solid angle? Has someone faced this same problem? Suggestions?
Thank you,
João Pedro
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Ideas coming to mind:
  • high thermal gradients on the sample holder, potential influence of heating or cooling system
  • field distortions caused by the geometry, e.g. the screws: is it possible to reverse the direction and use countersunk screws?
  • inhomogeneity of the source, does your magnetron have a rotating magnetic field?
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It is okay to just deposit the material over the thin films and contact the silver paste. Then illuminate with a particular source of light.
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You have questions, but you dont mention the material you are working to suggest a feasible study and an appropriate answer.
When you work with powders, there is no mechanical cohesion between the powder particles (nanomaterials). There have been a few papers (on UV detectors) which show nanoparticles between two electrodes in colorful pictures. These are computer drawn pictures and do not reveal the reality.
I don't know if they just sprinkle the powders, or use the nano particle in ethanol/acetone, and put a droplet, when the solvent dries up, the particles remain. Mechanical cohesion is not guaranteed in such a method for the current to flow. Moreover for practical applications such methods do not stand a chance for establishing a rigid structure.
Definitely the two parallel electrode contacts must be very close to each other (upto 10-20 microns) which is done by photo-lithography.
However if you have sufficient quantity of your material in nanomaterial powder form, you can press a pellet which is dense enough, cut a small rectangular slab out of it, put contacts on either end, and then do your photoconductivity test to detect incoming radiation.
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Information about the program for measuring the thickness of thin films (prepared by thermal chemical spraying) known as hepatic optics?
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As Jürgen Weippert said, Spectroscopy Ellipsometry is one of the best techniques to obtain the thickness, roughness, and parameters of thin films.
You can also use AFM to obtain information about thickness (you can deposit your film and use a tape that does not leave residues on the substrate to create a gap between film and substrate, then measure it).
If your film is thick enough, you can perform SEM cross-section analysis.
However, I strongly advise the use of ellipsometry.
Regards
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We are using glass and iridium substrate for the deposition of Y2O3 by PLD. Under the same deposition conditions, the Y2O3 was successfully deposited on glass substrate but we did not found thin film on the Iridium substrate. We also confirmed it by SEM images and found only few particles of Y2O3 on iridium substrate but on glass substrate it was a complete thin film with reasonable coverage. We are looking for the expert opinion for understanding/resolving this issue or any other deposition technique suitable for the deposition of Y2O3 on iridium substrate.
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Further information is required, for example: cross-sectional SEM results of samples
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I have thin metallic and ferromagnetic films on the quartz substrate and I want to clean the surface of these films. what are the cleaning procedures for metallic thin films and ferromagnetic thin films?
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You must know how the thin film material can be dissolved. It depends purely on the material you have deposited on your quartz substrate.
Never use HF acid it can spoil your quartz substrate surface.
Bare quartz substrates can be cleaned in soap water, HW + CW, and then TCE, acetone and vapor degreased in methanol.
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If, in PLD process, we need to deposit a thin film on top of YSZ substrate, does some pretreatment be required? (Similar to the etching of STO substrate in order to obtain a specific terminal)
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Besides standard cleaning methods used for de-greasing the substrate, you can thermally anneal the substrate at a high temperature. YSZ has been very commonly used in the literature, and you can find a lot of information on cleaning such substrates.
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Does tin oxide have birefringence refractive index, when it was deposited as form thin layer ?
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Fotonlar kalay ve oksit için farklı tepkiler gösterirler. Bu yüzden ışık ışınları kalay oksit 'te iki defa kırınıma uğrar ve aynı ince film tabakada çift kırınıma uğrar. Bunun nedeni fotonun farklı özellik göstermesidir.
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I am currently doing a DFT calculation for thin film consisting of 32 atoms. The thin film's thickness is 12.3 Angstrom and the atoms position have low symmetry, so I also use dipole correction in this calculation. Typically, I use the thickness around 15 Angstrom for the vacuum length, but it might be computationally demanding. I want to ask if we can reduce it.
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Depends too much on the properties of interest and the specific system being used for there to be a single answer. 15 is probably fine, but you can just convergence test against your quantities of interest. I.e. maybe you care about binding energies at the surface, see if these changes at all when going from 10, 12, 16, 18, 20A of vacuum.
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As we know that RF power have demonstrate its great advantage on film properties with magnetron sputter. But, this technique had been applied only to planar targets.
Known advantages of rotary cylindrical target compared to planar targets,so it's attractive to expand the use of RF power to rotary cylindrical target . But I haven't seen any equipment combinations like that, neither any research literatures on that. I want to know why? what will happen if i deposit thin films (such as ITO film) with RF power rotaty cylindrical target?
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While RF power has demonstrated advantages for magnetron sputtering of thin films using planar targets, the use of RF power with rotary cylindrical targets is not as common. This may be due to technical challenges in designing and operating the equipment for this type of configuration.
In a rotary cylindrical target configuration, the target rotates and the substrate is located in close proximity to the target, allowing for high deposition rates and potentially better film properties. However, there are technical challenges associated with maintaining a stable plasma and uniform deposition over the entire surface of the substrate in this type of configuration. This is because the geometry of the cylindrical target can lead to uneven deposition and varying plasma conditions, which can affect the film properties.
That being said, there have been some studies that have explored the use of rotary cylindrical targets for thin film deposition, including for ITO films. In one study, the authors used a DC pulsed magnetron sputtering system with a cylindrical ITO target and found that the ITO films deposited using this configuration exhibited good electrical and optical properties. However, the authors noted that achieving uniform deposition over large areas remained a challenge.
If you were to attempt to deposit thin films, such as ITO films, using RF power and a rotary cylindrical target, it is possible that you may encounter similar challenges with achieving uniform deposition and maintaining stable plasma conditions. However, the exact outcome will depend on the specific equipment and parameters used, and there may be ways to optimize the deposition conditions to achieve better results. It's worth noting that there may be other deposition techniques that are better suited for depositing ITO films, such as electron beam evaporation or pulsed laser deposition, which are more commonly used for this type of material.
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My interested thin film compound of study are reported to have optical band gaps from experiments; while my DFT calculations shows half metallic properties.
My DFT Optical properties calculations also shows somewhat almost semiconducting properties with the presence of very low optical activities in the low photon energy range. So is it possible that half metallic compounds shows some optical band gaps?
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Hello
According to the information I have, the amount of band gap in theoretical calculations depends on the base state and the desired method.
It is even involved in solvent type calculations.
There are usually differences between the experimental and the theoretical mode.
In my opinion, it is better that you read the articles that are similar to your work and compare your results with the articles.
Investigation of Structural and Optoelectronic Properties of Sc2O3 Nanoclusters: A DFT Study
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Power 60w as optimum with 10E-1 resistance. But can't reach 10E-3. What should I do?
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To lower the resistance decrease the pressure and increase the power (10% to 50%). Good power is 5W/ cm^2
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Hi,
So I am trying to use a Hitachi F7000 fluorometer to measure the photoluminescence of thin films on glass. When I measure only the glass, I get strongly varying spectra, depending on the excitation wavelength. Attached you see spectra on the same sample using either 350 nm or 400 nm excitation, the results being strikingly different. Any help is greatly appreciated.
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I'm curious whether a short wavelength source damaged your sample since it provides higher energy. Maybe measurement using longer wavelengths is better in this case? Also, you can try to reduce the power of the laser source and/or reduce the exposure time.
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Recently I am doing my undergrad thesis on CuO thin film. I am facing problem in XRD characterisation as the peak in 32 degree becomes abnormally high whereas it should be a minor peak. What could be the possible reasons behind it?
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Sovendo Talapatra You can correct the typos in your question (XrD for XRD; 32 degrees not 32 degree) by use of the downward arrow on the right of the question. Please post your full diffractogram. Thin films sometimes require longer acquisition times because of the weaker intensity. Possible reasons are:
  • Orientation of the sample with respect to the beam showing preferred crystal planes different from a bulk sample
  • Substrate 'bleedthrough'. On what substrate was the CuO deposited?
  • Amorphous content
  • How do the positions of all the peaks compare to what is expected from the JCPDS card for CuO?
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Hello Everyone,
I am depositing CIS thin film using the thermal co-evaporation method. To study the composition, I use Hitachi S-4800 SEM/EDS instrument. Due to some limitations, I deposited only ~ 80 nm (instead of 1.6 micrometer) of CuInSe on a Si wafer.
I am wondering what is the suitable voltage/conditions for this kind of sample to get good EDS results.
BTW, the substrate is not rotating.
If someone tried that before, please let me know.
Thank you in advance.
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You should not go below 5-6 kV for proper excitation of L-lines of your elements of interest. If you do not have access to special (optional) "thin film analysis" software no satisfactory quantification is possible. And, as was already said, increase time and beam intensity.
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I am depositing thin films of Co using RF sputtering (magnetron) system. The deposition pressure is 7 x 10-3 mbar and RF power is 80 W at 20 sccm Argon flow. Earlier I was getting a sheet resistance around 400 ohms for a 4 nm thin film but now after almost 1 month, the 4 nm film resistance is coming around 1k ohm and there is no FMR signal is coming. I have changed the gas cylinder and tried to check the the possible things to look for.
Now I want to work on power and deposition pressure. Can anyone please help me how these parameters effect the film quality and magnetic behavior of Cobalt.
Thanks
Best Regards
Pinki
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Dear Pnnki,
The following info seem to be relevant and helpful:
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Magnetic anisotropy and electrical property of CoZrTaB thin films deposited by oblique sputtering
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during calculation microstrain of doped and undoped ZnO. i found negative microstrain. for example = -0.22938 for 1% al doping , -0.27 for 2% Al doping.
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Dear Mahamud,
Almost all sputter deposited thin films (at low deposition pressure) show compressive intrinsic stress after deposition. Low pressure goes together with high energy of charged particles, hence there is a sort of atomic peening effect during deposition. For higher deposition pressure, the intrinsic stress becomes zero and eventually, for still higher deposition pressures, tensile. The point of zero stress might be in the 5-8E-03 mbar range where the coating already shows strong porosity.
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I prepared undoped ZnO, AZO (Al-doped ZnO), and MZO(Mg doped Zno) thin films. After SEM analysis I noticed that the particle size decreased for Al doping compared to undoped but particle size increased for Mg doping.
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First compare the crystallite sizes using XRD analysis of the both samples using Serrer's formula. The ionic radius of Mg2+ is 66pm and ionic radius of Al3+ is 53pm. The increase in the size may be due to the larger size of the Mg2+ w.r.t. Al3+.
From my side I can say this.
Waiting for other response from the RG experts.
Regards
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I want to characterize the residual stress in copper thin film deposited on fused silica. Kindly let me know how to do that.
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Yes. Probable instrument and method:
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How to find out the value of current that has to be applied while measuring Hall effect measurement for TF of thickness 100 nm ?
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A thin film with 100 nm thickness, 1 cm/ 5 mm has a resistance of approximately 10 kOhms. With a current of 10 mA you can have a Hall volatge of less than 1 Volt
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Hello everyone,
This is a master degree problem that is applicable for thin films, its highly appreciated if anyone help me in the derivation of the equations. The equation are written in the attached file.
Thank you in advance.
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The formula that you are interested in is the effusive flow rate. It tells us how many gas molecules pass through a window with a unit area per unit time. This implies, its dimension is 1/m²/s.
The formula is valid for ideal gasses that obey the Maxwell's velocity distribution (https://en.wikipedia.org/wiki/Maxwell%E2%80%93Boltzmann_distribution), from which it can be derived. You may check the following Wikipedia contribution: https://en.wikipedia.org/wiki/Effusion#Physics_in_Effusion, where you can find the description of this quantity.
A more detailed description of the kinetic theory of gases can be found here: https://en.wikipedia.org/wiki/Kinetic_theory_of_gases, it is based on the abovementioned Maxwell's velocity distribution. Have a look especially at the paragraph "Collisions with container wall", where the collision rate = the effusive flow rate is derived.
I hope these hints will help you.
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I want to measure the mobility of NiO semiconductors with the Hall effect but I don't know which contact is appropriately working. NiO thin film was grown from the RF-sputtering method.
Actually, I read some topics and I found out Ti and Ni are the best for this. But, I'm considering how to connect Ti and Ni with my sample. If I use indium solder, I am afraid this way can destruct the sample at high temperatures. Or if I use evaporation deposition (sputtering, thermal) for the contact point, I'm afraid it can turn to NiTiO3 or something like this.
Please help me and explain in as much detail as possible.
Thank you so much for that
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To measure the mobility of NiO semiconductors using the Hall effect, it is common to use Ti or Ni as contact materials as they have good electrical conductivity and are relatively stable when in contact with NiO. However, the choice of contact material will also depend on the specific requirements of your experiment and the properties of the NiO sample. Low-temperature bonding techniques such as ultrasonic bonding, or using a thin layer of a conducting polymer as a buffer layer between the NiO and the Ti or Ni contact, can help to avoid any reaction between the contact and the semiconductor. Additionally, using e-beam evaporation or magnetron sputtering at low temperatures can be used to deposit the contact material on the sample, minimizing any reactions between the contact and the semiconductor. It's always good to check the compatibility of the contact materials with your sample
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I want to build a thin film of BCC iron
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Possible techniques reported are thermal evaporation technique, Pulsed Laser Deposition, physical vapour deposition
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1) In XRD analysis, while testing Thinfilm for information on the crystallinity of a particular thin film at the sample holder, if we used epoxy plaster tape to keep the thin film tight in that holder, did that impact the samples' properties?
2) If epoxy plaster tape is amorphous material in the above case, then?
3) If epoxy plaster tape is not amorphous in the above case, then?
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three wo aspects:
a) please have a look at epoxy XRD; for example Fig. 5 of:
If your epoxy will contribute to your background, you will be in trouble because of the broad XRD 'peaks', as you mentioned above.
As
Vadim S. Gorshkov
suggested, acquistion of an expoxy pattern could help, but you have to perform a weighted subtraction of sample XRD and the expoxy XRD pattern; but weighting factor unknown yet.
So
b) what thickness range of the film you are talking about? (When putting a film onto 'a plaster tape', I assume, it should be quite stiff and thus will have not too low thickness).
c) depending on the thickness range you may use grazing incidence XRD (GIXRD), which will reduce the information depth of XRD.
Best regards
G.M.
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The reaction of
Tartic acid + citric acid =?
Tartic acid + malic acid = ?
Citric acid + mailc acid = ?
Are these products have properties to use in Chemical Bath Deposition for making thin films?
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About pH or titration of mixed acid solutions at RG:
About the titration of a mixed phosphoric acid / sulfuric acid aq. solution with sodium hydroxide aq. solution; cf. my posts at:
About the pH for sodium acetate / acetic acid solutions with added hydrochloric acid; cf. my posts at:
About the pH of mixed lactic acid /sodium lactate and acetic acid / sodium acetate solutions or buffers ― also with strong monoprotic acid added; cf. my posts at:
About the pH of mixed H2SO4―HNO3 aq. solutions:
On the pH of mixed H2SO4―HCl―HI / aq. sol.:
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I am having 10nm chromium and 30nm gold on fused silica substrate. I need to characterize grain size and grain orientation for that. Thin film is deposited by Ion beam sputtering. My film roughness is between 4-6 nm
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FESEM and TEM.
You may perform AFM to get the idea about the surface and can corelate with the SEM results.
Regards
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