Semiconductor Fabrication - Science topic

We proposed a DHM system with improved spatial resolution compared with that of the polarized camera-based DHM system by employing a liquid crystal phase modulator (LCPM). The LCPM-based holographic interferometry optical system can reliably construct a four-step phase shifting scheme by changing the applied voltage, thus eliminating the need for m...

AMHSs (Automated Material Handling Systems) are widely used in major Fabs (semiconductor fabrication plants). The OHT in an AMHS is responsible for handling the FOUP (Front Opening Unified Pod) within the Fabs. Due to the unidirectional track, the movement path of the OHT aims to avoid congested areas caused by operations or malfunctions as much as...

Quantum dot (QD) color conversion‐based displays have emerged as one of the most promising next‐generation devices due to their superior emission properties in terms of color expression. To date, however, existing QD color conversion layer (QD‐CCL) technologies have suffered from low luminance and power efficiency, mainly due to significant light a...

Within high-precision indoor environments, such as semiconductor fabrication or textile plants, humidity control is paramount for preserving product integrity and reducing energy expenditure. The non-uniform indoor air environment poses a significant challenge in achieving humidity regulation that meets the distinct requirements of various location...

Fabrication of quantum processors in advanced 300 mm wafer-scale complementary metal-oxide-semiconductor (CMOS) foundries provides a unique scaling pathway towards commercially viable quantum computing with potentially millions of qubits on a single chip. Here, we show precise qubit operation of a silicon two-qubit device made in a 300 mm semicondu...

Physical unclonable functions (PUFs) have emerged as a favorable hardware security primitive, they exploit the process variations to provide unique signatures or secret keys amidst other critical cryptographic applications. CMOS-based PUFs are the most popular type, they generate unique bit strings using process variations in semiconductor fabricat...

The global outsourcing of semiconductor fabrication has led to hardware security concerns such as counterfeit Integrated Circuits (ICs) and Hardware Trojans (HTs), compromising the trustworthiness of semiconductor devices in critical applications. To address the issue of counterfeit ICs and HTs, various physical inspection methods have been develop...

The integration of quantum-dot (QD) technology with lithography defect detection presents a transformative approach to enhancing semiconductor fabrication processes. As the semiconductor industry continues to pursue smaller feature sizes and higher performance, the need for advanced defect detection methods becomes increasingly critical. Quantum do...

News Tidbits. Singapore's rise in the global information economy is driven by its strategic focus on ICT goods production, content creation, network infrastructure development, and informatization. Through initiatives like the IT2000 plan, Singapore transformed into a key regional tech hub by investing in broadband infrastructure and fostering inno...

Novel sensing applications benefit from multifunctional nanomaterials responsive to various external stimuli such as mechanics, electricity, light, humidity, or pollution. While few such materials occur naturally, the careful design of synergized nanomaterials unifies the cross-coupled properties which are weak or absent in single-phase materials....

The realisation of an universal quantum computer will require the operation of thousands to millions of qubits. The possibility of using existing industrial semiconductor fabrication techniques and infrastructure for up-scaling and reproducibility makes silicon based spin qubits one of the most promising platforms to achieve this goal. The implemen...

The semiconductor industry is on the brink of a paradigm shift driven by innovative transistor architectures. Vertical transistors, particularly FinFETs and Gate-All-Around (GAA) structures, are emerging as key players in the quest for improved performance, energy efficiency, and miniaturization in memory and logic devices. This article explores th...

The realisation of an universal quantum computer will require the operation of thousands to millions of qubits. The possibility of using existing industrial semiconductor fabrication techniques and infrastructure for up-scaling and reproducibility makes silicon based spin qubits one of the most promising platforms to achieve this goal. The implemen...

Multi-cluster tools are increasingly being adopted for wafer production in semiconductor fabrications. The current paper deals with single-armed linear multi-cluster tools connected by one-space buffer modules with residency time constraints. Due to the complexity of operations, previous research has primarily focused on scenarios with the schedula...

Wet etching of Silicon nitride (Si3N4) by phosphoric acid (H3PO4) is one of the key steps in the semiconductor fabrication process, especially for three‐dimensional integrated circuits (ICs). Unfortunately, few systematic studies of phosphoric acid etching of Silicon nitride are available. Summarizing how various factors affect etching and determin...

Oxide-based perovskite materials have a large application in fuel and hydrogen sensors, non-volatile random access memory devices, semiconductor fabrications, optoelectronic, thermoelectric and photovoltaic devices. In this report, equilibrium geometries, and optoelectronic properties of oxide-perovskite materials XTiO3 (X = Be, Mg, Ca, Sr and Ba)...

Advancements in high-computing devices increase the necessity for improved and new understanding and development of smart manufacturing factories. Discrete-event models with simulators have been shown to be critical to architect, designing, building, and operating the manufacturing of semiconductor chips. The diffusion, implantation, and lithograph...

With semiconductor chip dimensions shrinking below 7 nanometers, Chemical Mechanical Planarization (CMP) becomes more critical [1], [2]. To meet the increasing demand for precision and uniformity in the fabrication of wafers and chips, enhancements in CMP consumables and operating conditions are necessary. To address these requirements, novel pad d...

Two-dimensional (2D) semiconductors are regarded as promising building blocks for next-generation electronics. However, the fabrication of high quality 2D semiconductor wafers with engineered layers remains a significant challenge. Here, we develop a direct wafer bonding and debonding method for monolayer epitaxial semiconductors to overcome this c...

This study aims to establish and optimize a process for the fabrication of 3D microstructures of the biocompatible polymer Parylene C using hot embossing techniques. The different process parameters such as embossing temperature, embossing force, demolding temperature and speed, and the usage of a release agent were optimized, utilizing adhesive mi...

The exposure of spaceborne devices to high-energy charged particles in space results in the occurrence of both a total ionizing dose (TID) and the single-event effect (SEE). These phenomena present significant challenges for the reliable operation of spacecraft and satellites. The rapid advancement of semiconductor fabrication processes and the con...

Precise phase control of microwaves and millimeter waves is critical for today's wireless communication and signal processing electronics. For decades, achieving even modest phase-shifting resolution has demanded a complex mix of transistor switches and passive electromagnetic structures. These true-phase delay, true-time-delay or quasi-true-time-d...

As machine learning continues to find applications, extensive research is currently underway across various domains. This study examines the current methodologies of machine learning being investigated to optimize semiconductor manufacturing processes. Our research involved searching the SPIE Digital Library, IEEE Xplore, and ArXiv databases, ident...

In semiconductor fabrication (FAB), wafers are placed into carriers known as Front Opening Unified Pods (FOUPs), transported by the Overhead Hoist Transport (OHT). The OHT, a type of Automated Guided Vehicle (AGV), moves along a fixed railway network in the FAB. The routes of OHTs on the railway network are typically determined by a Single Source S...

The High-k/Metal-Gate Stack (HKMG) technology represents a seminal advancement in semiconductor fabrication, predicated upon the substitution of SiO2 with high-k dielectric materials, coupled with the integration of metal gate materials. This technological paradigm shift has emerged as a transformative response to the intricate challenges encounter...

Nanopatterning methods utilizing block copolymer (BCP) self-assembly are attractive for semiconductor fabrication due to their molecular precision and high resolution. Grafted polymer brushes play a crucial role in providing a neutral surface conducive for the orientational control of BCPs. These brushes create a non-preferential substrate, allowin...

The chemical mechanical planarization (CMP) process is a complex and critical operation in the semiconductor manufacturing industry, involving a wide variety of process parameters. As a universally employed technique in semiconductor fabrication, it has received extensive research attention over the past several decades. Despite the development of...

Recent advancements in optical communication technologies have spurred the development of Next-Generation (NG) systems capable of delivering higher data rates, improved spectral efficiency, and extended transmission distances. In response to the continually escalating and ambitious requirements of contemporary connectivity, researchers are explorin...

This paper delves into the convergence of mathematical and computer science principles within the realm of electronics engineering, particularly focusing on device-level transistor restructuring. A pressing challenge confronting the semiconductor sector is the persistent escalation of leakage current alongside technological advancements. At the hea...

In the rapidly evolving area of integrated photonics, there is a growing need for materials that satisfy the particular requirements of increasingly complex and specialized devices and applications. Present photonic material platforms have made significant progress over the past years; however, each platform still faces specific material and perfor...

The use of submerged orifices for bubble generation is ubiquitous in industries with wettability known to influence the bubble departure diameter. In this study, we investigated bubble generation and departure from the orifices (0.3–2 mm) drilled on hydrophobic perfluoroalkoxy (PFA) tubes in water. By varying the gas inflow rate (33 to 200 mL/min),...

This paper delves into the convergence of mathematical and computer science principles within the realm of electronics engineering, particularly focusing on device-level transistor restructuring. A pressing challenge confronting the semiconductor sector is the persistent escalation of leakage current alongside technological advancements. At the hea...

The high stretchability of two-dimensional (2D) materials has facilitated the possibility of using external strain to manipulate their properties. Hence, strain engineering has emerged as a promising technique for tailoring the performance of 2D materials by controlling the applied elastic strain field. Although various types of strain engineering...

The use of water-based chemistry in photolithography during semiconductor fabrication is desirable due to its cost-effectiveness and minimal environmental impact, especially considering the large scale of semiconductor production. Despite these benefits, limited research has reported successful demonstrations of water-based photopatterning, particu...

Suspended microchannels are of great interest in applications such as physical and chemical sensor systems. In this study, we developed a suspended microchannel resonator (SMR) by bonding two separate Au-coated silicon–insulator–silicon substrates via thermal diffusion bonding. To obtain a secure bond between Au films, we investigated different bon...

The integration of Artificial Intelligence (AI) and Machine Learning (ML) into semiconductor manufacturing has revolutionized defect detection and yield improvement processes. AI and ML algorithms analyze vast amounts of data generated during fabrication to enhance quality control, reduce defects, and optimize production yields. This paper provides...

Photonics, an ever-growing field since the invention of lasers in the 1960s, has been applied in wide-ranging applications such as optical communications, sensing, imaging and more. Photonic integrated circuits (PIC) are the next step to take this technology and shrink it onto a semiconductor chip, leading to more compact, cheaper, and lower power...

Chemical mechanical polishing/planarization (CMP) is an essential manufacturing process in semiconductor technologies. This method combines chemical and mechanical forces to smooth the surfaces of wafers. The effectiveness of CMP relies on a carefully chosen slurry, demanding a sophisticated manufacturing technology. This technology must seamlessly...

Cerebral organoids are hSPC derived tissue complexes that self-organize over an extended period and begin to recapitulate certain features of in vivo neurogenesis, and there is a need to develop tools that allow for the physical and electrical interrogation of these cell complexes as they mature. Presented here is a method of manufacturing thin, po...

With the advancement of semiconductor manufacturing technology, the effects of trace impurities in industrial chemicals have grown significantly. In industrial processes, conventional purification methods, such as filtration and distillation, have reached their limits for removing nanoparticles from aqueous and acidic solutions. Especially, silicon...

Analog and digital integrated circuit performance has greatly benefited by the shrinking of semiconductor fabrication technology components. In order to reduce the size of the transistors, it is obvious that the speed of the circuits must increase and the supply voltage must decrease. Although this decreases the power consumption of the circuits, i...

In this paper, an ultracompact combined sensor for displacement and angle-synchronous measurement is proposed based on the self-imaging effect of optical microgratings. Using a two-grating structure, linear and angular displacement can be measured by detecting the change of phase and amplitude of the optical transmission, respectively, within one s...

The semiconductor industry is undergoing a significant transformation away from conventional methods of shrinking devices and reducing costs. Chip designers are actively exploring new technological avenues to improve cost-effectiveness while integrating more features into the silicon footprint. One promising strategy is Heterogeneous Integration (H...

Radiation damage in semiconductor materials is a crucial concern for electronic applications, especially in the fields of space, military, nuclear, and medical electronics. With the advancements in semiconductor fabrication techniques and the trend of miniaturization, the quality of semiconductor materials and their susceptibility to radiation-indu...

Falkner's‐Skan flows are one‐dimensional flows widely used in fluid dynamics and boundary layer theory. They optimize heat exchangers and cooling systems, enhance turbine and compressor blades in turbomachinery, and provide consistency and quality in semiconductor fabrication. Additionally, they assist in pollution management and environmental impa...

In semiconductor manufacturing processes, numerous wet processing processes are involved in etching, development, and cleaning of wafers. The liquid waste contains tiny hazardous debris and particles and must be filtered out before being recirculated or discharged. Therefore, circulation systems, with filtration films to intercept debris, are essen...

Semiconducting graphene plays an important part in graphene nanoelectronics because of the lack of an intrinsic bandgap in graphene¹. In the past two decades, attempts to modify the bandgap either by quantum confinement or by chemical functionalization failed to produce viable semiconducting graphene. Here we demonstrate that semiconducting epigrap...

Reticle optimization is a computationally demanding task in optical microlithography for advanced semiconductor fabrication. In this study, we explore the effectiveness of D-Wave’s quantum annealing (QA) and hybrid steepest descent (SD) solvers in solving pixelated binary reticle optimization problems. We show that the energy derived from the objec...

This study proposes an effective dynamic OHT routing approach to handle a substantial volume of wafer transport in a modern large semiconductor fabrication plant. The proposed approach aims to overcome challenges faced by previous approaches whose applicability is limited in conditions where the underlying distribution of traffic conditions varies...

If there were ever a time to bring the people back to the AT&T Bell Labs Microelectronics plant in Orlando, Florida, it would be now. The big reset in U.S. domestic semiconductor manufacturing, exacerbated by the CHIPS Act of 2022 to reestablish semiconductor fabricators (known as fabs), is vulnerable to constraints in the global supply chain that...

In semiconductor fabrication, any deviation leads to significant mistakes in the result. Thus, the proximity effect is a critical issue that must be solved. In the past, optical proximity correction was constructed by fabrication experience and physics formula models, resulting in difficulties when the technology node shrinks. As a result, optical...

Optogenetics is an advanced neural stimulation technique with high spatiotemporal precision. Various stimulation devices have been developed using microfabrication techniques to deliver light to specific population of neurons. However, traditional microfabrication techniques rely on clean room facilities, making the overall manufacturing process lo...

In this paper, an ultracompact combined sensor for displacement and angle synchronous measurement is proposed based on self-imaging effect of optical microgratings. Using a two-grating structure, linear and angular displacement can be measured by detecting the change of phase and amplitude of the optical transmission respectively within one single...

Photocatalytic technology is promising in the wastewater treatment field due to its environmental friendliness and high degradation rate. Herein, a highly photocatalytic active magnetic composite SnO2/NiFe2O4 is successfully prepared through the hydrothermal and physical grinding method, and its structure and properties are analyzed using advanced...

This report assesses the effectiveness of the Biden administration’s export controls on semiconductor fabrication (chipmaking) equipment targeting China and China’s response. America’s licensing for chipmaking equipment have been surprisingly loose since Biden expanded the range of controls in October 2022. Thus, while China has not made much headw...

Background This study focuses on assessing occupational risk for the health hazards encountered during maintenance works (MW) in semiconductor fabrication (FAB) facilities. Objectives The objectives of this study include: 1) identifying the primary health hazards during MW in semiconductor FAB facilities; 2) reviewing the methods used in evaluatin...

Motivated by the drawbacks of solution phase processing, an all‐dry resist formation process is presented that utilizes amorphous zinc‐imidazolate (aZnMIm) films deposited by atomic/molecular layer deposition (ALD/MLD), patterned with electron beam lithography (EBL), and developed by novel low temperature (120 °C) gas phase etching using 1,1,1,5,5,...

The micro-hole machining of quartz wafers depends on photolithography techniques akin to those used in semiconductor fabrication. These methods present challenges due to high equipment setup costs, large space requirements, and environmental pollution risks. This research applies ultrasonic vibration assistance in electrochemical discharge machinin...

Occurrence of unintended gas breakdown in the narrow gaps of plasma processing chambers is one of the critical challenges in developing advanced plasma sources. We present combined experimental and theoretical study of unintended discharges in the narrow gaps of plasma processing chambers and report significant drop of the gas breakdown voltage in...

We demonstrate an artificially-intelligent cornea that can assume the functions of the native human cornea such as protection, tactile perception, and light refraction, and possesses sensory expansion and interactive functions. These functions are realized by an artificial corneal reflex arc that is constructed to implement mechanical and light inf...

Al 1-x In x N as a Ⅲ-nitride semiconductor material has become a present research hot issue due to its remarkable physical properties and chemical stability. When tuning the Al and In compositions, its band-gap energy varies from 0.7eV to 6.2eV, which shows great application potential in the photodetector. Here, we report the fabrication and perfor...

Optical imaging and photolithography hold the promise of extensive applications in the branch of nano-electronics, metrology, and the intricate domain of single-molecule biology. Nonetheless, the phenomenon of light diffraction imposes a foundational constraint upon optical resolution, thus presenting a significant barrier to the downscaling aspira...

With the advancement of state-of-the-art technologies, the semiconductor industry plays a key role as an essential component in the manufacture of various electronic products. Since the manufacturing of a semiconductor goes through very sophisticated and complex processes, efficient and accurate work and management are essential in the design, cons...

As the digital age continues to evolve, the environmental footprint of the electronics industry becomes increasingly evident. The traditional production and disposal processes of electronic devices pose significant threats to our environment. Addressing these concerns, the integration of renewable materials offers a promising avenue towards redefin...

The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves...

In Part I of a two-part report, we provide a detailed and systematic review of the latest progress in cutting-edge innovations for the silicon carbide (SiC) material system, focusing on chemical vapor deposition (CVD) thin film technologies. To this end, up-to-date results from both incremental developments in traditional SiC applications as well m...