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Micromachining - Science topic

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Recently, I made a 20% glycerol solution, added red ink to it, and placed a drop at my microfluidic chip's inlet. But it needs to move forward, and it is not moving forward. What's the reason behind this? It's the deposition of ink or dust particles at the chip's channel. Can you recommend any cleaning process?
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Actually, it flows sometimes. I'm not sure if the problem is with the design or my preferred mode of fabrication. Why does it flow from some chips if it's a design issue? By the way, it doesn't flow most of the time. Like 4 out of 5 chips it dont flow.
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Dear sir
Today my supervisor asked me whether grinding is under the micromachining or not. Really I'm confused. in the grinding process, we can possible to remove a minimum volume of material but how to we consider its micromachining .....
Please Clear My Query
Kind Regards
S.Sathishkumar
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I think machining a micro-size component is called micro-machining. We can use any machining process to do that.
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I am looking to purchase a Laser micromachining system for fabricating microfluidics devices with 35micron rounded channels from PDMS, PMMA or glass. What is the best make and model to achieve this type of feature resolution and what system parameters are the most important ones that I should be aware of? Thank you
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Standard CO2 lasers are cheap but not easy to use to produce round channel with precises dimention. Femto laser like one from https://www.femtoprint.ch/ can be use to produce channels into a specific glass material with a two step etching: 1. laser pre-condition glass and 2. channels are wet etched https://www.degruyter.com/document/doi/10.1515/nanoph-2017-0097/html
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Can anyone help me to know the micromachining / EDM/CNC tools?
I need the pattern as shown in the figure, in which the white portions are cut and removed, black portions are retained and the dimension is 10 micrometers.
The material used may be plastic/any metal.
Please give your valuable suggestions.
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The part can't be manufactured using traditional methods of mechanical and electrical discharge machining. May be try laser cut.
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Can anyone help me to know the micromachining / EDM/CNC tools?
I need the pattern as shown in the figure, in which the white portions are cut and removed, black portions are retained and the dimension is 10 micrometers.
The material used may be plastic/ metal.
Please give your valuable suggestions.
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I would suggest photolitography for such fine structures. This is much cheaper and easier than a 1 M$ CNC machine as suggested from Oscar Rodriguez Alabanda.
Cheers, Claus
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We are a research group working in the field of laser processing. We want to build our own femtosecond (or picosecond laser) for micromachining (fine marking for example). Do your know any low cost solution ? (publications, reports, do-it-yourself instructions, simple low cost source, etc...). Thanks for your advice and contact me if you having complete discussion : mflury@unistra.fr
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Still an interesting topic in 2021. Ultrafast lasers are still expensive! The smallest available laser which can be used for material processing (means 3-5 W of average power, 15-100ps pulses, 30-60uJ pulse energy) still costs 25kEUR-45kEUR . :/
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A100nm of Chromium is used as a sacrificial layer which is to be removed in order to have a microcantilever suspended. However, after wet etching of Chromium, immersing in DI water, and drying by nitrogen gas, the microcantilever is stuck to the silicon substrate. As a result, nonuniform structures are obtained. I was wondering if there would be a way to get rid of this adhesion?
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You can try CPD or try to release the structure by using dry etching of sacrificial layer
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1. LATEST RESEARCH TREND ON CRYOGENIC MACHINING
2. POLYMER BEHAVIOR BELOW GLASS TRANSITION TEMPERATURE
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Dear Partha,
For help and eventual interest some information that can be obtained directly from the producers of cryogenic grinding equipment. Best regards, Marius
Source: Airproducts
Particle size reduction with cryogenic grinding/milling with liquid nitrogen
Source: Retsch
Source: SPEX® SamplePrep
Structural Changes in Polymers by Means of Cryogenic Grinding
Other information
Production of Fine Polymer Powder under Cryogenic Conditions
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High accuracy Thermocouple used to measure the temperature between the tool tip interface? Give the suggestions for suitable thermocouple or device which may be used to measure the temperature near to the machining region while dielectric fluid is flowing in advanced micromachining processes?
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A agree that a k-type thermo couple would work fine for this job, you could potentially also use an "NTC". You will need to enssure good thermal contact to the sensor however. I think you will have great difficulty using an infrared thermometer as you need an object that radiates heat well i.e. has a high emissivity. Typically metal surface are very bad for this, and have to be painted mat black. The coolant will also mask what you are trying to measure with the infrared technique.
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MEMS based energy harvester: But tuning should be continuous so as to get maximum power from harvester. 
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All you want to know is summarized here:
Self Tunable Piezoelectric Energy Harvester: Autonomous Frequency Tracking Using Servomotor
by Sutrisno W. Ibrahim (Author),‎ Wahied G. Ali Abdelaal (Author)
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I am designing Micromachined antenna what step should I follow for simulation for same
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Minor ID 1mm
Major ID 2mm
Thickness 0.4mm
Hole dimension: square 2*2 mm
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or you can use chemical etching with a hard mask
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What are the different ways of measuring surface roughness of a microhole? 
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you can try stylus profilometer for measureing the surface roughness in the hole...if the hole depth is not too much....
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As i m trying to drill on NiTi sheet 0.35 mm thickness in underwater but i observed that heat affected zone is maximum in case of underwater as compare to open air processing. Also the material removal rate is to be minimum.
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And further, Maybe you will find bubbles around  laser spot during drilling, especially with laser of longer pulse, like nanosecond laser.
Try to remove them ,or it will affect water layer and act like lens to move foucus center to somewhere around the hole.
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I want to fabricate devices using ebeam lithography and AZ 5214E in Raith 150 Two system.  
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An example of EBL process for AZ 5214E photoresist can be found in the attached paper.
Regards.
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The μPECMM occurs at very small gap widths (<2 microns), so that can quickly produce a short circuit caused by contamination. This short circuit is counter-productive for a high surface quality, so it must be recorded and a spark discharge across this short-circuit can be avoided. What are the criteria to detect this short-circuit early?  
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I know that all those with the μPECMM (Pulse Electrochemical Micro Machining - Double Layer reloading) is aware of this problem, but does not discuss because of the mostly good surface results.
But it would be good to know whether the shorts have a signified effect, and whether the impact on larger working surfaces (higher operating currents) is stronger. This is an important issue with respect to the increase in productivity of μPECMM.
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What all thin film quality parameters (thickness uniformity, roughness, stress etc) will be drastically affected if I use a stationary substrate holder instead of a rotating substrate holder in an e-beam evaporator system? Anyone did quality tests in such films?
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Jose, the answer to this question is independent of the type of physical deposition  process you utilize, whether it be e-beam evaporation, thermal evaporation, rf or dc sputtering, or even pulsed-laser deposition.  By not rotating your substrate, you will have much lower thickness uniformity.  Because of this, you will also experience a different set of stress variations across the film surface.  Since stress for thicker films is often relieved by either buckling or the formation of pinholes, you could run create a gradient of these features across a sample surface.  By using rotation, typically a larger uniform area for both thickness and stress-relieved artifacts will occur.
For various experimental reasons, you may or may not have the option of rotating the substrate holder.  Just make sure you know your area of uniform deposition and keep sample sizes small enough to remain within this limit.  You can still get work done, just in smaller regions.  Good luck.
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The chip which is used in mostly in laptop's and CPU's, under the cover of processor. is possible to do micro machining process on that chip.
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@ Sameer: Unfortunatelly I don't get what you mean with "chips are covered with wafer on tap portion".
You can do micromachining on a chip (Silicon with active areas) . You just need to take care that no active area is effected, neither by chipping or crack formation. Which means you need to have a enough space. The sawing process for chip singulation is actually a kind of chip machining.
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This is in reference to circularity and roundness profiles of microholes of up to 0.1 mm.
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ZETA profilometer may help you. You need to mount your sample vertically
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I am trying to find some information about an energy harvesting using PZT in a condition of high acceleration ( e.g. 70 000 G) and a high rotation speed (40 000 rpm/s). Any tips ?
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Depending on the resonance frequency of the external force, the behaviour would be highly non-linear and, the hysteresis behaviour may be unpredictable if the driving frequency impinge the natural frequency of the PZT. 
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In the ED micromachining, we must assume that the pulse energy must be getting smaller. However, the limit of the arc-curve shows us that we must not fall below a certain current threshold. How do you solve this problem?
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Ok, that is practical solutions, which generally apply to the EDM. But they say nothing to that minimum erosion current must be achieved in order to prevent corona discharges.
My interest now is to find out what they have gained knowledge for other researchers, where this limit the erosion current lies and / or whether there is this limit at all. After the u i characteristic for discharges there must be this limit, but it depends on the materials used, the dielectric, geometric specifications (?) ....
Objective of the pulse generation is always to generate a spark discharge, no arc, no glow and no other abnormalities like.
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For a fibre optical pressure sensor system as shown in the paper by F. Ceyssens et al what is the maximum frequency response one could expect? What are the differences in frequency response between a bulk silicon micromachined membrane and a SiC membrane?
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The frequency response/resonance frequency depends on both the material and the structure of the system. So, the inital material of the fibre gives you some hints about the specrum however, it is changed within different structures and I think the experiment is the only way to investigate it. Cheers,N
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This is in order to know the capabilities of EDM and MicroEDM processes.
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So simple is not the answer, because it is now a question of what technical equipments are aveailable to me and what price I will pay for it. Another important question is how deep I want to make this hole and which material is to machining.
Best regards
Hans-Peter
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Are there any companies that use components produced using this technique?
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Please find direct answers of applications from different sources. It is extracted using syntactic-semantic technology. Hope it is useful
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For better operating results in MEMS.
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There are quite a few brands that you can use. Comsol is a not too bad option, CoventorWare is fantastic but the price is a bit high and of course ANSIS. Personally I'd suggest to use CoventorWare in combination with comsol...