Zhiqiang Feng's research while affiliated with Chinese Academy of Sciences and other places

Publications (5)

Article
Epoxy resins are widely used for electronic packaging materials due to their good performance. A common way to cure epoxy is to add anhydride as a hardener, to this, we added a less used curing method, catalytic curing, to study their effect on the curing system and curd samples. Polymers containing naphthalene rings usually have low moisture absor...
Article
Developing self-healable, recyclable and reprocessable polymer materials is one of the effective ways to relieve plastic pollution and save resources. Using dynamic reversible hindered urea bonds (HUBs) to construct self-healing materials have become a hot topic to investigate renewable materials. HUBs have a large substituent on its nitrogen atom,...
Article
Full-text available
The field of microelectronic devices and 5G communication has an increasing demand for polymer composites with low dielectric constant, low dielectric loss, and good hydrophobicity. However, traditional polymer composites cannot simultaneously satisfy them, which severely hinders their application. In this work, a liquid crystal epoxy resin (LCE4)...
Article
The fabrication and development of excellent thermoset polymers with self-healing and shape memory properties is highly desirable. Herein, a novel high-strength epoxy resin (EP-SeSe) with diselenide bonds was rationally designed for rapid repair materials in building constructions and electrical packaging. The resultant resins exhibit excellent sha...
Article
Full-text available
Traditional epoxy resin materials are widely used in coatings, composite materials, electronic packaging materials, etc. They are usually made of unsustainable fossil resources and cannot be recycled under mild conditions. Degradable thermosetting resins with dynamic covalent structure provide a potential solution to this conflict. In this paper, u...

Citations

... Zeng et al. demonstrated a novel epoxy material derived from the reaction of 4,4′-dithiodiphenylamine with epoxidized soybean oil, and the mechanical properties were almost recovered completely when two broken parts of materials were welded together (Liu et al., 2020). Liang et al. introduced dynamic diselenide bonds into epoxy thermosets, which have good self-healing and shape-memory (Liu et al., 2022). Although dynamic disulfide bonds and dynamic diselenide bonds can be used as DCBs of epoxy systems, the effects of crosslinkers on the mechanical properties, thermal stability, and self-healing of epoxy materials have not been studied. ...
... 93 In a similar study, two different imine exchange based vitrimers were synthesized using vanillin/1,6-hexylenediamine (VHP) and vanillin/m-xylylenediamine (VMP) curing agents. 94 The tan d result shows that the T g of VHP and VMP bio-based imine epoxy vitrimers are 83°C and 96°C, respectively, whereas the storage modulus values are 2600 MPa and 2650 MPa, respectively. This could be attributed to the higher rigidity chain structure for VMP vitrimer ( Fig. 12a and b). ...