Petr Kubíček’s research while affiliated with The Czech Academy of Sciences and other places

... With the development of electronics manufacturing and welding technology, it has been an inevitable trend that leadfree solder substitutes the lead-containing alloy (Li 2005;Katsuaki 2001;Drápala et al. 2013). Sn-based alloy is a new type of brazing materials due to its excellent performance (Lai et al. 2003;Suzuki et al. 2005;Sebo et al. 2013). ...

Reference:

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

... The width of the creating phase depends on the concentration curve of each phase and its rate of growth [11]. Some our results at the study of the reactive diffusion were published in the journal Defect and Diffusion Forum [12][13][14][15] and [16]. ...

Reference:

Study of growth kinetics of intermetallic phases in Cu-Sn solder joints under the conditions of reactive diffusion

... The width of the creating phase depends on the concentration curve of each phase and its rate of growth [11]. Some our results at the study of the reactive diffusion were published in the journal Defect and Diffusion Forum [12][13][14][15] and [16]. ...

Reference:

Study of growth kinetics of intermetallic phases in Cu-Sn solder joints under the conditions of reactive diffusion

... The width of the creating phase depends on the concentration curve of each phase and its rate of growth [11]. Some our results at the study of the reactive diffusion were published in the journal Defect and Diffusion Forum [12][13][14][15] and [16]. ...

Reference:

Study of growth kinetics of intermetallic phases in Cu-Sn solder joints under the conditions of reactive diffusion

... The width of the creating phase depends on the concentration curve of each phase and its rate of growth [11]. Some our results at the study of the reactive diffusion were published in the journal Defect and Diffusion Forum [12][13][14][15] and [16]. ...

Reference:

Study of growth kinetics of intermetallic phases in Cu-Sn solder joints under the conditions of reactive diffusion

... Isothermal sections of the equilibrium phase diagram in the ternary Bi-Cu-Sn system were calculated using the CALPHAD method with Thermo-Calc Software and the COST531 thermodynamic database [28,29]. The results of the calculations at T = 473 K are shown in Fig. 5. ...

Reference:

Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures

... not less important were also the related articles about mechanic properties (which was one of favored of the Šatava's research topics [208,217]), diffusion studies [203][204][205][206][207][208][209][210][211][212] and early measurements of electrical and heat conductivity [202,[214][215][216][217] inserted into category Mechanical and transport properties [200][201][202][203][204][205][206][207][208][209][210][211][212][213][214][215][216]. the last category of Czechoslovak papers dealing with ta is labeled as History and nomenclature. it contains reviews of historical aspects of thermometry and thermodynamics [221][222][223][224][225][226][227] and associated nomenclature issues [219,220]. ...

Reference:

Czechoslovak footprints in the development of methods of thermometry, calorimetry and thermal analysis

... The results are presented in Fig. 2. This TGA data at different heating rates can be used to determine the kinetic parameters (Kubicek and Lesko, 1979). ...

Reference:

Characterization of spray lubricants for the high pressure die casting processes

... From the results of the present preliminary measurements c B (x,t) in the region where atoms B diffuse from phase β into metal A, see Fig. 3, the concentration profile cannot always be described by the function (31). If a new coordinate system with the origin x' = 0 is placed on axis 1 in Fig. 3, then the following function better corresponds to the measured concentration profiles: ...

Reference:

Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt