March 2025
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7 Reads
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March 2025
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7 Reads
January 2025
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10 Reads
December 2024
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1 Read
September 2024
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7 Reads
September 2024
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8 Reads
September 2024
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7 Reads
August 2024
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215 Reads
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8 Citations
Aluminum Scandium Nitride (Al1−xScxN) has received attention for its exceptional ferroelectric properties, whereas the fundamental mechanism determining its dynamic response and reliability remains elusive. In this work, an unreported nucleation‐based polarization switching mechanism in Al0.7Sc0.3N (AlScN) is unveiled, driven by its intrinsic ferroelectricity rooted in the ionic displacement. Fast polarization switching, characterized by a remarkably low characteristic time of 0.00183 ps, is captured, and effectively simulated using a nucleation‐limited switching (NLS) model, where the profound effect of defects on the nucleation and domain propagation is systematically studied. These findings are further integrated into Monte Carlo simulations to unravel the influence of the activation energy for ferroelectric switching on the distributions of switching thresholds. The long‐term reliability of devices is also confirmed by time‐dependent dielectric breakdown (TDDB) measurements, and the effect of thickness scaling is discussed. Ferroelectric field‐effect transistors (FeFETs) are demonstrated through the integration of AlScN and 2D MoS2 channel, where biological synaptic functions can be emulated with optimized operation voltage. The artificial neural network built from AlScN‐based FeFETs achieves 93.8% recognition accuracy of handwritten digits, demonstrating the potential of ferroelectric AlScN in future neuromorphic computing applications.
March 2024
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40 Reads
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3 Citations
January 2024
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126 Reads
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8 Citations
In this work, 10 nm scandium-doped aluminum nitride (AlScN) capacitors are demonstrated for the construction of the selector-free memory array application. The 10 nm Al0.7Sc0.3N film deposited on an 8-inch silicon wafer with sputtering technology exhibits a large remnant polarization exceeding 100 µC/cm² and a tight distribution of the coercive field, which is characterized by the positive-up-negative-down (PUND) method. As a result, the devices with lateral dimension of only 1.5 μm show a large memory window of over 250% and a low power consumption of ~40 pJ while maintaining a low disturbance rate of <2%. Additionally, the devices demonstrate stable multistate memory characteristics with a dedicated operation scheme. The back-end-of-line (BEOL)-compatible fabrication process, along with all these device performances, shows the potential of AlScN-based capacitors for the implementation of the high-density selector-free memory array.
January 2024
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223 Reads
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12 Citations
Ferroelectric scandium-doped aluminum nitride (Al1-xScxN) is of considerable research interest because of its superior ferroelectricity. Studies indicate that Al1-xScxN may suffer from a high leakage current, which can hinder further thickness scaling and long-term reliability. In this work, we systematically investigate the origin of the leakage current in Al0.7Sc0.3N films via experiments and theoretical calculations. The results reveal that the leakage may originate from the nitrogen vacancies with positively charged states and fits well with the trap-assisted Poole-Frenkel (P-F) emission. Moreover, we examine the cycling behavior of ferroelectric Al0.7Sc0.3N-based FeRAM devices. We observe that the leakage current substantially increases when the device undergoes bipolar cycling with a pulse amplitude larger than the coercive electric field. Our analysis shows that the increased leakage current in bipolar cycling is caused by the monotonously reduced trap energy level by monitoring the direct current (DC) leakage under different temperatures and the P-F emission fitting.
... CIM has been recognized as a promising approach for accelerating core operations, such as vector-matrix multiplication (VMM), which are central to DNN computations. Various non-volatile memory devices, including resistive random-access memory (ReRAM) [13][14][15][16][17][18][19][20][21][22][23][24][25][26], phase-change memory (PCM) [27][28][29][30][31][32][33][34][35][36], and ferroelectric devices [37][38][39][40][41][42][43][44][45][46], have been investigated for CIM applications due to their distinctive properties. Among them, flash memory has gained significant attention in the CIM application [47][48][49][50][51][52][53][54][55][56]. ...
August 2024
... These results suggest a minimal "size effect" on the P r value of (Al,Sc)N films. 92,93) ...
January 2024
... Many recent reviews have thoroughly discussed the key advantages and future directions of AlScN as an FE material, emphasizing its growing importance in high-performance devices [9][10][11][12]. However, a comprehensive understanding of how different deposition techniques and conditions influence their structural, electrical, and [36] FE properties is still lacking. Such knowledge is crucial for optimizing fabrication processes and enhancing device performance to meet the stringent requirements of modern electronic applications. ...
January 2024
... 10,11 The incorporation of scandium (Sc) into AlN has shown significant potential to enhance its piezo performance and electromechanical coupling coefficient and reduce leakage current. [12][13][14] In our previous work, 15 we have deposited RF sputtered AlN thin films at low sputtering power. In the present work, we have further increased the sputtering power to improve crystallinity in the grown films. ...
July 2023
... However, precise determination of the saturated polarization remained challenging due to the high leakage observed in the ultra-thin film. [54][55][56] Next, quasi-DC I-V measurements were conducted to investigate switching performance under slow sweeping conditions. A DC I-V hysteresis measurement was performed on the capacitor, sweeping from 5.2 V to -5.2 V with a 0.025 V step size. ...
July 2023
... This suggests that Mo is a promising top electrode material for FE AlScN thin films, particularly when grown on ultrathin electrodes. Further exploration of the effects of stress on leakage in these films, particularly in 100-nm FE AlScN films sputtered on 50-nm Mo on an 8-inch wafer, demonstrated a direct correlation between in-plane stress and increased leakage, as manifested in Fig. 6f [62]. ...
September 2023
... Various growth processes and parameters significantly impact the lattice polarity and crystalline quality of FE AlScN thin films, which in turn affect their overall properties. For example, factors such as sputtering power, gas ratio, and substrate choice directly influence key characteristics of the films, including current leakage and P r [55,56]. Early sputtering methods produced FE AlScN thin films with poor quality and little control over lattice polarity, highlighting the need for improved techniques [57]. ...
July 2023
Applied Surface Science
... The wurtzite materials have served as a type of mature piezoelectric material for a long time due to their promising acoustic application in the microelectromechanical systems (MEMS). 11,12 The discovery of ferroelectricity in the Sc-doped AlN has opened a broad avenue for the study of wurtzite ferroelectrics. 13 In recent several years, the wurtzite ferroelectrics have been intensively studied due to their compatibility with the CMOS technology, and the atomic-scale polarization switching mechanism has also been clarified by the scanning transmission electron microscopy (STEM) approach. ...
December 2022
ACS Applied Electronic Materials
... 5,15,16 This points to the possibility that leakage currentsespecially at low thicknessmay not be tied intimately to structural defects. 17,18 ...
December 2022
... Diffraction analyses from bulk regions (Regions 2 and 3, R2 & R3) reveal almost uniform crystalline throughout the film, even at grain boundaries where nitrogen vacancies are prone to accumulate. These optimized fabrication measures effectively suppress oxidation at the interface and nitrogen vacancy formation within the bulk, ensuring superior crystalline and enhanced breakdown characteristics [9], [10]. ...
October 2022