January 2025
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This study investigated silicone composites with distributed boron nitride platelets and carbon microfibers that are oriented electrically. The process involved homogenizing and dispersing nano/microparticles in the liquid polymer, aligning the particles with DC and AC electric fields, and curing the composite with IR radiation to trap particles within chains. This innovative concept utilized two fields to align particles, improving the even distribution of carbon microfibers among BN in the chains. Based on SEM images, the chains are uniformly distributed on the surface of the sample, fully formed and mature, but their architecture critically depends on composition. The physical and electrical characteristics of composites were extensively studied with regard to the composition and orientation of particles. The higher the concentration of BN platelets, the greater the enhancement of dielectric permittivity, but the effect decreases gradually after reaching a concentration of 15%. The impact of incorporating carbon microfibers into the dielectric permittivity of composites is clearly beneficial, especially when the BN content surpasses 12%. Thermal conductivity showed a significant improvement in all samples with aligned particles, regardless of their composition. For homogeneous materials, the thermal conductivity is significantly enhanced by the inclusion of carbon microfibers, particularly when the boron nitride content exceeds 12%. The biggest increase happened when carbon microfibers were added at a rate of 2%, while the BN content surpassed 15.5%. The thermal conductivity of composites is greatly improved by adding carbon microfibers when oriented particles are present, even at BN content over 12%. When the BN content surpasses 15.5%, the effect diminishes as the fibers within chains are only partly vertically oriented, with BN platelets prioritizing vertical alignment. The outcomes of this study showed improved results for composites with BN platelets and carbon microfibers compared to prior findings in the literature, all while utilizing a more straightforward approach for processing the polymer matrix and aligning particles. In contrast to current technologies, utilizing homologous materials with uniformly dispersed particles, the presented technology reduces ingredient consumption by 5–10 times due to the arrangement in chains, which enhances heat transfer efficiency in the desired direction. The present technology can be used in a variety of industrial settings, accommodating different ingredients and film thicknesses, and can be customized for various applications in electronics thermal management.
