M. Armstrong’s research while affiliated with Intel and other places

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Publications (6)


Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture
  • Conference Paper

June 2024

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38 Reads

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1 Citation

Christopher Pelto

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R. Aggarwal

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R. Ahan

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[...]

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S. Natarajan

mmWave and sub-THz Technology Development in Intel 22nm FinFET (22FFL) Process
  • Conference Paper
  • Full-text available

December 2020

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678 Reads

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12 Citations

This paper presents the recent mmWave and sub-THz oriented technology developments as part of RF design-technology co-optimization (DTCO) efforts in Intel 22nm FinFET process (22FFL). Several back-end-of-line (BEOL) and front-end-of-line (FEOL) improvements have been implemented for high frequency applications. In the newly developed BEOL, ExpressVia is introduced, which allows direct transistor connection to thick metal. Continuous via and 3+1 thick metal layers are enabled for design flexibility. The high performance RF transistor (RF HP) is optimized with the new BEOL and characterized at top metal. Additional process improvements in high power RF device (HyPowerFF) and varactors are also implemented. These BEOL and FEOL improvements enable high performance, innovative mmWave and sub-THz circuits and systems.

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Performance summary of HyPowerFF and the reference devices
Implementation of High Power RF Devices with Hybrid Workfunction and OxideThickness in 22nm Low-Power FinFET Technology

December 2019

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226 Reads

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20 Citations



Citations (4)


... In the last decade, nanotechnology has continued its relentless progress leading to transistor scaling towards the sub-nm regime [9], outstanding achievements in CMOS-RF circuits towards true terahertz support [10], silicon photonics and other fully integrable photonic technologies [11], and energy harvesting and power transfer means enabling perpetual operation of devices [12], to name a few. Transversal to them all, the last decade has also seen tremendous advances in the synthesis and application of graphene, which in turn heralded the arrival of a new breed of two-dimensional nanomaterials with outstanding opto-electromechanical properties [13], [14]. ...

Reference:

Electromagnetic Nanonetworks Beyond 6G: From Wearable and Implantable Networks to On-Chip and Quantum Communication
mmWave and sub-THz Technology Development in Intel 22nm FinFET (22FFL) Process

... Additional technology considerations for the element optimization including fin geometry and gate flow are detailed in [4] and summarized further in Fig. 11. With the voltage across the element lowered to the nominal voltage of the process, the limit on the number of sense cycles is virtually eliminated and RAM-like on-demand sensing is enabled. ...

Design-Technology Co-Optimization of Anti-Fuse Memory on Intel 22nm FinFET Technology
  • Citing Conference Paper
  • December 2019

... Cost-effective CMOS technology with high transistor density is suitable for beamforming applications of mobile devices. FinFETs have a better maximum oscillation frequency (fMAX) than the planar MOSFET [4,5]. However, the cut-off frequency (fT) of FinFET cannot outperform planar MOSFET [4,6] due to the low electron mobility of its (110) sidewalls. ...

Implementation of High Power RF Devices with Hybrid Workfunction and OxideThickness in 22nm Low-Power FinFET Technology

... Although nowadays some manufacturers (e.g. Intel [6], [7]) use significantly reduced channel doping to suppress RD induced fluctuations of device parameters, some other leading companies (such as IBM [8] and TSMC [9]) still employ FinFETs with "conventional" channel doping and therefore RD related variability still remains an issue. ...

Transistor reliability characterization and modeling of the 22FFL FinFET technology
  • Citing Conference Paper
  • March 2018