June 2024
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38 Reads
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1 Citation
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June 2024
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38 Reads
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1 Citation
December 2020
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678 Reads
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12 Citations
This paper presents the recent mmWave and sub-THz oriented technology developments as part of RF design-technology co-optimization (DTCO) efforts in Intel 22nm FinFET process (22FFL). Several back-end-of-line (BEOL) and front-end-of-line (FEOL) improvements have been implemented for high frequency applications. In the newly developed BEOL, ExpressVia is introduced, which allows direct transistor connection to thick metal. Continuous via and 3+1 thick metal layers are enabled for design flexibility. The high performance RF transistor (RF HP) is optimized with the new BEOL and characterized at top metal. Additional process improvements in high power RF device (HyPowerFF) and varactors are also implemented. These BEOL and FEOL improvements enable high performance, innovative mmWave and sub-THz circuits and systems.
April 2020
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18 Reads
December 2019
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226 Reads
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20 Citations
December 2019
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19 Reads
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4 Citations
March 2018
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72 Reads
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11 Citations
... In the last decade, nanotechnology has continued its relentless progress leading to transistor scaling towards the sub-nm regime [9], outstanding achievements in CMOS-RF circuits towards true terahertz support [10], silicon photonics and other fully integrable photonic technologies [11], and energy harvesting and power transfer means enabling perpetual operation of devices [12], to name a few. Transversal to them all, the last decade has also seen tremendous advances in the synthesis and application of graphene, which in turn heralded the arrival of a new breed of two-dimensional nanomaterials with outstanding opto-electromechanical properties [13], [14]. ...
December 2020
... Additional technology considerations for the element optimization including fin geometry and gate flow are detailed in [4] and summarized further in Fig. 11. With the voltage across the element lowered to the nominal voltage of the process, the limit on the number of sense cycles is virtually eliminated and RAM-like on-demand sensing is enabled. ...
December 2019
... Cost-effective CMOS technology with high transistor density is suitable for beamforming applications of mobile devices. FinFETs have a better maximum oscillation frequency (fMAX) than the planar MOSFET [4,5]. However, the cut-off frequency (fT) of FinFET cannot outperform planar MOSFET [4,6] due to the low electron mobility of its (110) sidewalls. ...
December 2019
... Although nowadays some manufacturers (e.g. Intel [6], [7]) use significantly reduced channel doping to suppress RD induced fluctuations of device parameters, some other leading companies (such as IBM [8] and TSMC [9]) still employ FinFETs with "conventional" channel doping and therefore RD related variability still remains an issue. ...
March 2018