Kenji Sawai’s research while affiliated with Tokyo Institute of Technology and other places

The recent papers Saito et al 2013 Smart Mater. Struct. 22 015019 and Dhelika et al 2013 Smart Mater. Struct. 22 095010 described studies of an electrostatic chuck that mimics the structure of gecko-like toes. Earlier work published by the authors and other researchers is cited to further illustrate the origin and motivation of the research.

An electrostatic chuck (ESC) is a type of reversible dry adhesive which clamps objects by means of electrostatic force. Currently an ESC is used only for objects having flat surfaces because the attractive force is reduced for rough surfaces. An ESC that can handle objects with rough surfaces will expand its applications to MEMS (micro electro mechanical system) or optical parts handling. An ESC consisting of compliant electrostatic inductive fibers which conform to the profile of the surface has been proposed for such use. This paper aims at furthering previous research by observing the attractive force/pressure generated, both theoretically and experimentally, through step-by-step fabrication and analysis. Additionally, how the proposed fiber ESC behaves toward rough surfaces is also observed. The attractive force/pressure of the fiber ESC is theoretically investigated using a robust mechano-electrostatic model. Subsequently, a prototype of the fiber ESC consisting of ten fibers arranged at an angle is employed to experimentally observe its attractive force/pressure for objects with rough surfaces. The attractive force of the surface which is modeled as a sinusoidal wave with various amplitudes is observed, through which the feasibility of a fiber ESC is justified.

Recently, micromanipulation techniques have been in high demand. A technique to deposit a metal microparticle onto a metal substrate by using a single metal probe has been proposed as one of the techniques. A solder particle with a diameter of 20–30 µm, initially adhering to the probe tip, is detached and deposited onto a substrate. The success rate of the particle deposition was 44% in the previous research, and is insufficient for industrial applications. In this paper, a technique of particle deposition by applying a single rectangular pulse is proposed, and the mechanism of the deposition is described. In the mechanism, an electric discharge between the probe and the particle when the particle reaches the substrate plays an important role in the particle deposition. Moreover, the mechanism of the proposed technique is verified by experiments of particle deposition, which are observed using a high-speed camera, a scanning electron microscope (SEM) and an oscilloscope. The success rate of the particle deposition has increased to 93% by the proposed technique. Furthermore, the damage to the particle by the electric discharge is evaluated using an RC circuit model, and the applicability of the proposed technique is discussed.

Recently, micromanipulation techniques for handling a conductive microparticle have been in demand. Electrostatic micromanipulation with a single probe is a promising technique for such manipulation. While the feasibility of the technique has been proved experimentally, the success rate of manipulation was 25%, and further improvements are required. To enhance the success rate and realize highly reliable electrostatic micromanipulation, this paper proposes an improved design of a voltage sequence which is applied to deposit a microparticle onto a substrate plate. It was found through investigation that the error in the evaluated mass of a microparticle must be considered in order to improve the success rate of the manipulation. Behavior of a microparticle during the electrostatic micromanipulation is calculated by a boundary element method, and the influence of error is discussed. An improved design of the applied voltage sequence that can tolerate an error in the evaluated mass is described. Moreover, the effectiveness of the newly designed voltage sequence in the electrostatic micromanipulation is experimentally shown.