Huamao Lin’s research while affiliated with Institute of Microelectronics and other places

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Publications (24)


Optical properties of scandium-doped aluminum nitride thin film for integrated photonics
  • Conference Paper

March 2025

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7 Reads

Nanxi Li

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Wing Wai Chung

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Chengkuo Lee







Fig. 1 (a-d) Illustration of fabricated MOS capacitors. The sample conditions are designated as follows, henceforth: TEMAHf+TMA+H2O (HAH), TEMAHf+TMA+H2O+Ozone (HAHOZ), TEMAHf+TMA+H2O +O2-plasma (HAHOP, control sample) and key process flow of MOS capacitors fabrication. Fig. 2(a), shows the gate leakage density (JG) plotted as a function of VG, which may be used to interpret the HfAlO gate dielectric film quality. Samples that underwent in-situ oxygen (O2) plasma treatment during ALD growth demonstrated significantly improved gate leakage current behavior with no trap-assisted leakage up to the trigger of FN tunneling at 5.8MVcm -1 . The in-situ O2 plasma also showed near-ideal capacitance-voltage (C-V) behavior with low hysteresis and reduced flat-band voltage values, indicating a clear reduction of the interface and bulk trap charges (Fig. 2(b)). Asdeposited, and in-situ ozone treatments are not discussed any further here due to their inferior performance.
Fig. 2 (a) JG -VG for the MOS capacitors (b) Typical Cox-VG double sweep curves of the MOS capacitors (c) JG -VG for the MOS capacitors (control device (HAHOP) w/o PDA and w/PDA in O2 at 800 °C and (d) Typical Cox-VG double sweep curves of the MOS capacitors w/o PDA and w/PDA in O2 at 800 °C gate dielectric(control device HAHOP).
High-K Gate Dielectric for High-Performance SiC Power MOSFET Technology with Low Interface Trap Density, Good Oxide Lifetime (ttddb≥ 10s), and High Thermal Stability (≥ 800 °C)
  • Article
  • Full-text available

August 2024

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183 Reads

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2 Citations

In this work, we demonstrate SiC/high-κ MOS capacitors with low leakage density of 10⁻⁸ Acm⁻², good device uniformity, good thermal stability (> 800 °C), and longer oxide lifetime > 104 s simultaneously. This is enabled by using atomic layer deposition (ALD) processed- HfAlO as the gate dielectric with a thickness of 35 nm, smooth surface (RMS roughness =0.70 nm), and high-quality SiC/ HfAlO interface with interface density (Dit) of 8×1010 eV⁻¹cm⁻².

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Demonstration of 10 nm Ferroelectric Al0.7Sc0.3N-Based Capacitors for Enabling Selector-Free Memory Array

January 2024

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126 Reads

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8 Citations

In this work, 10 nm scandium-doped aluminum nitride (AlScN) capacitors are demonstrated for the construction of the selector-free memory array application. The 10 nm Al0.7Sc0.3N film deposited on an 8-inch silicon wafer with sputtering technology exhibits a large remnant polarization exceeding 100 µC/cm² and a tight distribution of the coercive field, which is characterized by the positive-up-negative-down (PUND) method. As a result, the devices with lateral dimension of only 1.5 μm show a large memory window of over 250% and a low power consumption of ~40 pJ while maintaining a low disturbance rate of <2%. Additionally, the devices demonstrate stable multistate memory characteristics with a dedicated operation scheme. The back-end-of-line (BEOL)-compatible fabrication process, along with all these device performances, shows the potential of AlScN-based capacitors for the implementation of the high-density selector-free memory array.


Citations (9)


... A narrower hysteresis loop reflects minimal charge trapping within the TiO 2 films and at the TiO 2 /Si interface. 21,62 The interface trap density (D it ) was evaluated using the Terman method 63 and the results are presented in Table V. The as-deposited sample exhibits the highest D it value of 22 × 10 12 cm −2 eV −1 , which significantly decreased to 5.5 × 10 12 cm −2 eV −1 after annealing at 525°C. ...

Reference:

Tailoring Sol-Gel Derived Titanium Dioxide Thin Films for Improved Optical and Electrical Performance
High-K Gate Dielectric for High-Performance SiC Power MOSFET Technology with Low Interface Trap Density, Good Oxide Lifetime (ttddb≥ 10s), and High Thermal Stability (≥ 800 °C)

... However, precise determination of the saturated polarization remained challenging due to the high leakage observed in the ultra-thin film. [54][55][56] Next, quasi-DC I-V measurements were conducted to investigate switching performance under slow sweeping conditions. A DC I-V hysteresis measurement was performed on the capacitor, sweeping from 5.2 V to -5.2 V with a 0.025 V step size. ...

Leakage Mechanism of Ferroelectric Al 0.7 Sc 0.3 N Ultra-thin Film
  • Citing Conference Paper
  • July 2023

... Various growth processes and parameters significantly impact the lattice polarity and crystalline quality of FE AlScN thin films, which in turn affect their overall properties. For example, factors such as sputtering power, gas ratio, and substrate choice directly influence key characteristics of the films, including current leakage and P r [55,56]. Early sputtering methods produced FE AlScN thin films with poor quality and little control over lattice polarity, highlighting the need for improved techniques [57]. ...

Ultrathin Pt and Mo films on Al1–Sc N: an Interface Investigation
  • Citing Article
  • July 2023

Applied Surface Science

... Diffraction analyses from bulk regions (Regions 2 and 3, R2 & R3) reveal almost uniform crystalline throughout the film, even at grain boundaries where nitrogen vacancies are prone to accumulate. These optimized fabrication measures effectively suppress oxidation at the interface and nitrogen vacancy formation within the bulk, ensuring superior crystalline and enhanced breakdown characteristics [9], [10]. ...

Oxidation of sputtered AlScN films exposed to the atmosphere
  • Citing Conference Paper
  • October 2022

... This is because the Sc element has a higher O affinity than the Al element. [43] However, there is no obvious enrichment of the O element at the interface. Therefore, the polarity reversal and the formation of the buffer layer are not the effects of O element. ...

Oxide overlayer formation on sputtered ScAlN film exposed to air
  • Citing Article
  • September 2022

... 30 However, sputtered films are typically polycrystalline, with broad x-ray diffraction (XRD) peaks. [31][32][33] Epitaxial growth of wurtzite ScAlN via MBE and MOCVD offers superior control over phase purity, composition, crystallinity, defect density, doping concentration, unintentional impurity incorporation, bandgap engineering, polarization, and lattice polarity compared to sputtering. 17,[34][35][36][37] In 2017, Hardy et al. reported the first MBE-grown ScAlN on GaN and SiC substrates. ...

Texture evolution of ferroelectric AlScN films on metal under-layers
  • Citing Conference Paper
  • June 2022