September 2024
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38 Reads
Several practical problems require high thermal resistance and minimum compliance. An example is a high-temperature computer-controlled stage for additive manufacturing, which must be heated and precisely positioned. In this case, the heat transfer from the build plate must be limited to minimize the heating of the computer-controlled stage. The simplest option, supporting the build plate using low thermal conductivity risers, introduces a tradeoff between the heat transfer to the stage and the mechanical stiffness of the system. We explore an alternative using the concept of tensegrity, a term coined by Buckminster Fuller for structures that are separated only by members in tension. Other objects can be loaded under compression or bending. Because the tensile members can be very slender (for example stainless steel cabling) the overall thermal resistance can be reduced while increasing the mechanical stiffness. We present a solution to a specific problem including practical fabrication considerations and design for manufacturability. We then generalize the design of tensegrity structures to high-temperature thermal applications. Besides the additive manufacturing system, the concept of thermal tensegrity has applications to furnace or kiln design and even connecting high-temperature aircraft skins to structural elements.