Dongxiang Wu’s research while affiliated with State University of New York and other places

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Publications (31)


Oscillatory redox behavior in oxides: Cyclic surface reconstruction and reactivity modulation via the Mars-van Krevelen mechanism
  • Article

June 2025

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19 Reads

Proceedings of the National Academy of Sciences

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Dongxiang Wu

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Jianyu Wang

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The breaking of translational symmetry at oxide surfaces gives rise to coordinatively unsaturated cations/anions and surface restructuring—key factors that govern surface reactivity. Using direct in situ environmental transmission electron microscopy (TEM) observations along with atomistic modeling, we report oscillatory redox behavior in CuO under H 2 , where cyclic surface reconstruction and reactivity modulation occur via the Mars–van Krevelen (MvK) mechanism. We observe self-switching between oxygen-rich and oxygen-deficient surface reconstructions, alternately activating and deactivating the surface for H 2 O formation. During periods of chemical inactivity, the oxygen-deficient surface undergoes slow reoxidation via lattice oxygen diffusing from subsurface and bulk reservoirs, restoring the active oxygen-rich surface termination. The inherent disparity in chemical activity among undercoordinated surface ions, along with sluggish subsurface-to-surface oxygen replenishment, drives this oscillatory redox cycle, modulating H 2 -induced loss of lattice oxygen at the surface and its delayed replenishment from the subsurface. This creates spatiotemporally separated redox steps at the oxide surface. The phenomena and atomistic insights presented here have significant implications for manipulating the surface reactivity of oxides by tuning the separation of these redox steps.


Fig. 1 | In situ gas-and liquid-phase TEM setup. a Thin-window cell specimen holder. b Differentially pumped TEM system.
Fig. 2 | Intermittent transformation of c(6×2)-O to Cu 2 O on Cu(110). a-e Time-sequence HRTEM images illustrating stop-and-go step growth of a monoatomic Cu 2 O layer at 623 K and ~1 × 10 −3 Pa O 2 . The Cu 2 O growth front pauses intermittently (~1 to 4 s) at isolated Cu columns within the c(6×2)-O terrace. Inset in (a): zoomed-in HRTEM image with the overlaid atomic structure of the Cu 2 O growth front. The yellow dashed circle represents a Cu vacancy beneath an isolated Cu column in the c(6×2)-O reconstruction. Cyan, yellow, gray, and red balls represent substrate Cu, Cu in Cu 2 O, Cu in c(6×2)-O, and O, respectively. Inset in (e): image intensity profile along the yellow dashed line, showing the periodic undulations of the Cu 2 O layer. Pseudo color is applied to the Cu 2 O layer for clarity. f Distance-time plot from in situ HRTEM imaging, showing the stop-and-go movement of the Cu 2 O growth front. Adapted from 68 Copyright @2024 American Physical Society.
Fig. 3 | Unidirectional CuO growth during Cu oxidation. a Cross-sectional SEM image illustrating the layered morphology of oxidized Cu at 673 K and ~2 × 10 4 Pa O 2 for 2 h. b TEM image of a CuO whisker with a bicrystal grain boundary along its axis. c HRTEM image revealing the atomic structure of the bicrystal grain boundary. d-l In situ HRTEM imaging of CuO tip growth at 673 K under 0.5 Pa O 2 . d Stepterrace configuration at the CuO whisker tip with the bicrystal boundary marked by green dashed lines. e Schematic illustrating Cu ion transport along the grain boundary to the tip. f Step-flow growth of atomic planes on the left terrace, starting from the bicrystal boundary corner, with the green dashed line indicating the initial configuration from (d). g Locally accelerated oxide growth (protrusion) at the grain boundary, marked by yellow arrows. h-l Repeated nucleation and step-flow growth of CuO atomic layers on the right terrace of the whisker tip. Adapted from 91 Copyright @2019 Wiley.
Fig. 5 | H 2 O-vapor induced passivation of Al surfaces. a-g Time-sequence HRTEM images showing the growth of the Al(OH) 3 /Al 2 O 3 bilayer film on Al(111) at 298 K and ~5 × 10 −3 Pa H 2 O. The solid white lines indicate weakened lattice contrast due to Al atom extraction from the surface during H 2 O adsorption. In (g), the white line overlays the Al 2 O 3 /Al(111) interface profile at t = 65.4 s from (d). Insets in (b, g) show simulated HRTEM images of the Al lattice with vacancies (b) and the Al(OH) 3 structure (g). h Schematic of the Al(OH) 3 /Al 2 O 3 bilayer structure. i Time dependence of Al(OH) 3 /Al 2 O 3 bilayer thickness (green) and displacement of the Al 2 O 3 /Al(111) interface (black). j-o Time-sequence HRTEM images of Al(OH) 3 /Al 2 O 3 bilayer growth on a stepped Al surface at 298 K and ~5 × 10 −5 mbar H 2 O. The white dotted rectangles in (j-l) highlight the disordering of the stepped facet before Al(OH) 3 formation. Dashed yellow and solid blue lines in (d-g, m-o) indicate the Al(OH) 3 / Al 2 O 3 and Al 2 O 3 /Al(111) interfaces, respectively, with pseudo yellow and blue colors representing the Al(OH) 3 and Al 2 O 3 layers. Adapted from 42 Copyright @2023 The Authors. Published by AAAS.
Fig. 7 | Corrosion of Sn nanocrystals in an aqueous salt chloride solution. a Sequential TEM images illustrating the etching process of a Sn nanocrystal in a thick liquid layer under an electron dose rate of 7470 e − Å −2 s −1 . b Sequential HRTEM images capturing the corrosion of a Sn nanocrystal in a thin liquid region at a higher electron dose rate of 12000 e − Å −2 s −1 . c Contours of the Sn nanocrystal surfaces at the initial stage (0.0-13.8 s) and (d) at a later stage (20.0-33.0 s) during the corrosion process shown in (b). The colors represent the time sequence, with blue indicating the initial time and red representing the later time. e Enlarged view of representative images from panel (b), highlighting key stages of the corrosion process. Adapted from 191 Copyright @2024 American Chemical Society.

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In situ electron microscopy: atomic-scale dynamics of metal oxidation and corrosion
  • Article
  • Full-text available

March 2025

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56 Reads

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1 Citation

npj Materials Degradation

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Intermittent oxidation kinetics and metal/oxide interfacial undulation

August 2024

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34 Reads

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1 Citation

The phenomenon of oxygen adsorption induced surface restructuring is widespread across various metal-oxygen systems, yet its impact on initiating bulk oxide formation remains largely unexplored. Through in situ atomic-resolution electron microscopy observations of surface oxidation of Cu(110) and Cu85Au15(110), we unveil intermittent oxide-film growth modulated by oxygen-induced surface restructuring. This modulation is evidenced by repeated pinning of the Cu2O growth front at isolated Cu columns of the c(6×2)-O reconstruction, owing to required long-range diffusion of Cu and O atoms to the Cu2O growth front. We reveal that Cu vacancies, generated at the Cu2O growth front, are injected into the Cu2O/Cu interface, inducing hill and valley undulation of the Cu2O film. In contrast, atomic vacancies produced during the Cu85Au15(110) oxidation preferentially migrate into interfaces between Au-rich and Au-poor regions in the bulk, resulting in a flat and adherent Cu2O film. These findings demonstrate the critical role of oxygen-induced surface restructuring in modulating oxide film growth kinetics and the manipulability of the fate of injected vacancies by alloying, thereby offering insights applicable to a broader range of metal-oxygen systems for fine-tuning oxidation kinetics and enhancing oxide/metal interfacial adhesion.


Identification of suboxides from CuO reduction in H2. a) HRTEM image of the CuO formed from Cu oxidation at 400°C and pO2 = 0.5 Pa, viewed along the [1¯1¯1¯]$[ {\bar{1}\bar{1}\bar{1}} ]$ zone axis. Overlaid onto the HRTEM image is the stoichiometric CuO structure model viewed along the [1¯1¯1¯]$[ {\bar{1}\bar{1}\bar{1}} ]$ direction (upper panel) and simulated HRTEM image (lower panel) based on the CuO structure. b) Diffractogram of the HRTEM image in (a), where all the diffraction spots can be indexed with CuO in the [1¯1¯1¯]$[ {\bar{1}\bar{1}\bar{1}} ]$ zone axis. c) HRTEM image showing the formation of the suboxides of Cu2O (the top layer) and CuO superlattice (the intermediate layer, denoted as m‐Cu4O3) after the CuO reduction at 300 °C in 0.5 Pa of H2 gas. d) Diffractogram of the HRTEM image in (c), where the spots corresponding to Cu2O, m‐Cu4O3, and CuO are marked in cyan, orange, and red, respectively. e) Zoom‐in HRTEM image of the m‐Cu4O3 layer. Inset is a simulated HRTEM image based on the DFT‐optimized structure model of m‐Cu4O3 in (f). g) Intensity profiles drawn along the dashed orange and purple arrows in (e). h) Truncated‐bulk Cu‐O termination of the Cu2O(32¯1¯)$( {3\bar{2}\bar{1}} )$ surface. i) Zig‐zag configuration of the Cu‐O‐terminated Cu2O(32¯1¯)$( {3\bar{2}\bar{1}} )$ surface after removing the under‐coordinated Cu atoms marked by red circles in (h). j) Truncated‐bulk Cu2O(11¯0)$( {1\bar{1}0} )$. Red, grey, and blue balls represent O, O vacancy, and Cu, respectively. Scale bar: 1 nm (a) and (c); 0.5 nm (e).
DFT modeling of the phase transfromation pathways in CuO. a–d) Atomic models showing the energetically favorable sequential pathway of O loss via DFT calculations of O vacancy formation energies. e) Cu2O supercell derived from the CuO reduction. f) DFT‐optimized Cu2O/m‐Cu4O3 interface structure used for HRTEM image simulation in (g) and its comparison to the experimental HRTEM image in (h). Insets are intensity profiles along the yellow and blue dashed lines in (g) and (h), respectively. Red, grey, and blue balls represent the O atom, O vacancy, and Cu atom, respectively. Scale bar: 1 nm (h).
Coordinated multi‐interface migration and resulting thickness evolution of the interfacial layers during the exposure of CuO at 300 °C to 0.5 Pa of H2 gas flow. a‐e) Time‐lapse HRTEM images from Movie S2 (Supporting Information) showing the inward migration of the H2/Cu2O, Cu2O/m‐Cu4O3, and m‐Cu4O3/CuO interfaces toward the CuO side. The orange circles mark the number of atomic layers in the intermediate m‐Cu4O3 layer. t0 represents the starting time of the image sequence. All the in situ HRTEM images are drift‐corrected. f) Thickness evolution of the top Cu2O and intermediate m‐Cu4O3 layers extracted from Movie S2 (Supporting Information), showing that the thickness of the Cu2O layer remains relatively constant whereas the m‐Cu4O3 layer grows gradually thicker. The shaded error bands in (f) represent the standard deviation of uncertainty due to multiple measurements. Scale bar in (a–e), 2 nm.
Varied reaction fronts leading to the multiple interface migration during the exposure of CuO at 300 °C to 0.5 Pa of H2 gas flow. a‐j) Time‐sequence HRTEM images (Movie S3, Supporting Information) showing the inward shrinkage of the hill‐and‐valley rough H2/Cu2O interface and coordinated inward migration of the diffuse Cu2O/m‐Cu4O3 interface, where the m‐Cu4O3 → Cu2O transformation occurs at random locations of the interface. By contrast, the m‐Cu4O3/CuO interface has a ledge‐and‐terrace configuration and the CuO → m‐Cu4O3 transformation occurs via the lateral flow of monoatomic‐height ledges (tracked by cyan arrows 1 to 7) along the interface. The green lines in (j) are the superimposed trace of the position and profile of the H2/Cu2O, Cu2O/m‐Cu4O3, and m‐Cu4O3/CuO interfaces at t0 in (a), showing the inward movement of all the three interfaces toward the CuO side. t0 represents the starting time of the image sequence. All the in‐situ HRTEM images are drift‐corrected. k) Measured ledge positions versus time for seven independent monoatomic ledges (marked in (a–j)) along the m‐Cu4O3/CuO interface, the solid lines correspond to a linear fit to the experimental data points. The shaded error bands in (k) represent the standard deviation of uncertainty due to multiple measurements. Scale bar, 1 nm in (a–j).
Atomic process underlying the Cu2O/m‐Cu4O3/CuO layered structure formation on CuO(3¯12)$( {\bar{3}12} )$. a,b) Atomic models of the Cu2O/m‐Cu4O3 and CuO/m‐Cu4O3 interfaces used for calculating the O vacancy formation energy at the different interface sites labeled by a1‐a6 and b1‐b4. c) Schematic illustration of the multi‐interface transformation and migration: i. Reaction of adsorbed H2 molecules with lattice O at the H2/Cu2O interface results in the formation of H2O molecules that desorb from the surface, leaving behind O vacancies; ii. Inward migration of the O vacancies toward the Cu2O/m‐Cu4O3 interface is accompanied with an outward flux of lattice O to the Cu2O surface, where the similar reactivity of the interface sites for vacancy‐O exchanges results in the random inward motion of the Cu2O/m‐Cu4O3 interface upon the m‐Cu4O3 → Cu2O transformation; iii. O vacancies diffuse further to the inner CuO/m‐Cu4O3 interface, where the higher reactivity of the interface ledges for vacancy‐O exchanges leads to the ledge flow of the CuO → m‐Cu4O3 transformation. Red, grey, blue, and green balls represent O, O vacancy, Cu, and H, respectively.
Atomic Dynamics of Multi‐Interfacial Migration and Transformations

November 2023

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141 Reads

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3 Citations

Redox‐induced interconversions of metal oxidation states typically result in multiple phase boundaries that separate chemically and structurally distinct oxides and suboxides. Directly probing such multi‐interfacial reactions is challenging because of the difficulty in simultaneously resolving the multiple reaction fronts at the atomic scale. Using the example of CuO reduction in H2 gas, a reaction pathway of CuO → monoclinic m‐Cu4O3 → Cu2O is demonstrated and identifies interfacial reaction fronts at the atomic scale, where the Cu2O/m‐Cu4O3 interface shows a diffuse‐type interfacial transformation; while the lateral flow of interfacial ledges appears to control the m‐Cu4O3/CuO transformation. Together with atomistic modeling, it is shown that such a multi‐interface transformation results from the surface‐reaction‐induced formation of oxygen vacancies that diffuse into deeper atomic layers, thereby resulting in the formation of the lower oxides of Cu2O and m‐Cu4O3, and activate the interfacial transformations. These results demonstrate the lively dynamics at the reaction fronts of the multiple interfaces and have substantial implications for controlling the microstructure and interphase boundaries by coupling the interplay between the surface reaction dynamics and the resulting mass transport and phase evolution in the subsurface and bulk.


Atomistic mechanisms of water vapor–induced surface passivation

November 2023

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140 Reads

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15 Citations

Science Advances

The microscopic mechanisms underpinning the spontaneous surface passivation of metals from ubiquitous water have remained largely elusive. Here, using in situ environmental electron microscopy to atomically monitor the reaction dynamics between aluminum surfaces and water vapor, we provide direct experimental evidence that the surface passivation results in a bilayer oxide film consisting of a crystalline-like Al(OH) 3 top layer and an inner layer of amorphous Al 2 O 3 . The Al(OH) 3 layer maintains a constant thickness of ~5.0 Å, while the inner Al 2 O 3 layer grows at the Al 2 O 3 /Al interface to a limiting thickness. On the basis of experimental data and atomistic modeling, we show the tunability of the dissociation pathways of H 2 O molecules with the Al, Al 2 O 3 , and Al(OH) 3 surface terminations. The fundamental insights may have practical significance for the design of materials and reactions for two seemingly disparate but fundamentally related disciplines of surface passivation and catalytic H 2 production from water.


Atomically visualizing cyclic self-refreshing of gas- oxide interfaces

February 2023

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204 Reads

Surface-induced breaking of translation symmetry of a crystalline oxide results in various types of coordinately unsaturated cations/anions and surface restructuring , yet identifying the stability, functionality and activity of the coordinated unsaturated sites of gas-oxide interfaces remains challenging owing to their dynamic behaviors in reacting gas and temperature environments and issues with current characterization tools. Through direct in-situ transmission electron microscopy observations and atomistic modeling, here we report cyclic self-refresh between oxygen-rich and oxygen-deficient surface reconstructions of CuO in H 2 that are chemically active and inactive for H2O formation, respectively. After a period of chemical inactivity, the oxygen-deficient surface re-oxidizes back to the oxygen-rich termination due to the outward diffusion of lattice oxygen from the subsurface. This cyclic surface refresh is intrinsically induced by the disparity in chemical activity of undercoordinated surface atoms in modulating H 2 -induced loss of lattice oxygen at the surface and subsequent oxygen replenishment from the subsurface, which results in spatiotemporally separated redox reaction steps at the oxide surface. The atomistic mechanism has significant implications in manipulating the surface reactivity of oxides by tuning this separation of the redox steps at oxide surfaces.




Formation of mismatch dislocations at the Cu2O/Cu interface
a, HRTEM image of a Cu2O/Cu interface formed by in situ oxidation of a Cu(110) facet at pO2\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$${p}_{{{\rm{O}}}_{2}}$$\end{document} = 0.67 Pa and T = 623 K. The core regions of four mismatch dislocations along the Cu2O/Cu interface (green dashed line) are marked with crosses. Inset: diffractogram of the HRTEM image. The yellow and red circles mark the (200) spots of Cu and Cu2O, respectively. b, In-plane strain map (εxx) obtained by GPA of the HRTEM image in a. c,d, Experimental (c) and simulated (d) HRTEM micrographs showing the dislocation core structure, where the Burgers circuits are marked by white lines. e, DFT relaxed Cu2O(110)/Cu(110) interface structure used for HRTEM simulations in d. f, HAADF-STEM image of a typical mismatch dislocation. Scale bars, 1 nm (a) and 0.5 nm (c,d,f).
In situ TEM visualization of the stop-and-go ledge flow of the Cu2O → Cu interfacial transformations at 623 K and 5.3 Pa of H2 gas
a–d, Time-sequence HRTEM images showing the Cu2O → Cu transformation along the Cu2O(110)/Cu(110) interface (Supplementary Video 1). Arrows 1 and 2 mark the Cu2O/Cu interfacial ledges. Between c and d, the e-beam was blanked for about 60 s to eliminate possible electron-beam effects on the interfacial transformation and then unblanked for TEM imaging. The dark red, red, orange and yellow dashed lines show the traces of the surface contour of the oxide at 0 s (a), 10.5 s (b), 21 s (c) and 102 s (d), respectively. e, Distance–time plot measured from Supplementary Video 1 showing the lateral flow of ledges 1 and 2 in a stop-and-go manner. f–i, Time-sequence TEM images (Supplementary Video 2) showing the Cu2O → Cu transformation along the Cu2O(100)/Cu(100) interface. Arrows 3 and 4 mark the lateral flow of the Cu2O/Cu interfacial ledges. j, Distance–time plot measured from Supplementary Video 2 showing the stop-and-go flow of ledges 3 and 4. Insets in a–d and g–i show schematically the ledge-flow transformation at the Cu2O/Cu interface. Inset in f is a zoom-in HRTEM image of the Cu2O/Cu interface region. Scale bars, 2 nm (a–d) and 5 nm (f–i).
In situ atomic-scale observations of the intermittent ledge flow regulated by mismatch dislocations during the Cu2O → Cu interfacial transformations at 623 K and 5.3 Pa of H2 gas flow
a–e, Time-sequence HRTEM images (Supplementary Video 3) showing the regular interruption of the lateral flow of a double-atomic-height ledge along the Cu2O(110)/Cu(110) interface, where the ledge is pinned for about 2–6 s at the core of each dislocation and then resumes its lateral migration. f, Plot showing the dwell time of the interfacial ledges at the core of dislocations along the Cu2O(110)/Cu(110) interfaces. g–k, Time-sequence HRTEM images (Supplementary Video 4) showing the periodic pauses of monoatomic ledges at the core of the mismatch dislocations along the Cu2O(100)/Cu(100) interface, where the ledge is pinned for about 0.5–1.5 s at the dislocation cores and then resumes its lateral migration. The yellow arrows point to the location of the interfacial ledges. l, Plot of the dwell time of the interfacial ledges at the core of dislocations along the Cu2O(100)/Cu(100) interfaces. The yellow dashed lines mark the Cu2O/Cu interface and the yellow arrows point to the locations of the interfacial ledges. The core regions of the mismatch dislocations along the Cu2O/Cu interface in a–e and g–k are marked with white 'T's and red crosses. Scale bars, 1 nm (a–e,g–k).
DFT modelling of the stop-and-go Cu2O → Cu interfacial transformations
a,b, Upon sequential removal of the interfacial lattice O (red circles), adjacent Cu shifts spontaneously towards the vacated O, as indicated by the small black arrows in a, resulting in two Cu-vacancy columns (blue dashed circles in b). In turn, the dislocation glides to a pink solid ‘T’ from the original position (a red dashed ‘T’ in b). The inset in b is a HAADF-STEM image of the Cu2O/Cu(110) interface, showing the pinning of a double-atomic-height interfacial ledge at the dislocation core. The intensity profile along the red dashed rectangle shows relatively dimmed intensity of the ledge atom column owing to the presence of atomic vacancies. c, On filling up the two Cu-vacancy columns with extra Cu atoms (blue balls), the dislocation climbs spontaneously from pink dashed ‘T’ to the black solid ‘T’. d, Evaluating the system energy as a function of the distance of a Cu vacancy from the Cu2O/Cu interface by one (site 1), three (site 2) and five (site 3) atomic spacings in the Cu bulk. e, System energy plot as a function of the Cu-vacancy site shown in d. f, Schematic showing an edge dislocation in the Cu bulk acting as a source of Cu atoms to fill up the Cu vacancies for the mismatch dislocation climb in front of the interfacial ledge. g, Time-sequence HRTEM images (Supplementary Video 5) showing the glide and positive climb of an edge dislocation in the Cu bulk during the Cu2O reduction. h, Schematic showing the stop-and-go transformation kinetics induced by the dislocation lines parallel to the interfacial ledge; the lateral flow of the interfacial ledge is pinned at the dislocation core until the dislocation line climbs to the upper terrace (Supplementary Video 7). Scale bars, 0.5 nm (inset in b, and g).
Dislocation-induced stop-and-go kinetics of interfacial transformations

July 2022

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412 Reads

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100 Citations

Nature

Most engineering materials are based on multiphase microstructures produced either through the control of phase equilibria or by the fabrication of different materials as in thin-film processing. In both processes, the microstructure relaxes towards equilibrium by mismatch dislocations (or geometric misfit dislocations) across the heterophase interfaces1–5. Despite their ubiquitous presence, directly probing the dynamic action of mismatch dislocations has been unachievable owing to their buried nature. Here, using the interfacial transformation of copper oxide to copper as an example, we demonstrate the role of mismatch dislocations in modulating oxide-to-metal interfacial transformations in an intermittent manner, by which the lateral flow of interfacial ledges is pinned at the core of mismatch dislocations until the dislocation climbs to the new oxide/metal interface location. Together with atomistic calculations, we identify that the pinning effect is associated with the non-local transport of metal atoms to fill vacancies at the dislocation core. These results provide mechanistic insight into solid–solid interfacial transformations and have substantial implications for utilizing structural defects at buried interfaces to modulate mass transport and transformation kinetics. Environmental transmission electron microscopy is used to reveal that mismatch dislocations modulate the interfacial transformation of copper oxide to copper metal in an intermittent manner.


Citations (18)


... However, the advent of environmental TEM has opened new avenues for bridging this knowledge gap, allowing for atomic-scale imaging of reaction dynamics at gas-solid interfaces. In situ TEM imaging comparing the oxidation of Cu (110) and Cu 85 Au 15 (110) 68 reveals that injected vacancies can be directed to deeper regions within the alloy. This reduces metal/oxide interfacial cavitation and improves oxide layer adhesion. ...

Reference:

In situ electron microscopy: atomic-scale dynamics of metal oxidation and corrosion
Intermittent oxidation kinetics and metal/oxide interfacial undulation
  • Citing Article
  • August 2024

... In situ E-TEM experiments were performed using a dedicated E-TEM system equipped with an objective-lens aberration corrector and a gas manifold for controlling gas pressure in the specimen area. CuO was prepared by thermally oxidizing high-purity Cu foils in O 2 within the E-TEM, followed by reduction through switching the gas environment to H 2 (28)(29)(30)(31). ...

Atomic Dynamics of Multi‐Interfacial Migration and Transformations

... This structural compatibility reduces nucleation energy barriers and favors lattice matching during initial growth, as the θ-phase requires smaller atomic rearrangements compared to the α-phase. Consequently, θ-Al 2 O 3 preferentially forms during the early oxidation stages at TBC interfaces, as illustrated by the lattice structure schematic in Figure 7. Water vapor exposure facilitates H2O dissociation into H + and OH − on oxide surfaces with OH − further decomposing to release O 2− for oxide growth [41][42][43][44][45][46]. Meanwhile, H diffuses into the oxide lattice, altering vacancy formation and atomic migration (Figure 7 As shown in Table 2, H + significantly reduces the Al and O vacancy formation energies i both θ-and α-Al2O3. ...

Atomistic mechanisms of water vapor–induced surface passivation

Science Advances

... The reducibility of the CuO is then comparatively examined by flowing H 2 and CO gases in the reaction chamber at the gas pressure of ~1 Torr. The details for XPS data acquisition and analysis can be found from previous studies (29,49,(62)(63)(64). ...

Effect of surface segregation on the oxidation resistance of Cu 3 Pt ( 100 )
  • Citing Article
  • February 2022

Physical Review Materials

... In situ E-TEM experiments were performed using a dedicated E-TEM system equipped with an objective-lens aberration corrector and a gas manifold for controlling gas pressure in the specimen area. CuO was prepared by thermally oxidizing high-purity Cu foils in O 2 within the E-TEM, followed by reduction through switching the gas environment to H 2 (28)(29)(30)(31). ...

Dislocation-induced stop-and-go kinetics of interfacial transformations

Nature

... In Pnma -type CaH 2 , doping with La leads to the formation of fluorite-type Ca 0.84 La 0.16 H 2.12 near the melting point of CaH 2 , suggesting disordering similar to surface melting ( 49 ). Furthermore, the surface melting or amorphization has also been observed in aluminum oxidation reactions during MD simulations with a ReaxFF potential ( 50 ). This phenomenon was confirmed by in situ TEM observations due to the slow kinetics of the reaction. ...

Passive Oxide Film Growth Observed On the Atomic Scale

... This process leads to the formation of atomic vacancies in the topmost layer, as shown by the simulated HRTEM image (inset in Fig. 5b). The H 2 O adsorption-induced extraction of surface atoms aligns with the results from surface science experiments and atomistic simulations, which indicate that the dissociative adsorption of gas molecules on metallic surfaces typically results in one-atomic-layer-deep pits and adatoms removed from the metal surface 65,126,127 . The exfoliation of the outermost Al results in the hydroxylation of the two inner atomic layers, causing the interplanar spacing to expand from 2.3 Å in the pristine Al(111) lattice (Fig. 5a) to~3.2 ...

Atomistic mechanisms of the initial oxidation of stepped Cu 3 Au ( 100 )
  • Citing Article
  • February 2022

... The narrow reduction peaks and an autocatalysis effect are expected for the catalysts with the participation of the noble metals as active components. However, there are a number of works showing that autocatalytic reduction can also be characteristic of catalysts containing non-noble metals [70][71][72]. As a rule, oxide forms of non-noble metals should have non-stoichiometricity, small particle sizes, and high defect concentration, including vacancies on the surface, which finally induces the formation of reducible oxygen. ...

Atomic Origin of the Autocatalytic Reduction of Monoclinic CuO in a Hydrogen Atmosphere

The Journal of Physical Chemistry Letters

... XRD reflexes can be well identified by the disordered Au-Cu phase, which is in accordance with the fact that the dewetting temperature (850 ℃) locates in the disordered phase region of the Au-Cu phase diagram [30]. Although Au surface segregation has been reported in Au-Cu alloy after annealing in a reductive environment, such segregation can be only observed within several atom layers on the outermost surface [38][39][40]. Considering the high O 2 partial pressure used here, the role of Au surface segregation at atomic scale on the Cu oxidation is negligible. Therefore, the disordered Au-Cu nanoparticles fabricated here are believed to have uniform Au/Cu composition and they will be used as precursors for the following oxidation treatments. ...

Effect of surface steps on chemical ordering in the subsurface of Cu(Au) solid solutions
  • Citing Article
  • January 2021

... Historically, significant research has focused on the oxidation behavior of NiAl and similar alloys in environments containing oxidizing gases such as O 2 , CO 2 , and H 2 O vapor. These gases are well known to promote the formation of protective oxide scales-most notably α-Al 2 O 3 -which inhibit further oxidation and contribute to the long-term stability of these materials in high-temperature applications [9][10][11][12]. As such, the prevailing focus has been on characterizing oxidation kinetics, oxide scale adhesion, and long-term stability under oxidizing conditions [13][14][15][16]. ...

Non-compact oxide-island growth induced by surface phase transition of the intermetallic NiAl during vacuum annealing
  • Citing Article
  • December 2020

Acta Materialia