Deji Akinwande’s research while affiliated with University of Texas at Austin and other places

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Publications (408)


Non‐Volatile Resistive Switching in Nanoscaled Elemental Tellurium by Vapor Transport Deposition on Gold (Adv. Sci. 1/2025)
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January 2025

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Yoonseok Lee

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The schematic diagram and analysis data for ferroelectric junctions with α‐In2Se3 nanosheet. a) The schematic diagram of the structure with Au/α‐In2Se3/Au in a planar configuration. b) Optical image of the ferroelectric device. c) AFM analysis of the device with the α‐In2Se3 nanosheet thickness ≈170 nm. d) Raman shifts and e) PL of the α‐In2Se3 nanosheet. f) PFM analysis of the α‐In2Se3 nanosheet in IP direction.
The schematic image and electrical characteristics of α‐In2Se3 ferroelectric junctions. a) Ferroelectric properties of α‐In2Se3 with the direction of OOP and IP polarization. b) The I‐V curve of the ferroelectric junction device in the planar structure shown in Figure 1. c) The operating mechanism of the ferroelectric device. d) Endurance of DC 100 cycles.
The I‐V curve and on/off ratio of α‐In2Se3 ferroelectric device with varying SiO2 thickness. The I‐V curve of the ferroelectric device with SiO2 thickness around a) 0 nm, b) 2 nm, c) 3 nm, and d) 5 nm. e) The statical variations of the ION/OFF ratio of the ferroelectric device with a difference of SiO2 thickness. f) The operating voltages with SiO2 thickness.
The schematic diagram and analysis data for ferroelectric junctions with 3 nm of SiO2. a) The schematic diagram of the Au/α‐In2Se3/SiO2/Au planar structure. b) Optical image of the ferroelectric device. c) AFM analysis of the device shows the α‐In2Se3 nanosheet thickness of ≈100 nm. d) Electrical properties of the ferroelectric device below coercive voltage and e) above coercive voltage. f) Endurance test results showing 53rd DC cycles.
Illustration and synaptic plasticity of the ferroelectric synaptic junction. a) Illustration of the ferroelectric device and pre‐ and post‐synapse. The synaptic plasticity with ferroelectric junction, including b) PPF property, c) forgetting curve, and d) LTP and LTD.

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Enhanced Synaptic Memory Window and Linearity in Planar In2Se3 Ferroelectric Junctions

December 2024

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86 Reads

A synaptic memristor using 2D ferroelectric junctions is a promising candidate for future neuromorphic computing with ultra‐low power consumption, parallel computing, and adaptive scalable computing technologies. However, its utilization is restricted due to the limited operational voltage memory window and low on/off current (ION/OFF) ratio of the memristor devices. Here, it is demonstrated that synaptic operations of 2D In2Se3 ferroelectric junctions in a planar memristor architecture can reach a voltage memory window as high as 16 V (±8 V) and ION/OFF ratio of 10⁸, significantly higher than the current literature values. The power consumption is 10⁻⁵ W at the on state, demonstrating low power usage while maintaining a large ION/OFF ratio of 10⁸ compared to other ferroelectric devices. Moreover, the developed ferroelectric junction mimicked synaptic plasticity through pulses in the pre‐synapse. The nonlinearity factors are obtained 1.25 for LTP, −0.25 for LTD, respectively. The single‐layer perceptron (SLP) and convolutional neural network (CNN) on‐chip training results in an accuracy of up to 90%, compared to the 91% in an ideal synapse device. Furthermore, the incorporation of a 3 nm thick SiO2 interface between the α‐In2Se3 and the Au electrode resulted in ultrahigh performance among other 2D ferroelectric junction devices to date.


Switchable Photovoltaic Effect Induced by Light Intensity

December 2024

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65 Reads

ACS Nano

Photovoltaic devices capable of reversible photovoltaic polarity through external signal modulation may enable multifunctional optoelectronic systems. However, such devices are limited to those induced by gate voltage, electrical poling, or optical wavelength by using complicated device architectures. Here, we show that the photovoltaic polarity is also switchable with the intensity of incident light. The modulation in light intensity induces photovoltaic polarity switching in geometrically asymmetric MoS2 Schottky photodiodes, explained by the asymmetric lowering of the Schottky barrier heights due to the trapping of photogenerated holes at the MoS2/Cr interface states. An applied gate voltage can further modulate the carrier concentration in the MoS2 channel, providing a method to tune the threshold light intensity of polarity switching. Finally, a bidirectional optoelectronic logic gate with “AND” and “OR” functions was demonstrated within a single device.



Understanding and predicting adsorption energetics on monolayer transition metal dichalcogenides

October 2024

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52 Reads

Two-dimensional (2D) transition metal dichalcogenides (TMDs) have recently been shown to demonstrate non-volatile resistive switching (NVRS), offering significant advantages such as high-density integration and low energy consumption due to their atomic-scale thinness. In this study, we focus on the adsorption and desorption of metal adatoms, which can modulate the electrical resistivity by several orders of magnitude. We develop material-based relationships of the adsorption energy with electronic and atomic structure descriptors by examining the effects of various transition-metal adsorbates on the surface of TMDs. Our results reveal that adsorption energies of transition metals exhibit consistent trends across different TMDs (MoS2_2, MoSe2_2, WS2_2, WSe2_2) and can be explained using simple descriptors of the atomic and electronic structure. We propose several models to describe this adsorption process, providing a deeper understanding of a crucial step in the resistive switching mechanism based on formation and dissolution of point defects. Finally, we connect our computed adsorption energies to the switching energy. These findings will help guide rational materials selection for the development of NVRS devices using 2D TMDs.


Skin Controlled Electronic and Neuromorphic Tattoos

October 2024

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84 Reads

Wearable human activity sensors developed in the past decade show a distinct trend of becoming thinner and more imperceptible while retaining their electrical qualities, with graphene e-tattoos, as the ultimate example. A persistent challenge in modern wearables, however, is signal degradation due to the distance between the sensor's recording site and the signal transmission medium. To address this, we propose here to directly utilize human skin as a signal transmission medium as well as using low-cost gel electrodes for rapid probing of 2D transistor-based wearables. We demonstrate that the hypodermis layer of the skin can effectively serve as an electrolyte, enabling electrical potential application to semiconducting films made from graphene and other 2D materials placed on top of the skin. Graphene transistor tattoos, when biased through the body, exhibit high charge carrier mobility (up to 6500 2V-1s-1), with MoS2 and PtSe2 transistors showing mobilities up to 30 cm2V-1s-1 and 1 cm2V-1s-1, respectively. Finally, by introducing a layer of Nafion to the device structure, we observed neuromorphic functionality, transforming these e-tattoos into neuromorphic bioelectronic devices controlled through the skin itself. The neuromorphic bioelectronic tattoos have the potential for developing self-aware and stand-alone smart wearables, crucial for understanding and improving overall human performance.


Triangle and hexagonal shapes of hexagonal boron nitride (hBN) islands on Cu(111) substrates
a–c Atomic illustrations of the triangle-shaped hBN island with all N-terminated edges (a), and the hexagonal-shaped hBN island with the same number of N- and B-terminated edges (c).
Oxygen-assisted growth of hexagonal-shaped hBN on Cu(111)
a, b False-color scanning electron microscopy (SEM) images of as-grown hBN on Cu(111) foils with triangular (a) and hexagonal islands (b). c SEM image of as-grown well-aligned hexagonal-shaped hBN islands on the Cu(111) substrate. d, e Raman maps of the CuOx intensity (ICuOx\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$I_{{{{\mathrm{CuO}}}}_{{\mathrm{x}}}}$$\end{document}) measured on the triangle- (d) and hexagonal-shaped hBN islands (e). f, g Raman spectra taken from ∼ 100 random locations of bare Cu (f) and hBN-covered (g) regions. The compared spectra collected from the marked positions in (e) are shown in the inset of (g). h, i Atomic force microscopy (AFM) topography (h) and conductive AFM current map (i) of as-grown hexagonal-shaped hBN island on Cu(111) substrate after the oxidation treatment. j, kI–V curves collected from 77 and 66 random positions in the area of as-grown hexagonal- (j) and triangle-shaped (k) hBN islands on Cu(111) by applying ramped voltage stresses from 0 to 10 V to the tip. l, m Statistical analysis of the onset voltages for hexagonal-shaped (l) and triangle-shaped (m) hBN islands. The solid lines show fitted distribution curves, illustrating the differences in onset voltages between the two island shapes.
Atomic structures and density functional theory (DFT) simulations
a, b Atomic structures of relaxed N- (left) and B-terminated (right) zigzag edges of freestanding monolayer hBN (a) and monolayer hBN on Cu(111) (b). c Atomic structures of relaxed N- and B-terminated zigzag edges of monolayer hBN on Cu(111) with a low concentration of attached O atoms. d Atomic structure of a hexagonal monolayer hBN island on Cu(111). The N- and B-terminated zigzag edges are marked in blue and red, respectively. e Energy differences between the N- and B-terminated edges (a, b, and c). All images are viewed in the 〈0001〉 direction. The O, B, N, and Cu atoms are shown in green, blue, magenta, and brown, respectively.
High-quality hexagonal-island-merged monolayer hBN on Cu(111) substrates
a Schematic of the growth process of monolayer hBN merged from well-aligned hexagonal-shaped hBN islands in oxygen-assisted chemical vapor deposition (CVD) synthesis. b–d SEM images of the as-grown hBN film showing hexagonal-shaped islands (b, c), with white dashed lines indicating the alignment of the hexagonal islands, and a fully merged, continuous monolayer hBN film (d) on Cu(111) foil. The inset in (d) is a magnified view of the hBN wrinkle area. e Photograph of as-grown single-crystal monolayer hBN on Cu(111) foil with areas of 25 × 70 mm². f, g X-ray photoelectron spectroscopy (XPS) spectra measured on as-grown hexagonal-island-merged monolayer hBN film on Cu(111) substrate. h Optical image of the as-grown monolayer hBN after transferring onto 90 nm SiO2/Si substrates. i Raman map of the intensity of the hBN E2g band measured on the marked region in (h). j Typical Raman spectrum of as-grown hexagonal-island-merged hBN film after transferring onto SiO2/Si substrates.
Transmission electron microscopy (TEM) characterization of single-crystal monolayer hBN films
a Large-scale high-resolution TEM image of hexagonal-island-merged monolayer hBN film. b Atomic-resolution TEM image of the monolayer hBN film. The inset shows the corresponding false-color image. The red and blue spheres indicate N and B atoms, respectively. c Intensity profile along dashed lines in (b) with colors of green (upper panel), red and blue (below panel). d A series of representative selected area electron diffraction (SAED) patterns acquired from six random positions across the 3-mm TEM grid. The blue lines indicate the lattice orientation of various locations shows no difference over the entire grid. Scale bars, 5 nm–1. e Cross-sectional TEM image of the as-grown monolayer hBN film. f Electron energy loss spectroscopy (EELS) mappings of the polymethyl methacrylate (PMMA)/hBN/Cu interface from different locations. Scale bars, 5 nm.
Single-crystal hBN Monolayers from Aligned Hexagonal Islands

October 2024

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216 Reads

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3 Citations

Hexagonal boron nitride (hBN), as one of the few two-dimensional insulators, holds strategic importance for advancing post-silicon electronic devices and circuits. Achieving wafer-scale, high-quality monolayer hBN is essential for its integration into the semiconductor industry. However, the physical mechanisms behind the chemical vapor deposition (CVD) synthesis of hBN are not yet well understood. Investigating morphology engineering is critical for developing scalable synthetic techniques for the large-scale production of high-quality hBN. In this study, we explored the underlying mechanisms of the CVD growth process of hBN and found that the involvement of a small amount of oxygen effectively modulates the shape of the single-crystal hBN islands. By tuning the oxygen content in the CVD system, we synthesized well-aligned hexagonal hBN islands and achieved a continuous, high-quality single-crystal monolayer hBN film through the merging of these hexagonal islands on conventional single-crystal metal-foil substrates. Density functional theory was used to study the edges of hBN monolayers grown in an oxygen-assisted environment, providing insights into the formation mechanism. This study opens new pathways for controlling the island shape of 2D materials and establishes a foundation for the industrial-scale production of high-quality, large-area, single-crystal hBN.


AFM topography characterization performed on 2 µm × 2 µm scan area of tellurium thin‐films a) transferred on Au/Mica substrate, b) directly grown on Au/SiO2 substrate and c) directly grown on Au/Mica substrate d) Comparison of average grain size calculated using cross‐correlation method e) Raman spectroscopy acquired on tellurium thin films transferred on Au/Mica substrate, directly grown on Au/SiO2 and Au/Mica substrates.
a) Schematic illustration of C‐AFM technique with a sharp tip acting as top electrode scanning over the tellurium films b) I–V characteristics obtained by C‐AFM performed on tellurium thin‐films transferred on Au/Mica, directly grown on Au/SiO2, and directly grown on Au/Mica substrate (from left to right) c) Comparison of a statistical distribution of set (blue) and reset (red) voltages d) Comparison of the average values and standard deviations of set and reset voltages e) Comparison of the calculated N ratio, a statistical parameter representing the ratio of the number of points with hysteretic RS behavior to the total number of acquired I‐V curves in different ultra‐thin tellurium films.
a) cross‐sectional STEM images showing the deposited Te film on the Au substrate along with the FFT electron diffraction pattern of the lattice corresponding to the region of the blue box. b) EDXS spectrum showing the detected electronic shells of Au and Te atoms in the same box of a). c) EELS map and percent composition along the path in figure (white arrow). The spatial distribution of Au and Te shows that the two energy‐loss signals overlap at the interface over a scale of several nanometers.
a) Schematic of the cross‐point memristor based on vertical Au/tellurium/Au device array. b) Optical microscope image of the device. c) I−V curve of the device resistive switching. d) Multi‐level states retention as long‐term memory analysis. Reliability analysis: e) DC switching endurance test over 60 cycles and f) device‐to‐device uniformity with box plot.
Non‐Volatile Resistive Switching in Nanoscaled Elemental Tellurium by Vapor Transport Deposition on Gold

October 2024

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42 Reads

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1 Citation

Two‐dimensional (2D) materials are promising for resistive switching in neuromorphic and in‐memory computing, as their atomic thickness substantially improve the energetic budget of the device and circuits. However, many 2D resistive switching materials struggle with complex growth methods or limited scalability. 2D tellurium exhibits striking characteristics such as simplicity in chemistry, structure, and synthesis making it suitable for various applications. This study reports the first memristor design based on nanoscaled tellurium synthesized by vapor transport deposition (VTD) at a temperature as low as 100 °C fully compatible with back‐end‐of‐line processing. The resistive switching behavior of tellurium nanosheets is studied by conductive atomic force microscopy, providing valuable insights into its memristive functionality, supported by microscale device measurements. Selecting gold as the substrate material enhances the memristive behavior of nanoscaled tellurium in terms of reduced values of set voltage and energy consumption. In addition, formation of conductive paths leading to resistive switching behavior on the gold substrate is driven by gold‐tellurium interface reconfiguration during the VTD process as revealed by energy electron loss spectroscopy analysis. These findings reveal the potential of nanoscaled tellurium as a versatile and scalable material for neuromorphic computing and underscore the influential role of gold electrodes in enhancing its memristive performance.


General concept of light-driven C–H activation in long-chain molecules mediated by 2D materials
a Schematic showing the light-driven transformation of CTAC on an atomic layer of WSe2 into luminescent CDs. b Schematic showing the photochemical reaction process involving the activation of C–H bonds and the formation of C=C bonds.
Optical characterizations of 2D-mediated C–H activation and CD synthesis
a Optical images showing the CTAC on the WSe2 sample under a 532 nm laser irradiation at t = 0 s and t = 10 s. The laser power is 2.5 mW. The yellowish PL emission comes from the optically synthesized CDs. b The PL spectra of WSe2 and WSe2 + CDs hybrids. c Time-resolved PL intensity of CDs at 600 nm from the CTAC on WSe2 sample under a 532 nm laser irradiation with different optical power. d, e The PL spectra of d WS2 and WS2 + CDs hybrids and e MoS2 and MoS2 + CDs hybrids under the excitation of a 532 nm laser. Inset in (d) optical image showing the PL emission from the WS2 + CDs sample. f The PL spectra of WSe2/WS2 + CDs samples excited by a 660 nm laser. “a.u.” in (b–f) stands for arbitrary units.
Material characterizations of optically synthesized CDs
a Raman spectra of WSe2 and WSe2 + CDs hybrids. b, c SEM images of the synthesized CDs. d Near-field nano-FTIR spectra of the CDs and pristine CTAC films. The light blue shading indicates the C=C bond spectrum regime. e, f High-resolution TEM images of the synthesized CDs. Inset in f shows the selected area electron diffraction (SAED) pattern of the CDs. “a.u.” in (a, d) stands for arbitrary units.
First-principles calculations to provide insights into the light-driven C–H activation mediated by 2D materials
a Optimized structures considered for DFT calculations. Pristine WSe2 and WSe2−x with Se vacancies or O substitutions are considered. b, c PDOS of the d-electrons of local W-sites (red triangles in a) at pristine WSe2 and WSe2−x with Se vacancies (b) or O substitutions (c). The vertical bars indicate the calculated d-band centers. The Fermi levels are shifted to zero. d The process of C–C coupling considered for DFT calculations on the WSe2 surface. e Comparison of the kinetic barriers of C–C coupling on the WSe2 and other surfaces.
Light-driven C–H activation mediated by 2D transition metal dichalcogenides

July 2024

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104 Reads

C–H bond activation enables the facile synthesis of new chemicals. While C–H activation in short-chain alkanes has been widely investigated, it remains largely unexplored for long-chain organic molecules. Here, we report light-driven C–H activation in complex organic materials mediated by 2D transition metal dichalcogenides (TMDCs) and the resultant solid-state synthesis of luminescent carbon dots in a spatially-resolved fashion. We unravel the efficient H adsorption and a lowered energy barrier of C–C coupling mediated by 2D TMDCs to promote C–H activation and carbon dots synthesis. Our results shed light on 2D materials for C–H activation in organic compounds for applications in organic chemistry, environmental remediation, and photonic materials.


Physical and d.c. characterization of Au–hBN–Au devices
a, Optical microscope image of a device array and de-embedding structures laid out on a 25 μm pitch CPW pattern and with an effective device area of 9 and 100 μm². b, Single device image under the optical microscope. Wrinkles (delineated by arrows and yellow lines) are a clear sign of hBN presence. c, Cross-sectional TEM images of a typical pristine Au–hBN–Au device. The characteristic layered, yet defective, structure of the CVD hBN is well observed, with a layer count of approximately 12 to 18 layers. d, Characteristic I–V curves in LRS and HRS (displaying at least 100 consecutive curves per device) for devices of four different areas. Mean LRS resistance is clearly dependent on device area, which points towards multiple filaments being present in LRS. e, Statistics from the set and reset processes of 13 devices displaying the resistance values (top) and the voltages (bottom) at which the switching event occurs, measured through at least 70 consecutive cycles in each device (all devices are 9 μm², see Supplementary Fig. 8 for data on different device areas for a total of 21 devices). In all cases, data are presented as median values, with box boundaries at the 25th and 75th percentiles and whiskers at the 10th and 90th percentiles (for number of data points accounted for in each bar see Supplementary Fig. 8d). f, Resistance values in HRS and LRS through 2000 consecutive cycles obtained on a 2,500 μm² device by applying successive pulsed I–V ramps. Notice that HRS resistance saturates at ~500 kΩ due to the limited resolution of the high-speed analogue-to-digital converter used for the pulse I–V measurement. Large LRS variability shows values up to ~1 kΩ.
Enhanced LRS performance for RF applications by pulsed write–verify protocol
a, Detail of the full pulsed I–V signal (applied voltage in blue, measured resistance in green) to switch a device through a full cycle, namely HRS–LRS–HRS. The highlighted forbidden region is a simulated estimation of the minimum HRS and maximum LRS values that are compatible with RF applications (Supplementary Fig. 5). The green shaded interval represents the high-speed pulse section to enhance LRS performance. b, Detailed view of the green shaded interval of a with the high-speed pulse protocol to reduce ON-state resistance, showing a resistance as low as 11 Ω for this device. c, Variability of HRS and LRS through 475 cycles of the device being switched with the proposed protocol depicted in a (bipolar scheme). Note the LRS variability improvement compared to Fig. 1f, achieving minimum resistance of 7.2 Ω and a mean value of 9.3 Ω. d, Empirical cumulative distribution of the LRS and HRS values for eight devices that switched at least 100 consecutive cycles with the proposed protocol (two of eight devices switched under unipolar regime). Notice that only one device fails to comply with the maximum LRS level for RF applications in more than 2% of the cycles. e–g, Switching time and energy consumption of the switch by using single pulses for the set and reset processes, showing the entire set–reset cycle (e) and the details of the set (f) and the reset transients (g). The pulsed reset process taking place at −4 V (see g) can be achieved at low voltages (see pulsed reset statistics in Supplementary Note 4). Note that the largest energy consumption takes place during LRS enhancement (see b), but it is still well below the average energy typically required to actuate phase-change memories for RF applications. All the devices featured in this figure are of size ~9 μm².
MmWave performance of Au–multilayer hBN–Au switches
a–c, Schematic circuits in the ON and OFF state and optical microscope images of 9 μm² memristor devices in series (a), shunt (b) and series–shunt (c) configurations. The schematics show the reflection (S11) and transmission (S21) of the signal in each state of the RF switch. d, De-embedded S21 in the ON state (LRS) of a series switch (IL when referred as a positive value). Blue lines are devices that undergo the PVS tuning described in Fig. 2, while red lines are results for devices that were measured after set with standard pulse I–V ramp process. The best-case device shows less than 0.5 dB loss up to 100 GHz, a large improvement compared to other switch technologies (such as those based on PCM or metal-oxide-semiconductor field-effect transistors). e, S21 in the OFF state (HRS) for a series switch (isolation when referred as a positive value). All devices in d and e are of drawn areas ~0.81 μm² (effective area is 1–3 μm² after lithography). f, S21 performance of an Au–hBN–Au switch (area 9 μm²), showing excellent isolation (better than 20 dB) in shunt configuration and less than 2.5 dB IL in series configuration up to 260 GHz. g, Isolation enhancement (better than 35 dB up to 120 GHz) with series–shunt architectures using Au–hBN–Au devices (area of devices 0.81 μm²). h, Schematic representation of a 45° switch-type phase shifter, where the RF switches select a signal path of desired length to introduce a specific phase shift. Shown below the schematic, the layout of the phase shifter centred at 35 GHz designed using 200 nm Au for a CPW pitch of 100 μm (switches in highlighted positions sw1 to sw4, later replaced by S-parameter measurements of Au–hBN–Au devices). i, S21 magnitude (red) and phase (blue) results from the simulations for the two programmable conditions of the phase shifter: 0° (dashed lines, reference) and +45° (full lines). IL for 200 nm thick metal lines at 35 GHz is less than 1.7 dB.
Memristive circuits based on multilayer hexagonal boron nitride for millimetre-wave radiofrequency applications

July 2024

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193 Reads

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4 Citations

Radiofrequency switches that drive or block high-frequency electromagnetic signals—typically, a few to tens of gigahertz—are essential components in modern communication devices. However, demand for higher data transmission rates requires radiofrequency switches capable of operating at frequencies beyond 100 GHz, which is challenging for current technologies. Here we report ambipolar memristive radiofrequency switches that are based on multilayer hexagonal boron nitride and can operate at frequencies up to 260 GHz. The ambipolar behaviour, which could help reduce peripheral hardware requirements, is due to a Joule-effect-assisted reset. We show switching in 21 devices with low-resistance states averaging 294 Ω and endurances of 2,000 cycles. With further biasing optimization, we reduce the resistance to 9.3 ± 3.7 Ω over more than 475 cycles, and achieve an insertion loss of 0.9 dB at 120 GHz. We also build a series–shunt device configuration with an isolation of 35 dB at 120 GHz.


Citations (49)


... Hexagonal boron nitride (hBN), often referred to as white graphene, is a remarkable two-dimensional (2D) material that possesses structural homology with carbon-based 2D materials, such as graphene and its derivatives [14]. The unique structure of hBN, characterized by in-plane polar bonds [15], makes it particularly adept at attracting polar asymmetric molecules, such as water molecules and persulfates. These polar bonds create a strong affinity for species with a similar charge distribution. ...

Reference:

Carbon-Doped Hexagonal Boron Nitride as a Catalyst for Efficient Degradation via Non-Radical Pathway
Single-crystal hBN Monolayers from Aligned Hexagonal Islands

... MXene can be blended with different carbon-based substances, such as graphene and carbon nanotubes (CNTs), which contribute to improved mechanical durability, ion diffusion kinetics, and electrical conductivity, whereas MXene offers a large surface area and capacitive behavior [188][189][190][191][192]. These composites perform better in supercapacitors and batteries regarding rate and charge storage capacity. ...

Ferroelectric MXene-assisted BiFeO3 based free-standing memristors for multifunctional non-volatile memory storage
  • Citing Article
  • March 2024

Carbon

... Roy et al. [83] proposed the resistive random-access memory (RRAM)-based hardware ANN for in-memory computing. Xie et al. [84] proposed the vertical hexagonal boron nitride (h-BN) memristor-based hardware ANN for in-memory computing. Jiang et al. [85] proposed and developed the transistor synapses and hardware SNN to realize motion and visual cognition. ...

Quantum Conductance in Vertical Hexagonal Boron Nitride Memristors with Graphene-Edge Contacts
  • Citing Article
  • January 2024

Nano Letters

... In contrast, the resistance state of nonvolatile cells is maintained for a long period after the external stimulus is removed. Considering these characteristics, research on RRAM devices is being conducted from various perspectives [85,86]. Due to advantages such as high scalability (4F 2 ), fast switching speed, low operating voltage, and a nonvolatile nature, RRAM devices are considered promising for next-generation applications involving nonvolatile data storage and artificial synapses [86]. ...

Volatile and Nonvolatile Resistive Switching Coexistence in Conductive Point Hexagonal Boron Nitride Monolayer
  • Citing Article
  • January 2024

ACS Nano

... This inability to precisely model these variations translates to suboptimal circuit performance and recurring reliability issues [43]. high-performance substrates and conductive materials with lower dielectric losses has demonstrably improved the propagation characteristics of RF signals [45][46][47]. ...

Emerging memory electronics for non-volatile radiofrequency switching technologies

... Recently, Kutagulla et al. 19 compared different two-dimensional materials on top of Nafion 211 with respect to their ability to reduce the hydrogen crossover in operating fuel cells. The barrier layers were additionally protected by a 200 nm thin Nafion coating facing the anode. ...

Comparative Studies of Atomically Thin Proton Conductive Films to Reduce Crossover in Hydrogen Fuel Cells
  • Citing Article
  • December 2023

ACS Applied Materials & Interfaces

... where G LTP /G LTD represents the conductivity of the LTP/LTD behaviors of the device, G max /G min are the maximum and minimum conductivities of the LTP/LTD behaviors, P denotes the number of pulses from G max to G min , and P max denotes the maximum number of pulses, A is a nonlinear parameter, while B is a function of A (equation (8)) [44][45][46]. The LTP/LTD behaviors of the device were fitted using equations (6) and (7) to obtain a value of 3.28/1.37 ...

Enhanced memristive effect of laser-reduced graphene and ferroelectric MXene-based flexible trilayer memristors
  • Citing Article
  • December 2023

Carbon

... temperature, pressure, etc.) can vary. For example, it has been reported that β-In 2 Se 3 is stable in thin films or nanosheets at room temperature 45 and that the β-phase can persist in bulk crystals at room temperature in non-oxidative environments 46 . ...

Air‐Stable Atomically Encapsulated Crystalline‐Crystalline Phase Transitions in In 2 Se 3
  • Citing Article
  • November 2023

... Figure 4b illustrates a similar trend for monolayer MoS 2 across various substrates. This inconsistency in adhesion energy measurements can be attributed to several factors: variations in the environmental conditions (e.g., relative humidity and temperature), the quality of the 2D Multilayer 12800 ± 1000 Scratch [20] Monolayer 750 ± 20 Indentation [26] Graphene-Au Monolayer 450 ± 100 Blister [117] Multilayer 7687.1 Blister [110] Multilayer 255 Indentation [118] Graphene-Ni Monolayer 6775 ± 556 Blister [116] Multilayer 72700 ± 10000 Scratch [20] Graphene-SiN Multilayer 3282 Blister [110] Graphene-Pt Multilayer 4021 Blister [110] Graphene Graphene-Sapphire Bilayer 2200 ± 400 DCB [122] Graphene-PDMS Multilayer 7 Buckling [123] Graphene-PET Monolayer~0. 54 Buckling [82] Graphene-Graphene Monolayer 86 ± 16 Blister [66] Bilayer 320 Indentation [126] materials, differences in the experimental protocols, the theoretical fitting models, twist angle, and so on. ...

Direct Metal-Free Growth and Dry Separation of Bilayer Graphene on Sapphire: Implications for Electronic Applications
  • Citing Article
  • October 2023

ACS Applied Nano Materials