D. Boroyevich’s research while affiliated with Virginia Tech and other places

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Publications (164)


Common-Mode Noise Current Simulation and Measurement on a Gate Driver for SiC MOSFET Half-Bridge Modules
  • Conference Paper

May 2021

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26 Reads

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5 Citations

T. Tanaka

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R. Burgos

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I. Cvetkovic

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[...]

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D. Boroyevich

Fig. 13. Copper minichannel performance.
Shipboard PEBB Cooling Strategies
  • Conference Paper
  • Full-text available

August 2019

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516 Reads

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17 Citations

We discuss herein several cooling strategies applicable to shipboard Power Electronics Building Blocks (PEBBs), namely the PEBB 1000 and a notional PEBB 6000 currently under development, subject to the following design goals and constraints: (1) small and lightweight package (i.e., high power density); (2) easy swapability achieved by minimizing any connections requiring sailor intervention for connecting or disconnecting ; and (3) any thermal solution must be able to cool not only a single PEBB unit, but also multiple units placed in close proximity to one another when combined to make up a converter. For the PEBB 1000 application, air cooling is most likely sufficient to meet the needs, and several arrangements of fin structures were investigated. On the other hand, air cooling, water cooling, and water cooling with a dry interface all have potential for meeting the cooling demand of an envisioned PEBB 6000 and warrant further investigation. In any case, the localized heat generated within the PEBB will require significant spreading to a larger surface area for subsequent transfer out of the PEBB.

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Fig. 1. (a) Schematic and 3D models of the (b) bottom and (c) complete assemblies, (d) side-view of the module, (e) terminal arrangement, and (f) housing with integrated cooler. The colors in the 3D models
Fig. 2. Schematics and their corresponding simulated electric field plots for (a) a single DBA, (b) two stacked DBAs with middle metal connected to S2, (c) two stacked DBAs with the middle metal left floating, and (d) two stacked DBAs with the middle metal connected to half of the applied voltage (3 kV).
Fig. 3. Assembled module with (a) 10 kV SiC MOSFETs and Mo posts, (b) stacked DBA substrates, and (c) the housing and integrated jet-impingement cooler.
Fig. 7. Drain-source (red, left axis) and ground current (purple, right axis) waveforms with and without the CM screen.
A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field

June 2018

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692 Reads

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8 Citations

While wide-bandgap devices offer many benefits, they also bring new challenges for designers. In particular, the new 10 kV silicon carbide (SiC) MOSFETs can switch higher voltages faster and with lower losses than silicon devices while also being smaller in size. These features can result in premature dielectric breakdown, higher voltage overshoots, high-frequency current and voltage oscillations, and greater electromagnetic interference. In order to mitigate these side effects and thus fully utilize the benefits of these unique devices, advanced module packaging is needed. This work proposes a power module package with a small footprint (68 mm × 83 mm), low gate- and power-loop inductances (4 nH), increased partial discharge inception voltage (53 %), and reduced common-mode current (90 %).





Optimization of an Aircraft Power Distribution System, JoAircraft, 40/1, 2003, pp. 16-26.

January 2013

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220 Reads


Synchronous generator-based grid-interface converter for energy storage systems integration

January 2013

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131 Reads

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4 Citations

The common, and with some exceptions the only method to interconnect high power renewable energy sources and energy storage systems to the grid has been using power electronics converters that operate as current sources to the grid for the purpose of achieving the maximum primary-source power tracking. When grid is not available, such sources would not be allowed to continue operating and will be shut-down after anti-islanded algorithms recognize the loss of the grid. Although existing standards and requirements still limit grid-interface converters to regulate voltage in the grid, this functionality will inevitably be the part of the power system operation in the future. This paper addresses physical and mathematical equivalency between power electronics converters and synchronous generators, and emphasizes how an inherent synchronization feature of the synchronous generators can be used to improve the performance of the grid-interface converters. It has also been shown that if operated as a voltage source, grid-interface converter could have significant stabilizing effect on the system dynamics due to the non-delayed power delivery.


Un-terminated common-mode EMI model of DC-fed motor drives

September 2012

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36 Reads

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13 Citations

Terminal electromagnetic interference (EMI) models of power converters have been shown to successfully predict conducted emissions up to at least 30 MHz. These models can accurately predict the input side EMI of converters for changes in the source impedance but only for a fixed load. In other words these models cannot predict the input side EMI for changes in the load side parameters. Such terminated EMI models have limited utility as they cannot be used for converters that have a strong coupling between the input and output side EMI. Moreover, in aerospace applications, the conducted EMI standards (DO- 160) dictate limits on the noise currents in all power lines and cable bundles, thus compelling development of models that can predict the EMI on both sides of the power converters. The proposed un-terminated EMI terminal model in this paper directly predicts the input and output side common-mode (CM) noise currents in a motor drive system for changes in both source and load side impedances. Such models can be very useful in understanding how EMI filters and harnesses affect the overall EMI in a motor drive system. The model runs in the frequency-domain and is validated by experiments.


Modeling Verification, Validation, and Uncertainty Quantification (VV&UQ) procedure for a two-level three-phase boost rectifier

February 2012

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63 Reads

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2 Citations

This paper presents complete Verification, Validation, and Uncertainty Quantification (VV&UQ) procedures that are applied to a two-level boost rectifier. The goal of this VV&UQ study is the improvement of the modeling procedure for power electronics systems, and the full assessment of the boost rectifier model (as an example) predictive capabilities. Modeling and simulation of large systems is always the preferred solution to avoid repetitive hardware, and to minimize the cost. However, developing the accurate models and making sure it matches the hardware is always a challenge. This paper provides a set of procedures that if followed one can claim the model is validated.


Citations (85)


... The power corridor's concept presents extra design constraints like compactness for the PEBBs. Many cooling strategies apply to the shipboard PEBBs, such as PEBB 1000 and PEBB 6000 [157]. ...

Reference:

Power Converters Coolant: Past, Present, Future, And A Path Toward Active Thermal Control in Electrified Ship Power Systems
Shipboard PEBB Cooling Strategies

... In the power module packaging area, numerous papers discuss the high E-field intensity management inside the module [7], [8], where the initial effort can date back to the 1990s and such study still continues today for 10-kV SiC module packaging [9]. By comparison, as a crucial issue for medium-and high-voltage power converters, the insulation system design for different parts inside a converter [10], [11], as well as those among multiple converters in a modular multilevel converter (MMC) structure [12], still needs more investigation. ...

A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field

... As a result, Ag atoms diffuse more quickly through electro-plated Ag than through electrolessplated Ni(P)/Ag, leading to stronger interfacial adhesion on the electro-plated Ag (Fig. 17). This difference in diffusivity helps explain why electro-plated Ag demonstrates a die-shear strength roughly 10 MPa greater than that of electroless-plated Ni(P)/Ag [96]. Nano-Ag sintering on Ag finish has been regarded as a preferable route, which can provide reliable bonding above 40 MPa [24]. ...

Effect of substrate surface finish on bonding strength of pressure-less sintered silver die-attach
  • Citing Conference Paper
  • April 2018

... Among these materials, 4H-SiC is notable, owing to its high electron mobility, superior breakdown field strength, enhanced thermal conductivity, and better lattice matching [1][2][3], which enable heterogeneous integration with other materials, such as gallium nitride (GaN). These outstanding characteristics make 4H-SiC ideal for a wide range of applications, including new energy vehicles, power transmission systems, and wireless communication technologies [4,5]. In these industrial applications, the 4H-SiC substrate has extremely high-quality requirements. ...

A high-power-density, high-speed gate driver for a 10 kV SiC MOSFET module
  • Citing Conference Paper
  • August 2017

... There is a large interest in improving the efficiency of Flyback converters, characterized by a wide input voltage range and a variable input and output voltage due to its wide applications [1][2][3][4]. To this aim, several non-dissipative clamp circuits, passive [5,6] and active [7][8][9][10], have been proposed and optimized over the years to limit the voltage spikes on the main switch, typically a power MOSFET, due to the transformer leakage inductance and optimized to not excessively affect the overall efficiency system [11]. ...

Design of a two-switch flyback power supply using 1.7 kV SiC devices for ultra-wide input-voltage range applications
  • Citing Conference Paper
  • September 2016

... It proposed a method to build power converters faster, sparing engineering time and still achieving high-performance levels in terms of power density, efficiency and reliability [14], [15]. The PEBB methodology also led to other advantages such as speeding up technology development [16], scaling up converters voltage and current capabilities, creating plug and play devices [11] and becoming key pieces in a smart-grid [15]. ...

Power electronics building blocks for utility power system applications
  • Citing Article
  • January 2004

... For the VS/CC-VSC, a DC/DC converter is often equipped to stabilize the voltage of the DC-link, and the energy supply on the DC side is able to provide sufficient energy for the VSC within a certain period of time. Since the voltage on the DC side is stable, the VSC control is focused on the output AC current control, as shown in By revealing the inherent PLL feature of the traditional SG, as shown in Fig. 15, a special PLL imitating the inherent phase-locking dynamic of SG is applied, instead of the conventional PLL with proportional-integral (PI) controller [49]. ...

Synchronous generator-based grid-interface converter for energy storage systems integration
  • Citing Article
  • January 2013

... The proposed scheme is implemented by redesigning the pre-existing line filter in the load subsystem without any additional feedback controller or control circuit. This method is an application of the impedancebased frequency-domain approach, which has been widely used for Dc-to-Dc power conversion systems [2]- [11] and are now emerging for stability analysis and control of ac power electronics systems [12], [13]. The front-end converter is designed and fabricated without any prior information about the load subsystem [14]. ...

Dynamic interactions in hybrid ac/dc electronic power distribution systems
  • Citing Article
  • May 2011

... A PWM modulation approach for the reduced switch count three-phase/level/wire T-Type rectier (Fig. 29) is presented in [139], based on the equivalence of two and three-level topologies. So, the converter is able to operate with a simple two-level overmodulation scheme. ...

Space Vector Modulation for Vienna-Type Rectifiers Based on the Equivalence between Two and Three-Level Converters: A Carrier-Based Implementation
  • Citing Article
  • January 2007

PESC Record - IEEE Annual Power Electronics Specialists Conference