A. Nomura’s research while affiliated with Aichi Medical University Hospital and other places

What is this page?


This page lists works of an author who doesn't have a ResearchGate profile or hasn't added the works to their profile yet. It is automatically generated from public (personal) data to further our legitimate goal of comprehensive and accurate scientific recordkeeping. If you are this author and want this page removed, please let us know.

Publications (7)


Poster abstracts
  • Article

July 2016

·

236 Reads

·

1 Citation

Sleep and Biological Rhythms

J. Ferrie

·

M. Shipley

·

F. Cappuccio

·

[...]

·

H. Richards

Characterization of across-device linewidth variation (ADLV) for 65 nm logic SRAM using CDSEM and linewidth roughness algorithms - art. no. 61520Y

April 2006

·

5 Reads

·

2 Citations

Proceedings of SPIE - The International Society for Optical Engineering

The lithographic challenges of printing at low-k1 for 65 nm logic technologies have been well-documented (1,2). Heavy utilization of model-based optical proximity correction (OPC) and reticle enhancement technologies (RET) are the course of record for 65 nm logic nodes and below. Within the SRAM cells, often more dimensionally constrained than random logic, characterization of the nominal gate linewidth and linewidth variation is critical to ensure cell performance and stability. In this paper, we present the use of the linewidth roughness analysis package of a commercially-available CD SEM to extract low-spatial frequency information in order to characterize effects of OPC, substrate topography, process variations, and RETs. The SEM-based characterization of across-device linewidth variation is analyzed statistically to extract the information necessary to set device processing conditions and to make layout corrections consistent with producing the least possible channel length variation along the active device.



Effect of Contact Liner Stress in High-Performance FDSOI Devices with Ultra-Thin Silicon Channels and 30 nm Gate Lengths

November 2005

·

35 Reads

·

6 Citations

IEEE International SOI Conference

We have investigated for the first time the effect of stressed contact liners on the performance of fully depleted ultra-thin channel CMOS devices with a raised source/drain. Significant enhancement in mobility and drive current is observed in both nFETs and pFETs. The observed enhancement shows a strong dependence on the Si channel thickness and the height of the raised source/drain, consistent with stress simulations.


High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
  • Conference Paper
  • Full-text available

July 2005

·

121 Reads

·

66 Citations

A high performance 65 nm SOI CMOS technology is presented featuring 35 nm gate length, 1.05 nm gate oxide, performance enhancement from dual stress nitride liners (DSL), and 10 wiring levels with low-k dielectric offered in the first 8 levels. DSL enhancement is shown to scale well to 65 nm with larger enhancement seen than at 90 nm design rules. A high performance 0.65μm2 SRAM cell is also presented. SOI allows the SRAM cell to use Metal 1 instead of Metal 2 for bit-line wiring, which lowers the capacitance and improves access times. A functional dual-core microprocessor test chip containing 76Mb SRAM cache and key execution units has been fabricated.

Download

Fig 1. Flow diagram of participants.
Design and baseline characteristics of a study of primary prevention of coronary events with pravastatin among Japanese with mildly elevated cholesterol levels

September 2004

·

963 Reads

·

12 Citations

Circulation Journal

Background Although cholesterol management reportedly reduces fatal and non-fatal coronary heart disease (CHD) events in subjects with or without evident atherosclerotic disease, it is still uncertain whether these benefits extend to Japanese. Methods and Results The study group comprised 8,009 subjects with mildly elevated total cholesterol who were randomized to treatment with 10-20 mg pravastatin plus diet (2,691 women, 1,267 men) or diet alone (2,758 women, 1,293 men). The groups were extremely well balanced with respect to baseline demographics and risk factors such as blood pressure and plasma lipids. Over a 5-year period of follow-up, the primary end-points will be a composite of fatal and non-fatal coronary events. Secondary end-points will include stroke and transient ischemic attack, all cardiovascular events and total mortality. Conclusions The 2 groups will be followed up until the end of March 2004 and end-points will be analyzed by full analysis set.


Citations (4)


... The New England Journal of Medicine, in 1993(GUSTO Investigators, 1993. The Management of Elevated Cholesterol in the Primary Prevention Group of Adult Japanese (MEGA) analyzed 8009 patients in 924 hospitals in Japan and published the results in an article, which consisted of 2459 authors (Nakamura et al., 2004). In physics, the scientists and engineers affiliated with the Collider Detector at Fermilab (CDF) have been added to the standard author list of all the articles published by CDF, in alphabetical order, since 1998. ...

Reference:

Multi-authoring and its impact on university rankings: a case study of CERN effect on Turkish universities
Design and baseline characteristics of a study of primary prevention of coronary events with pravastatin among Japanese with mildly elevated cholesterol levels

Circulation Journal

... Embedded Source/Drain in SiC [4] or in SiGe are used to increase nFETs and pFETs performance respectively [5]. Stress Memorization Techniques (SMT) are based on the amorphization of the source and drain or the gate materials and their recrystallization under stress induced by a liner [6]. So, even after the liner removal, the stress is memorized in the source and drain or in the gate. ...

Stress memorization in high-performance FDSOI devices with ultra-thin silicon channels and 25nm gate lengths
  • Citing Conference Paper
  • January 2006

... We fabricated undoped-body ETSOI devices, shown schematically in Fig. 1(a), with in-wafer average T SOI in the 4-23-nm range, 145-nm-thick BOX, 1.1-nm-thin SiON gate oxide, doped poly-Si gate electrodes, and Si raised source/drain (RSD). We used an SDE-last process flow, described in detail in [10], to minimize SDE doping loss and adopted dual stress liners (DSL) for imparting stress to the channel [7]. We use doped PDSOI devices with DSL and similar direct overlap between the gate and the SDEs as our reference devices [11]. ...

Effect of Contact Liner Stress in High-Performance FDSOI Devices with Ultra-Thin Silicon Channels and 30 nm Gate Lengths
  • Citing Conference Paper
  • November 2005

IEEE International SOI Conference

... The benefits of AS exceed that of the classical node scaling. embedded silicon germanium (eSiGe) for pFET [24], strain memorization technique (SMT) for nFET [25], and dual stress liners with tensile stress for nFET and compressive stress for pFET [26]. ...

High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell