October 2024
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3 Reads
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Publications (105)
August 2024
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21 Reads
IEEE Transactions on Components, Packaging, and Manufacturing Technology
This paper investigates the application of tensor decomposition and the stochastic Galerkin method for the uncertainty quantification of complex systems characterized by high parameter dimensionality. By employing these methods, we construct surrogate models aimed at efficiently predicting system output uncertainty. The effectiveness of our approaches is demonstrated through a comparative analysis of accuracy and CPU cost with conventional Galerkin methods, using two transmission line circuit examples with up to 25 parameters.
May 2024
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10 Reads
April 2024
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20 Reads
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2 Citations
IEEE Transactions on Circuits and Systems I Regular Papers
Recently, Polynomial Chaos (PC) has been proposed as efficient approach for performing uncertainty quantification in the the context of electronic design automation. A related approach, Rational Polynomial Chaos (RPC) was later developed for applications that exhibit a large variation in the quantity of interest. One of the key bottlenecks for both PC and RPC is the number of circuit evaluation needed, particularly as the number of random parameters increases (often referred to as the curse of dimentionality). In this paper, we propose an approach that uses sensitivity information to significantly reduce the number of circuit evaluations needed for Rational Polynomial Chaos. Numerical examples are given to illustrate the accuracy and efficiency of the proposed approach.
January 2024
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7 Reads
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1 Citation
IEEE Journal of Radio Frequency Identification
Temperature variation poses a significant challenge for battery-free sensors and Internet of Things (IoT) systems, mainly due to the absence of built-in temperature compensation modules. This work presents a strategy to identify Schottky diodes for low-power RF-to-dc Dickson charge pump (DCP) rectifiers to enhance temperature stability. Theoretical analysis pinpoints that performance degradation in dynamic temperatures results from the mismatch loss between diode nonlinear junction resistance and load resistance. The analytical method is implemented to synthesize the optimum number of stages and identify suitable Schottky diodes for low-power RF-to-dc DCP rectifiers. Experimental measurements demonstrate that the SMS7621-based 3-stage RF-to-dc DCP rectifier maintains a wide matched operating temperature range from 32.5 °C to 70 °C. Further experiments show that its dc output voltage remains above 3.2 V across a wide temperature range of 40 °C to 80 °C when the RF input is 8 dBm, which can drive a commercial wireless sensor board. This work aims to serve as a benchmark for developing reliable low-power RF-to-dc DCP rectifiers that meet various operating temperature requirements of battery-free IoT sensors.
January 2024
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4 Reads
IEEE Transactions on Components, Packaging, and Manufacturing Technology
In [1], we proposed the methodology to use the sensitivity information for building the Least-Squares SVM-based surrogate model for uncertainty quantification in the context of circuit systems. It was shown in [1] that the sensitivity-enhanced LS-SVM could successfully reduce the simulation data required for building LS-SVM-based surrogate models. However, the number of samples required for building the surrogate model is not known a priori. In this paper, we present an iterative technique that uses the nested Latin hypercubes to add the samples until the surrogate model achieves the desired accuracy. The presented technique is demonstrated using two numerical examples, where we show that the proposed method, when used with [1], can significantly reduce the amount of simulation data required for building LS-SVM-based surrogate models.
October 2023
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3 Reads
June 2023
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26 Reads
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1 Citation
June 2023
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14 Reads
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6 Citations
July 2022
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118 Reads
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1 Citation
Citations (58)
... The proposed PEEC-MOR method is validated through numerical results in both the frequency domain and time domain. Data-driven derivative-enhanced modeling techniques have proven to be successful in building accurate models with a reduced computational effort [16], [17], [18]. ...
- Citing Article
April 2024
IEEE Transactions on Circuits and Systems I Regular Papers
... Indeed, working in a real environment, outside of anechoic chamber, may degrade the dynamic range. Otherwise, employing two orthogonal polarizations (for UL and DL components of the E-wave) or two different harmonic frequency (using a harmonic transponder [6]- [7]) for transmission of the DL E-wave) and reception (UL E-wave) can significantly enhance the signal's dynamic range with the price of increasing system complexity. ...
- Citing Conference Paper
June 2023
... The Dickson rectifier in Figure 1 was demonstrated in the '70s by John F. Dickson [10]. In recent times, due to the practicality and simplicity of the Dickson rectifier, it has commonly been found and implemented in various charge pump and voltage doubler circuitry [11]- [16]. The coupling capacitor C1 charges during VRF < -VDIODE through D1 and functions as a doubler during VRF > VDIODE through D2 to transfer the charges to CL to generate VOUT = 2(|VRF| -VDIODE). ...
- Citing Conference Paper
June 2023
... Indeed, the polymer material involved in the additive manufacturing as well as the added conductor have a major impact on the RFEH performances and it is one of the main issues of the paper to quantify the impact and discuss the pertinence of the manufacturing process proposal in this context. [14], B- [15], C- [16], D- [17], E- [15], F- [15], G- [8], H- [8], I- [18], J- [19], K- [20], L- [21], M- [22], N- [4], O- [23], P- [24], Q- [25], R- [25], S- [26], T- [26], U- [27], V- [27], W- [28], X- [29], Y- [30], Z- [31], AA- [32], BB- [33], CC- [33], DD- [34], EE- [9], FF- [35], GG- [32], HH- [36], II- [28], JJ- [37], KK- [5], LL- [19], MM- [38], NN- [39], OO- [31], PP- [40], QQ- [41], RR- [42], SS- [43], TT- [44], UU- [45] 3D Plastronics allows integrating electronic functions at the surface of the polymer housing of an object by selective metallization of conductive traces and placement of Surface Mount Devices (SMD) [46,47]. 3D Plastronics is the terminology now accepted by the IPC organization [48], but it is also known as Molded Interconnect Devices or Mechatronic Integrated Devices (MID) [47]. ...
- Citing Conference Paper
- Full-text available
July 2022
... High efficiency transponder designs have been studied extensively. And a variety of diode types [21] [12], topologies [13] and operating modes [22] are investigated to improve the harmonic conversion efficiency. However, the approaches are only effective for a limited number of cooperative scenarios. ...
- Citing Article
- Full-text available
August 2021
... An item's level of participation in a fuzzy set indicates the extent to which it shares that set's defining features or attributes. If U is the space of uncertainty, then ωà is the membership function connected to each of its constituents in the fuzzy set Ã. Then the representation of fuzzy set is given by (Chamoun & Nour, 2021;Kassis et al., 2019;Saab & Saab, 2019): ...
- Citing Conference Paper
October 2019
... However, this can be achieved by leveraging a form of model selection. To this aim, we note that VF has already been coupled with model selection strategies [34,33], as a way to overcome one of its main limitations, namely, the need to fix the "surrogate complexity" m in advance. Without going into too many details, such model selection strategies generally work by using VF to independently build several rational approximations with different values of m, and then selecting the rational approximant characterized by the lowest approximation error 2 . ...
- Citing Article
October 2019
IEEE Transactions on Components, Packaging, and Manufacturing Technology
... The subspace methods including ORT, N4SID, MOESP, CVA) were used for the linear state space identification with different probing tests [36][37][38]. Afterwards, many variants of transfer function identification methods [8,13,[39][40][41][42][43][44][45][46][47][48] and state space identification methods [6,15,22,[49][50][51][52] were developed for data-driven control in the context of power grid applications such as damping control, voltage control and microgrid control (primary, secondary and tertiary) and aggregated load control. Generally, both transfer function and linear state space methods can represent systems well using a locally linearized model around a fixed operating point under the assumption that the system is an LTI (linear time-invariant). ...
- Citing Article
November 2018
Power Systems, IEEE Transactions on
... This includes time domain approaches such as Latency Insertion Method [2]. Another type of simulation method is the use of Harmonic Balance moments to compute the X-parameters for circuits excited with single or multiple input frequencies [3][4][5]. This approach allows for the computation of a complete set of X-parameters for the given system. ...
- Citing Conference Paper
October 2017
... This includes time domain approaches such as Latency Insertion Method [2]. Another type of simulation method is the use of Harmonic Balance moments to compute the X-parameters for circuits excited with single or multiple input frequencies [3][4][5]. This approach allows for the computation of a complete set of X-parameters for the given system. ...
- Citing Article
September 2017
IEEE Transactions on Components, Packaging, and Manufacturing Technology