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ABSTRACT: We present an attractive poly-SiGe thin film packaging and MEM (Micro Electro-Mechanical) platform technology for integrating various packaged MEM devices above standard CMOS. The packages, having cavities as large as 1 mm<sup>2</sup>, make use of pillars designed to withstand subsequent molding during 1<sup>st</sup> level packaging. Covers on top of the release holes avoid deposition inside the cavity during sealing. Hermeticity is proven in vacuum, air and N<sub>2</sub> atmosphere and at different temperatures. Packaged functional accelerometers sealed at a pressure around 1 bar, have an equivalent performance in measuring accelerations of about 1 g compared to a piezoelectric commercial reference device.