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Conference Paper: System-in-package synthesizer for PCS/DCS application[Show abstract] [Hide abstract]
ABSTRACT: The article presents a system-in-package (SiP) approach for synthesizer system module used in frequency down- and up-conversion of PCS/DCS radio base station applications using low-temperature co-fired ceramic (LTCC). The hybrid module benefits from the latest qualified production technology based on multilayer LTCC technology. LTCC permits a relatively high level of circuit integration in which different parts of the synthesizer such as the VCO, buffer amplifier, loop filter, PLL circuit, switch, and voltage regulator are integrated in a single substrate of 21 times 16 times 4 mm<sup>3</sup>. The module exhibits minimum RF tuning sections, improved performance repeatability, excellent RF performance, and good low phase noise. The module covers 1800 MHz Rx/Tx and 1900 MHz Rx/Tx frequency bands. Adoption of the synthesizer to upper or lower frequency band is possible by means of few component changes in a novel tuneable resonator structure. The module's design concept defines 4 commercial products which is included in Infineon's portfolio of wireless infrastructure circuit solutions for PCS/DCS radio basestation applications.