[Show abstract][Hide abstract] ABSTRACT: A new interconnect solution with plastic waveguide is demonstrated. The system consists of a pair of transceivers and a plastic waveguide. Millimeter wave signal is transmitted in a low-cost long piece of solid plastic dielectric acting as a waveguide. The plastic waveguide medium offers a large bandwidth for data communication using mm-wave carrier frequencies. Plastic waveguide interconnects do not require costly electrical-to-optical and optical-to-electrical conversion devices or precise alignment and offer longer transmission distances than wireless solutions due to better field confinement and lower path loss. Multiple plastic waveguides can be used in parallel and the modulated data at different frequencies can be multiplexed to increase the data rate. The demonstrated transceiver chips operate at carrier frequencies of 57 GHz and 80 GHz, and are fabricated in 40 nm low-power logic CMOS. The total area and power consumption of two transceivers are 0.41 mm and 140 mW, respectively. The fabricated demonstrator with Yagi-couplers achieves full-duplex transmission of 12.5 Gb/s ASK modulated signal in each direction over the 120 mm polystyrene waveguide with no equalization. The observed bit error rates for both channels are less than 10 for a PRBS length of 2 1 at the total data rate of 25 Gb/s. This paper shows the feasibility of the plastic waveguide interconnect as a promising alternative to electrical, optical, and wireless interconnects.
No preview · Article · Dec 2011 · IEEE Journal of Solid-State Circuits
[Show abstract][Hide abstract] ABSTRACT: This paper presents a 12.5+12.5Gb/s full-duplex plastic waveguide interconnect solution based on millimeter-wave signal transmission. The plastic waveguide is simply a long solid piece of plastic that provides a very simple, versatile, flexible, and low-cost transmission medium that has the main advantages of optical fiber in isolation and bandwidth, without the need for costly EO and OE. The dielectric waveguide does not need to be connected electrically like the wire or aligned to micron-level accuracy like optical fibers. It can be bent and twisted without significant impact on the signal. Compared to the wireless link discussed earlier, it offers additional signal isolation and confinement. Thus, it can be extended over much longer distances due to the low attenuation in the waveguide (as opposed to free space) and multiple independent lines can be run in parallel to increase the bandwidth. In our proposed plastic waveguide link, the TXs and RXs are fully integrated in CMOS, and the waveguide couplers can be fabricated in a conventional resin package without additional cost. In our existing setting there are a transmitter and a receiver operating at different carrier frequencies on each side of the waveguide, making it possible to realize a full-duplex solution. Because of the smaller fractional bandwidth for the millimeter-wave transmission, no equalization circuit is required.
[Show abstract][Hide abstract] ABSTRACT: A novel millimeter-wave Intra-Connect solution for short range, high speed, internal I/O connections in low-power logic 40 nm CMOS process is demonstrated. The system consists of a transmitter and a receiver that uses binary amplitude shift keying (ASK) modulation for a compact and power efficient design. The receiver realizes coherent demodulation using injection locking without a PLL or an external reference clock utilizing a path to inject the received signal into the VCO. The demonstrator achieves 11 Gb/s ASK data transmission over 14 mm using bond-wire antennas with a bit error rate (BER) of less than 10-11. The active footprint of the transmitter is 0.06 mm2 and the power consumption is 29 mW with an energy usage of 6.4 pj/bit per channel. The receiver occupies the active footprint of 0.07 mm2 and consumes 41 mW. The work shows the feasibility of the millimeter-wave Intra-Connect for high speed internal I/O connections.
[Show abstract][Hide abstract] ABSTRACT: We conducted a basic study of Millimeter-wave Intra-Connect Systems from the aspects of module implementation and transmission characteristics. We made small transmitter (TX) and receiver (RX) modules with on-board Yagi antennas using a resin material, and investigated the characteristics of the antennas. We also studied the relation of the transmission characteristics to module arrangement and the use of parallel metal plates as a simple case model. We confirmed extension of transmission distance by using the Yagi antenna with gain and sandwiching the modules between parallel plates.