[Show abstract][Hide abstract] ABSTRACT: A radio frequency integrated circuit (RFIC) tag consisting of an 8 bit CPU, a 4 kB ROM, a 512B SRAM, and an RF circuit, which communicates using 915 MHz UHF RF signals, has been developed on both a flexible substrate and a glass substrate. Each of the RFIC tags employs a single DES and an anti-side channel attack routine in firmware for secured communication, and occupies an area of 10.5 mm in width and 8.9 mm in height. The RFIC tag on the flexible substrate is 145 mum thick and weighs 262 mg, and the RFIC tag on the glass substrate consumes 0.54 mW at a power supply voltage of 1.5 V and communicates with a maximum range of 43 cm at a power of 30 dBm. The high-performance poly-silicon TFT technology on flexible substrate and glass substrate of 0.8 mum design rule, and a gate plus one metal layer are used for fabrication. The RFIC tag realizes stable internal clock generation and distribution by a digital control clock generator and a two-phase nonoverlap clock scheme, respectively.
No preview · Article · Feb 2008 · IEEE Journal of Solid-State Circuits
[Show abstract][Hide abstract] ABSTRACT: In 2005, we developed the first 13.56 MHz flexible RFCPU (8 bit) in the world by the flexible LSI (LSI on plastic) manufacturing technology, which is based on the manufacturing technology of LSI on glass and the peeling and transferring technology. In 2006, we considered the possibility of realizing a UHF RFCPU (8 bit) using a radio signal in the UHF band (915 MHz). A radio signal in the UHF band is in principle more capable of long distance communication than the 13.56 MHz radio signal. In this paper, we will report the results of test producing the high-performance 13.56 MHz (HF) RFCPU and UHF RFCPU, as an examination of the potential of the high-function RFCPU by the glass LSI manufacturing process and the flexible LSI manufacturing process.
No preview · Article · Jul 2007 · ECS Transactions