Nonfluorinated Volatile Copper(I) 1,3-Diketiminates as Precursors for Cu Metal Deposition via Atomic Layer Deposition
Novel nonfluorinated Cu(diketiminate)L complexes with L = neutral olefinic ligand have been prepared as stable, volatile Cu(I) precursors for the deposition of copper films by an atomic layer deposition (ALD) process. Among them, the complexes of 4-a and 5-a are the most volatile and stable at low temperature (55 degrees C). A clean, conformal copper film was deposited at 120 degrees C in an ALD process. These Cu(I) complexes are the first examples of nonfluorinated copper(I) diketiminates that can be readily applied to an industrial microelectronic fabrication process.
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- [Show abstract] [Hide abstract] ABSTRACT: The incorporation of rigid aromatic linkers into β-diketiminate ligands creates a binucleating scaffold that holds two metals near each other. This paper discloses the synthesis, characterization, and reactivity of mBin(2-), which has a meta-substituted xylylene spacer, and pBin(2-), which has a para-substituted xylylene spacer. Lithium, aluminum, and zinc complexes of each ligand are isolated, and in some cases are characterized by X-ray crystallography. The lithium complexes are coordinated to solvent-derived THF ligands, while the zinc and aluminum complexes have alkyl ligands. Complexes of the mBin(2-) ligand have an anti conformation in which the metals are on opposite sides of the macrocycle, while pBin(2-) complexes prefer a syn conformation. The (1)H NMR spectra of the complexes demonstrate that the conformations rapidly interconvert in the lithium complexes, and less rapidly in the zinc and aluminum complexes.0Comments 23Citations
- [Show abstract] [Hide abstract] ABSTRACT: Atomic layer deposition (ALD) is poised to become one of the dominant technologies for the growth of nanometer-thick conformal films in microelectronics processing. ALD is particularly suited for the deposition of isotropic films on complex topographies under mild conditions and with monolayer control. However, many questions concerning the underlying surface chemistry need to be answered before this film deposition methodology can find widespread use. Here we highlight some recent examples of surface-science studies of ALD processes aimed to provide a basic understanding of that chemistry.0Comments 48Citations