Conference Paper

Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
DOI: 10.1109/EPEP.2003.1250027 Conference: Electrical Performance of Electronic Packaging, 2003
Source: IEEE Xplore
We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.

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