Improving Compression Ratio, Area Overhead, and Test Application Time for System-on-a-Chip Test Data Compression/Decompression

Conference Paper · February 2002with3 Reads
DOI: 10.1109/DATE.2002.998363 · Source: IEEE Xplore
Conference: Design, Automation and Test in Europe Conference and Exhibition, 2002. Proceedings

    Abstract

    Proposes a new test data compression/decompression method for systems-on-a-chip. The method is based on analyzing the factors that influence test parameters: compression ratio, area overhead and test application time. To improve compression ratio, the new method is based on a variable-length input Huffman coding (VIHC), which fully exploits the type and length of the patterns, as well as a novel mapping and reordering algorithm proposed in a pre-processing step. The new VIHC algorithm is combined with a novel parallel on-chip decoder that simultaneously leads to low test application time and low area overhead. It is shown that, unlike three previous approaches which reduce some test parameters at the expense of the others, the proposed method is capable of improving all the three parameters simultaneously. An experimental comparison on benchmark circuits validates the proposed method