Chapter

Electrolytic refining

Authors:
  • Independent Researcher
  • Canadian Engineering Associates
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Abstract

Electrolytic refining is the principal method of mass-producing high purity (>99.97%) copper. The other is electrowinning. Copper from electrorefining, after melting and casting, contains less than 20 ppm impurities, plus oxygen, which is controlled at 0.018%–0.025%. Electrorefining entails electrochemically dissolving copper from impure copper anodes into an electrolyte containing CuSO4 and H2SO4, and then electrochemically depositing pure copper from the electrolyte onto stainless steel or copper cathodes. The process is continuous.

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... However, during the process of purification, convex nodules and particles appear on the surface of the cathode copper plate. These nodules grow continuously and eventually make contact with the anode, resulting in a short circuit between the cathode and anode, which ultimately leads to a significant decrease in current efficiency and deterioration in the quality of the copper plate [1,2]. Current research indicates that the formation of nodules on copper cathode plates is caused by a combination of multiple factors. ...
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Many factors which affects the anode passivation during electrolysis were discussed in this paper. These includes the amount of slime and slime adhesiveness. The internal factors which affects the amount of slime include the type, concentration and the form of impurities which exists in the anode. The external factors include the concentration of the dissolved oxygen and the impurity ions in electrolyte or the electrolytic condition such as current density.The anode impurities showed different behaviour of dissolution state according to the various forms of existence and the varying chemical properties of these elements or compounds. The anode slimes are formed either by dissolving of these impurities in the electrolyte at the anode or by remaining on the anode surface. The amount of these slimes greatly affects the occurence of passivation.It was clarified that the coexistence of oxygen together with elements such as S, As and Bi in anode affects the amount of slime, adhesiveness and therefore also affects passivation. The possibility of passivation increased markedly with increasing current density, dissolved oxygen, impurity ions, as well as the concentration of H2SO4.
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The interaction between chloride and thiourea in copper electrodeposition in a sulfate-plating bath was investigated. The sole addition of thiourea to the bath increased the polarization of the electrode potential during copper deposition, leading to very fine and smoothly structured deposit but with microscopic nodules distributed over the surface. When chloride was added to a plating solution containing thiourea, the copper deposition mechanism was changed, showing a depolarization of the electrode potential, and the copper deposits were found to have a relatively rougher microstructure, but without the formation of microscopic nodules. However, rough deposit surfaces having no distinct pattern were formed at the macroscopic scale. Observations of roughening evolution show that the rough surface was initiated from small holes formed across the deposit surface during the initial stage of deposition that eventually developed into visibly rough deposits. The copper deposition inside these holes and at other areas was expected to undergo different deposition mechanisms. Copper deposition in the areas that ultimately developed into holes was almost totally inhibited by the thiourea–Cu(I)–chloride complex film, not just in the grain growth process, but over practically the entire electrodeposition process. Conversely, copper deposition occurred in other areas under conditions where nucleation proceeded, but grain growth was inhibited to produce a fine, homogeneous microstructure. An uneven deposit surface that had different microscopic structures in different areas was then formed. The structure of the thiourea–Cu(I)–chloride film was strongly affected by the current density and appeared to break down completely if sufficiently high current density was applied to yield a fine and homogeneous microstructure that was also macroscopically smooth.
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Antimony- and bismuth-rich copper anodes, anode slimes and decopperized anode slimes from industrial copper electrorefineries were studied mineralogically. Antimony in the anodes occurs mainly as Cu-Pb-As-Sb-Bi oxide inclusions along the copper grain boundaries; bismuth is mainly present as Cu-Pb-As-Sb-Bi oxide, Cu-Bi-As oxide, Cu-Pb-As-Bi oxide and Cu-Bi oxide inclusions. Sb and Bi partly dissolve during electrorefining, but extensively reprecipitate as As-Sb oxide, As-Sb-Bi oxide and SbAsO4. The presence of As results in the precipitation of essentially all the Bi as BiAsO4. The decopperizing process dissolves much of the Sb and Bi, although the majority of the BiAsO4 phase remains unaffected. Subsequently, some of the dissolved Sb and Bi reprecipitates as various oxide, sulphate and arsenate species. X-ray absorption near-edge structure (XANES) analyses suggest about 70% of the antimony in the anode slimes is present in the pentavalent oxidation state. The XANES analyses indicate that most of the Bi in all the slimes samples is present in the trivalent oxidation state.
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In the present research, an effort has been made to prepare copper salt/powder from the copper bleed stream generated during the electrowinning of pure copper from the copper anode in a copper smelter. Various approaches have been opted for the complete recovery of copper values such as: evaporation–crystallization, electrolytic process, and direct hydrogen reduction. Physical and chemical properties of copper powder/salt produced from the large-scale experiments from actual plant and model solutions have been evaluated for P/M applications and compared with the standard properties. Thus, mixed crystal suitable for recycling back to the system as a makeup salt containing nickel in a tolerable range could be recovered by evaporation and crystallization of the bleed stream up, to 50%. Copper powder recovery by the electrolysis process at a current density of 700 A/m was about 95%. Scanning electron microscope examination showed that the powder was dendritic in nature. On annealing, the purity of the copper powder was found to be 99.95%. The annealed powder had apparent density of 3.04 g/cc, hydrogen loss 0.72%, and acid insoluble as 0.27%. On compaction of 99% and the annealed powder had an apparent density of 3.50 g/cc, flow rate 35.6 g/min, hydrogen loss 0.195%, purity 99.8%, and green density of 8.57 g/cc while the powder from the actual plant solution was found to have an apparent density of 3.49 g/cc, flow rate 46.0 g/min, hydrogen loss 0.598%, purity 99.4%, and green density 8.57 g/cc for the powder
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When nickel concentration increases in the copper sulphate electrolyte during electrolysis, it starts electrodepositing on the copper cathode thereby affecting the purity of the copper. In order to produce high quality copper cathodes with less than 1 ppm Ni, it became necessary to bleed-off large volumes of foul electrolyte contaminated with nickel and other impurities. The study reported in this paper was part of the effort aimed at devising a cost effective and an ecofriendly method for the production of value added powders from a waste stream, for P/M application. A part of copper salts and regenerated acid was used back into the system. As discussed in our paper on copper recovery from copper bleed stream (CBS), a process involving decopperisation and crystallisation–solvent extraction (SX) separation–electrowinning (EW) has been attempted as an alternative to the conventional process. Optimum conditions for nickel recovery from this type of solution have been investigated through a series of experiments carried out in a rectangular electrolytic bath with SS as cathode and Pb–Sb as anode. A quantitative and selective recovery was found for nickel deposition under suitable conditions. The purity of the electrolytic nickel powders so produced was found to be 99.89%. The compact density of the annealed nickel powder was 7.72 g/cc. Other properties of the nickel powders such as flow-ability, particle size, etc. were also evaluated to assess its suitability for its use in P/M applications.
Article
Most by-product gold comes from the processing of copper refinery anode slimes that are generated during the electrorefining of copper anodes. In the copper anodes, the gold occurs in solid solution in the copper crystals. During electrorefining, the copper dissolves and the associated gold is released. Some of the gold reports as tiny metallic gold particles in the anode slimes. The gold shows a strong affinity for the selenide phase, and some of the metallic gold nucleates on the selenide particles. Some gold also appears to dissolve in the sulfate electrolyte, possibly because of the presence of chloride and thiourea. The dissolved gold subsequently precipitates as a minor constituent of a complex oxidate phase and reacts to form a solid solution in the selenide phase and a discrete Ag-Au-Cu selenide phase. Decopperizing of the anode slimes concentrates the gold as metallic gold and an Ag-Au selenide phase (Ag3AuSe2). The metallic gold shows a strong affinity for selenium, and the Ag-Au selenide phase appears to form during decopperizing, becoming prevalent under high-temperature and pressure-leaching conditions. Also, the silver selenide phase becomes enriched in gold.
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The effect of trivalent arsenic on the removal mechanism of antimony and bismuth from copper electrolyte was investigated. The electrolyte was filtered and the precipitate structure, morphology and composition were analyzed by means of chemical analysis, scanning electron microscopy, transmission electron microscopy, energy dispersive spectra, X-ray diffraction, and infrared spectroscopy. The precipitate in the form of fine spherical particles mainly consists of As, Sb, Bi and O elements. The characteristic bands in the IR spectra of the precipitate are O–H, As–OH, As–OX (X = As, Sb), As–O–Sb, Sb–OY (Y = As, Sb, Bi) and O–As–O. The precipitate is a mixture of microcrystalline (Sb, As)2O3, BiSb2O7, and an amorphous phase. The impurities of Sb and Bi are effectively removed from copper electrolytes by trivalent arsenic owing to these precipitates.
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Extractants and processes used and proposed for recovery of arsenic, antimony and bismuth from copper electrolytes are presented and discussed. The use of the following extractants is duscussed: tributyl phosphate, partial esters of phosphoric acid (mono(2-ehtylhexyl)phosphoric acid, bis(2-ethylhexyl)phosphoric acid and mono(isooctadecyl) phosphoric acid, - DS 5834), esters of alkylphosphonic acids, trialkylphosphine oxide, CYANEX® 923 extractant, hydroxamic acids, LIX 1104, alcohols (2-ethyIhexanol and others), hydrophobic diols and alkylpolyphenols. The chemistry and processes are presented and discussed.
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A couple of refineries have adopted the solvent extraction (SX) process in place of the electrolytic route which is commonly employed for the purification of copper electrolyte with respect to various impurities. The SX process based on TBP (Tri n-Butyl Phosphate) solvent is particularly effective in the separation of arsenic from the electrolyte. Also, an ion-exchange (IX) process using a chelating resin, has been developed and employed in three other refineries for the removal of antimony and bismuth impurities from the electrolyte through preferential adsorption.The paper presents the results of the experimental studies as well as of the operation trials conducted in these refineries on the purification of the copper electrolyte by the removal of Va group elements employing the SX and IX processes. The paper also discusses the details of the investigations carried out on a} the revovery of TBP from the extraction raffinate by scrubbing with carbon tetra chloride, b) preferential sulfidation of copper in arsenate solution, c) the recovery of arsenic tri-oxide powder by freeze-melt technique, d) development of a closed circuit stripping system involving regeneration of ammonia by addition of lime to NH3-(NH4) 2, S04 stripping solution and e) the cyclic use of HCl-NaCl eluant in a chelating resin process of regeneration of HCl.
Article
Bleed stream from electro refining step of copper smelter was processed to recover the metals as high value products such as copper and nickel powders or salts. The process consists of partial decopperisation of the bleed stream followed by crystallization of a mixed salt of copper and nickel sulphate, leaching of the mixed salt, removal of iron, solvent extraction for the separation of copper and nickel and winning the solution to produce metal powders. After partial decopperisation of copper bleed stream, the resultant solution was subjected to crystallization which produces composite crystals with the chemical composition of 8.4–12.5% Cu, 13.7–14.38% Ni and 1–2 ppm of Fe as impurity. This mixed salt was leached with water and was treated for iron precipitation. The purified solution was subjected to solvent extraction using two solvents namely LIX 84 or Cyanex 272. A 20% LIX 84 in kerosene extracted 99.9% copper and 0.059% nickel at a pH of 2.5, similarly a 5% Cyanex 272 in kerosene extracted 98.06% copper and 0.51% nickel at a pH of 4.85. LIX 84 was used for metal separation in the mixer-settler unit and a flow sheet was developed using this solvent. The pure solutions of copper after stripping it from the loaded organic and nickel left in the raffinate were further electrolysed to produce pure copper (99.9%) and nickel (99.8%) powders, alternatively pure sulphate salts could also be crystallized. Since it is well known that Cyanex 272 is used for the separation of cobalt and nickel, a few experiments were performed on the extraction of copper by using Cyanex 272. A complete study is yet to be done to develop a flow sheet by using this solvent.
Article
Densities, viscosities, electrical conductivities and specific heats of solutions containing copper, nickel, arsenic, iron and sulphuric acid in the concentration ranges of copper electrorefining and electrowinning electrolytes have been measured. Equations are presented for calculating these properties as a function of electrolyte composition and temperature.
Article
The phrase “purification of copper refinery electrolyte” is misleading since typically, impurities are controlled by withdrawing a bleedstream of the circulating electrolyte. However, solvent extraction and ion exchange have also found some application in impurity control. This article describes conventional practice, including treatment of the bleedstream, and other attempts at electrolyte purification. Impurities to be discussed include Sb, Bi, As, Ni, Ca, ammonia, and organic fragments generated from hydrolysis of conventional cathode growth-modifying addition agents.
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The development of the CollaMat glue measuring system started at Norddeutsche Affinerie (NA) in 1986. Since 1989, CollaMat has been used for continuous glue measuring in NA’s copper tankhouse. In addition, the system is used under license worldwide in ten tankhouses. This paper provides an overview of basic CollaMat investigations in the laboratory as well as NA experiences in the production plant.
Article
Nickel-bearing copper anodes and anode slimes were studied using a variety of mineralogical and chemical techniques. In anodes containing <;0.3 pct Ni, the nickel occurs only in solid solution in the copper matrix. This nickel dissolves simultaneously with the copper during electrorefining, but a small amount reprecipitates as copper-nickel sulfate or a complex Ni-bearing Cu-Ag-As-Se-S oxidate phase in the anode slimes. In anodes containing >0.3 pct Ni, NiO crystals also form. The presence of the Cu-Ni-Sb oxide, kupferglimmer, in the anode depends on its antimony content. Kupferglimmer is prevalent in nickel-rich anodes with high Sb contents (>200 ppm) but is not found in similar anodes with Sb contents <200 ppm. Various Cu-Ni and Ca-Cu-Ni silicate inclusions are present. Depending on the iron content of the anode, Fe-bearing NiO, NiFe2O4, and other Ni-bearing iron oxide phases also may be present. All of the oxidate nickel phases remain largely undissolved during electrorefining and concentrate in the anode slimes.
Article
Copper bleed solution generated from an Indian Copper smelter contains high amount of copper and nickel along with several impurities. Attempts have been made to develop a new process for the production of pure copper powder from such streams. The purity of the electrolytic copper powder produced from such bleed streams was found to be 99.93%. Properties such as compact density of the annealed copper powder, flow-ability, particle size, etc. were evaluated and were found to be suitable for the powder metallurgical applications.
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