BONSEYES: Platform for Open Development of Systems of Artificial Intelligence: Invited paper

Abstract

The Bonseyes EU H2020 collaborative project aims to develop a platform consisting of a Data Marketplace, a Deep Learning Toolbox, and Developer Reference Platforms for organizations wanting to adopt Artificial Intelligence. The project will be focused on using artificial intelligence in low power Internet of Things (IoT) devices ("edge computing"), embedded computing systems, and data center servers ("cloud computing"). It will bring about orders of magnitude improvements in efficiency, performance, reliability, security, and productivity in the design and programming of systems of artificial intelligence that incorporate Smart Cyber-Physical Systems (CPS). In addition, it will solve a causality problem for organizations who lack access to Data and Models. Its open software architecture will facilitate adoption of the whole concept on a wider scale. To evaluate the effectiveness, technical feasibility, and to quantify the real-world improvements in efficiency, security, performance, effort and cost of adding AI to products and services using the Bonseyes platform, four complementary demonstrators will be built. Bonseyes platform capabilities are aimed at being aligned with the European FI-PPP activities and take advantage of its flagship project FIWARE. This paper provides a description of the project motivation, goals and preliminary work.

Full text

BONSEYES: Platform for Open Development of Systems of
Artificial Intelligence
Invited paper
Tim Llewellynn
nVISO SA
Switzerland
tim.llewellynn@nviso.ch
M. Milagro
Fernández-Carrobles
University of Castilla-La Mancha
Spain
Oscar Deniz
University of Castilla-La Mancha
Spain
Samuel Fricker
i4Ds Centre for Requirements
Engineering, FHNW
Switzerland
Amos Storkey
University of Edinburgh
United Kingdom
Nuria Pazos
Haute Ecole Specialisee de Suisse
Occidentale
Switzerland
Gordana Velikic
RT-RK
Serbia
Kirsten Leufgen
SCIPROM SARL
Switzerland
Rozenn Dahyot
Trinity College Dublin
Ireland
Sebastian Koller
Technical University Munich
Germany
Georgios Goumas
The Institute of Communications and
Computer Systems of the National
Technical University of Athens
Greece
Peter Leitner
SYNYO GmbH
Austria
Ganesh Dasika
ARM Ltd.
United Kingdom
Lei Wang
ZF Friedrichshafen AG
Germany
Kurt Tutschku
Blekinge Institute of Technology
(BTH)
Sweden
ABSTRACT
The Bonseyes EU H2020 collaborative project aims to develop a
platform consisting of a Data Marketplace, a Deep Learning Toolbox,
and Developer Reference Platforms for organizations wanting to
adopt Articial Intelligence. The project will be focused on using
articial intelligence in low power Internet of Things (IoT) devices
("edge computing"), embedded computing systems, and data center
servers ("cloud computing"). It will bring about orders of magnitude
improvements in eciency, performance, reliability, security, and
productivity in the design and programming of systems of articial
intelligence that incorporate Smart Cyber-Physical Systems (CPS).
In addition, it will solve a causality problem for organizations who
lack access to Data and Models. Its open software architecture will
facilitate adoption of the whole concept on a wider scale. To evaluate
the eectiveness, technical feasibility, and to quantify the real-world
improvements in eciency, security, performance, eort and cost
of adding AI to products and services using the Bonseyes platform,
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ACM ISBN 978-1-4503-4487-6/17/05.
DOI: http://dx.doi.org/10.1145/3075564.3076259
four complementary demonstrators will be built. Bonseyes platform
capabilities are aimed at being aligned with the European FI-PPP
activities and take advantage of its agship project FIWARE. This
paper provides a description of the project motivation, goals and
preliminary work.
KEYWORDS
Data marketplace, Deep Learning, Internet of things, Smart Cyber-
Physical Systems
ACM Reference format:
Tim Llewellynn, M. Milagro Fernández-Carrobles, Oscar Deniz, Samuel
Fricker, Amos Storkey, Nuria Pazos, Gordana Velikic, Kirsten Leufgen,
Rozenn Dahyot, Sebastian Koller, Georgios Goumas, Peter Leitner, Ganesh
Dasika, Lei Wang, and Kurt Tutschku. 2017. BONSEYES: Platform for Open
Development of Systems of Articial Intelligence. In Proceedings of CF’17,
May 15-17, 2017, Siena, Italy, 2017, 6 pages.
DOI: http://dx.doi.org/10.1145/3075564.3076259
1 INTRODUCTION
Articial intelligence (AI) is developing much faster than we thought
and specially its emerging branch called deep learning, which is
transforming AI. Deep learning relies on simulating large, multi-
layered webs of virtual neurons. This enables a computer to learn
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CF’17, May 15-17, 2017, 2017, Siena, Italy T. Llewellynn et al.
to recognize abstract patterns and solve any general pattern recog-
nition problem. The results using the new methodology have been
impressive, and both academia and the industry are currently mov-
ing at lightspeed towards the deep learning paradigm.
Thousands or millions of training examples are currently re-
quired by these state-of-the-art machine classication algorithms,
while in contrast humans are able to learn from few examples. The
current trend for improving AI to tackle increasingly complex prob-
lems is therefore a brute force solution to scale up the infrastructure:
more data, more computing power, more neurons in deep learning
algorithms, see for instance [
2
]. Tuning the very large number of
latent parameters controlling the resulting deep architectures is a
dicult optimisation problem where over-tting (or learning the
noise) is one of the major issues. More recent works aim at reduc-
ing the dimensionality of these architectures by imposing sparsity
constraints in the latent space of parameters. The ability for the
user to introduce any prior knowledge to help learning from small
datasets is also essential for ecient architectures to be designed for
a wide range of applications where data is scarce. Moreover learn-
ing eciently from unstructured (or poorly structured) datasets
and data streams that have noise is still currently a challenge for
deep architectures.
Another problem arising from the increase of the deep learning
techniques is related to GPUs. GPUs are regarded as one of the main
drivers of deep learning. As such, the DNN (Deep Neural Network)
models have, mostly, been designed with the GPU computational
model in mind and may not be suitable for other platforms. On the
other hand, the existing models have been mostly hand-crafted with
no proof of optimality. Therefore, embedding these networks into
other platforms may require either 1) developing new networks
taking into account the specications of the target platforms, or 2)
adapting the existing models to the target platforms. This will have
a direct impact on power eciency, which is a key dierentiator in
the case of embedded (and wearable) platforms.
On the other hand, despite advances in data management and
cloud infrastructure, AI systems are still predominantly developed
as monolithic systems. A key reason is that oerings like Microsoft
Azure Marketplace, Google Cloud Machine Learning, and IBM Wat-
son require deployment of data into the clouds of the respective
vendor and the use of the learning tools of these vendors. This
approach makes a marketplace unattractive for data providers that
are not willing to disclose their data, prevents scenarios in which
data is produced by a network of devices (e.g. as in IoT), and im-
pedes the emergence of a thriving ecosystem of data providers,
algorithm developers and model trainers, and AI system developers.
As a result, companies own the full AI systems development value
chain instead of spreading the cost of ownership and accelerating
time-to-market and quality through reuse of data and models.
Finally, the massive data collection required for deep learning
presents obvious privacy issues [
11
]. Users’ personal, highly sensi-
tive data such as photos and voice recordings is kept indenitely by
the companies that collect it. Users can neither delete it, nor restrict
the purposes for which it is used. Furthermore, centrally kept data
is subject to legal subpoenas and extra-judicial surveillance. Many
data owners for example, medical institutions that may want to
apply deep learning methods to clinical records are prevented by
privacy and condentiality concerns from sharing the data and
thus beneting from large-scale deep learning. Generally the best
way to protect privacy is to conne it to the device so that sensor
data never leaves it. This approach requires training of networks
or adaptation of networks in the device.
In this context, the Bonseyes
1
collaborative project has been
proposed and recently funded by the European Comission through
its Horizon 2020 Research and Innovation Programme. In terms of
scientic and technological background, the Bonseyes Project Con-
sortium consists of leading researchers who have a strong mix of
knowledge. This includes statistical and machine learning, embed-
ded software and compiler optimization, power ecient hardware
architectures, image processing and computer vision, cloud and
distributed systems and software ecosystems and requirements
engineering.
1.1 Objectives
The Bonseyes project aims to create a platform for open develop-
ment of systems of AI, which is clearly emerging as a key growth
driver in Smart CPS systems in the next decade. This is in contrast
to monolithic system design currently used in closed end-to-end
solutions. The main objectives of the project are summarized in
Table 1.
2 METHODOLOGY
Bonseyes is a platform for open development in building, improving,
and maintaining systems of AI in the age of the IoT. Figure 1 shows
the problem that Bonseyes is solving, which is that Monolithic
development of Systems of AI give rise to the Datawall eect that
only large companies with end to end solutions can pass. In addition,
Fig. 2 shows a summary of the target platforms that will be used in
the project.
2.1 Data Marketplace
The objective of the Data Marketplace is to enable a modularized
AI systems development value chain by oering the publishing,
trade, and acquisition of data, metadata, and models. Data are mea-
surements from the real world, typically made available as streams
of data or as batches of archival data. Metadata enhances that data
by capturing pre-processing results, classifying the primary data
according to expert knowledge (e.g. for supervised learning), spec-
ifying the context the data relates to, and documenting feedback
from AI system developers and users (e.g. for online learning). AI
models are created by applying learning algorithms on data and
metadata. The models embed knowledge about the data and classi-
cations and enable automated classication. All three components
are used by AI system developers as components to build smart
systems.
2.2 Deep Learning Toolbox
The objective of the Deep Learning Toolbox is to provide a set
of deep learning components that are tailored for embedded, con-
strained, distributed systems operating in real environments with
noisy, sometimes missing data. The toolbox will enable the selection
1www.bonseyes.com
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BONSEYES: Platform for Open Development of Systems of Artificial Intelligence CF’17, May 15-17, 2017, 2017, Siena, Italy
DATA
WALL
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» CHICKEN/EGG PROBLEM
COMPANIES WITH
END-TO-END SOLUTIONS
» VIRTUOUS CIRCLE
OTHER COMPANIES
WITHOUT CRITICAL MASS
Figure 1: The problem that Bonseyes is solving.
DATA
MARKETPLACE
DEEP
LEARNING
TOOLBOX
SYSTEMS OF
ARTIFICIAL
INTELLIGENCE
DATA FEEDBACK
MODEL CODE
DEVELOPMENT PLATFORM
FOR
FROM
CLOUD EDGE
TO
COMPUTING
DATA
CENTER
EMBEDDED
COMPUTING
LOW-POWE R
IOT DEVICE
DATA KNOWLEDGE MODEL APPLICATION
SERVICE & TOOLS
DATA
PROVIDER
ANNOTATOR DATA
SCIENTIST
APP
DEVELOPER
INFRASTRUCTURE PROVIDER
UNIVERSAL
REFERENCE PLATFORM
OPEN SOURCE
FRAMEWORKS
»
TENSORFLOW
»
CAFFE
»
THEANO
»
CPU
»
DSP
»
VPU
»
GPU
Figure 2: Target platforms.
and optimisation of tools for a particular task. The key components
of the toolbox are:
2.2.1 Deep learning methods. Methods that are exible in terms
of representation: number of bits precision, hashing methods, pa-
rameter sharing structure, memory usage, sparsity, and robustness.
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CF’17, May 15-17, 2017, 2017, Siena, Italy T. Llewellynn et al.
Table 1: Bonseyes objectives
Objectives
Accelerate the design and programming of systems of
arti�cial intelligence. Design and implement a Data
Marketplace. Reusing of data, meta data,and models among
separate legal entities to reduce design and development time
in building systems of AI as compared to existing monolithic
system of systems design and development approaches.
Reduce the complexity in training deep learning models
for distributed embedded systems. Provide the fundamental
tools for deep learning for constrained architectures. Design and
implement noise resistant machine learning capabilities able to
learn eciently from unstructured, partially labelled datasets.
Design and implement sparse models to scale and adapt to
various computational architectures. Enable users for designing
deep learning models taking advantage of prior domain
knowledge information.
Foster "embedded intelligence" on low power and resource
constrained Smart CPS. Bonseyes will enable the development
of deep learning models tailored for low power embedded
systems by incorporating architecture-awareness in existing
standardised deep learning packages via an open source toolbox.
Deep Learning Toolbox will allow deep models to be designed
and eciently deployed across multiple embedded systems and
support multiple low power developer reference platforms.
Demonstrate the whole concept in four key challenging
scenarios. Demonstrate the technical feasibility of Bonseyes
with at least three Developer Platforms in four scenarios:
automotive safety, automotive personalisation, consumer
devices, health-care. Each scenario will involve the creation
of a specic application using the Data Marketplace together
with one or more Developer Platforms to build systems of AI
2.2.2 Cost sensitive optimisation methods. Methods (e.g. Bayesian
optimisation) that can optimise a particular deep learning archi-
tecture for a particular embedded environment by incorporating
the particular individual costs (e.g. cost of using memory resources,
cost of processing power, energy cost, training time costs etc.) of
that environmental system into the optimisation. This includes
obtaining reduced dimensional parametrisations for particular ar-
chitecture classes, rather than just individual architectures. We will
explicitly encode for the costs of on-device learning, and costs (e.g.
communication costs) for cloud-based learning.
2.2.3 Component valuation. The value of a given deep learning
component in a given environment will be considered an integral
part of the component itself. The Deep Learning Toolbox will also
include a measure of when a component would be useful. The infor-
mation value of both data and deep-learning components can then
provide a structural marketplace for deciding what components are
best used with what data.
2.2.4 Transferability metrics. A component can either be a free
form deep learning model that needs optimizing for a particular
data source, or a learnt component, already optimised on dierent
data source, or cost function.
2.2.5 Structure-sensitive implementation. Often generic low-level
linear algebra libraries are used for implementing deep neural net-
works, but such libraries rarely provide the best computation for the
restricted architectures needed for embedded systems. For example,
both structural sparsity and dynamic sparsity (associated with the
use of sparse activation functions) provide substantial opportunity
for computational saving.
2.2.6 Implementation and tailoring of these components for par-
ticular reference architectures. The targets across all components
are the real systems that the deep learning components need to
work on. All development will use specic embedded environments
as exemplars. The specic development of deep learning methods
for the individual environments will form a substantial part of the
development eort.
2.3 Universal Developer Reference Platforms
The Deep Learning Toolbox will provide a unied framework for
accelerating Deep Convolutional Neural Networks on resource
constrained architecture-dependent embedded systems. A number
of platforms will be made available with pre-integrated middle-
ware via open source packages. This oers developers a number of
advantages:
•
Heterogeneous: Supports a wide array of CPU-based plat-
forms, VPUs, and DSPs.
•
Performance: Optimised code for reduced memory, power,
and CPU overhead.
•
Scalability: Ability to run models on the cloud or on em-
bedded systems.
•
Congurability: Support for multiple types of deep neural
network architectures.
•
Concurrent Classication & Learning: Support for incre-
mental learning at runtime through feedback APIs, which
allows for more exible and general network.
The following platforms will be supported by consortium part-
ners ARM, RT-RK, and HES-SO:
•
ARM-based platforms are used extensively when deploying
articial intelligence in embedded and automotive envi-
ronments. Optimizing the deep learning toolbox for an
ARM-based platform is a clear choice.
•
Low power CPU/VPU/GPU-based platforms are emerg-
ing for always-on visual intelligence applications based on
low power vision processors. Standing at the intersection
of low-power and high performance, these platforms en-
able the development of embedded intelligent solutions.
Equipped with multiple sensors, cameras and communica-
tion means, they will be used during the development and
validation stages of the networks prior to deployment and
integration.
•
DSP (Digital Signal Processor)-based platforms provided
by RT-RK have been successfully deployed for a spectrum
of consumer electronics applications, complex industrial
settings, and highly demanding automotive environments
and military applications. The board will support up to
ten cameras, basic and advanced warning systems, active
control systems and semi-autonomous applications.
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BONSEYES: Platform for Open Development of Systems of Artificial Intelligence CF’17, May 15-17, 2017, 2017, Siena, Italy
Apart from the platforms above, Android smartphones will be
also considered in the Bonseyes project.
2.4 Systems of arti�cial intelligence
Most AI systems involve some sort of integrated technologies, for
example the integration of speech synthesis technologies with that
of speech recognition. However, in recent years there has been an
increasing discussion on the importance of systems integration as
aeld in its own right. AI integration has recently been attracting
attention because a number of (relatively) simple AI systems for spe-
cic problem domains (such as computer vision, speech synthesis,
etc.) have already been created. Integrating what is already available
is a more logical approach to broader AI than building monolithic
systems from scratch. Within Bonseyes, four demonstrators will be
used to build such systems of AI (c.f. section 2.7).
2.5 Computing Power
The objective of the Computing Power component is to provide
resources in terms of CPU, memory, and storage to provide the
capabilities for the Data Marketplace. Bonseyes will use a well-
balanced approach for providing the training in the cloud backend
with sucient computing power. The balance aims at economic
and energy eciency, robustness, functional capabilities and data
privacy and isolation. It will mainly be based on the use of the
EU agship platform FIWARE
2
. The Bonseyes project will use a
balanced and agile concept of non-commercial, commercial and,
if necessary, self-operated compute infrastructure sourced from
FIWARE LAB
3
. These options include possible special support by
FIWARE Lab. The balance will reect on the economics, availability
and stability of the compute resources and the needs of the use
cases. The consideration of available resources will increase the
agility of the Bonseyes concept of a system of AI systems. The
detailed balance will be determined during the architecting phase
of the Bonseyes project.
2.6 Data Tools
Data Tools aims to provide tools to allow data collection, curation,
and augmentation: downloading, uploading, versioning, labelling,
evaluating, crowdsourcing, and editing data necessary for training
models using the Deep Learning Toolbox. One key area will be
on IoT data collection by providing a programming model and
micro-kernel style runtime. That can be embedded in gateways and
small footprint edge devices enabling local, real-time, analytics on
the continuous streams of data coming from equipment, vehicles,
systems, appliances, devices and sensors of all kinds. By performing
real-time analytics on the edge device, only anomalies or unseen
data can be transmitted for storage and archival used for learning.
2.7 Demonstrators
For demonstration, four scenarios in three sectors (automotive, con-
sumer, and healthcare) will be considered: automotive intelligent
safety, automotive cognitive computing, consumer emotional vir-
tual agents, and healthcare patient monitoring. These use cases
2www.ware.org
3lab.ware.org
have been considered as they are far reaching across a number of
high-value industries with high social impact.
2.7.1 Automotive Intelligent Safety. Autonomous systems are
able to control steering, braking, and accelerating and are already
starting to appear in cars. These systems require drivers to keep an
eye on the road and hands on the wheel. But the next generation of
self-driving systems [
4
], [
8
] could be available in less than a decade
and free drivers so they can work, text, or just relax. Ford, General
Motors, Toyota, Nissan, Volvo, and Audi have all shown ocars
that can drive themselves. They all have declared that within a
decade they plan to sell cars with some form of advanced automa-
tion. These cars will be able to take over driving on highways or to
park themselves in a garage.
In this demonstrator, Bonseyes will be used to build a system of AI
that will use scene and people detection (contextual awareness) and
driver distraction (driver monitoring) to trigger active or passive
safety systems. It will involve the following AI systems: per-pixel
scene labelling, scene detection, people detection, and driver dis-
traction.
2.7.2 Automotive Cognitive Computing. The vehicles of the near
future will be "intelligent". Electronics will bring new capabilities to
every part of the vehicle. New technologies will provide for greater
assistance in navigation, enhanced driver information about the
vehicle, its environment [
10
] and vehicle connectivity. Consumers,
with a plethora of electronic devices that inform them [
5
], entertain
them and keep them safe [
9
], [
6
], will nd themselves enjoying
the overall experience of their vehicles. Connectivity and lifestyle
trends will change the way cars are used. This "experience" will be
a key dierentiator in attracting consumers.
In the Automotive Cognitive Computing Demonstrator, Bonseyes
will be used to build an in-vehicle digital assistant. The in-vehicle
digital assistant will be able to recognise the driver and then person-
alise his/her car experience while learning the driver’s preferences
and allowing natural language interaction within the vehicle and
the driving context. It will provide the driver with personalised
advice on how to interact with the vehicle for route planning, envi-
ronment information, entertainment, etc. It will involve the follow-
ing AI systems: face recognition, demographic detection, emotion
recognition, speech-to-text, and natural language processing.
2.7.3 Consumer Emotional Virtual Assistants. Many institutions
are creating innovation labs aimed at understanding how they can
rewrite their existing applications to improve the technology and
consumer interaction and to provide a more compelling customer
service experience. Human sensor data, such as facial expressions
[
12
], voice input, hand gestures, even brain waves, emotion sensors,
heart beat are being tested as new forms of input [
1
]. While voice re-
sponse systems, haptics (tactile feedback) and holographs are being
tested as new forms of output. These inputs and outputs are being
augmented with AI to make them more useful and human-like
enabling, for example, discourse in natural language and sensing
emotions. Based upon what is learned, a new paradigm will likely
emerge that will fundamentally change the way machines and peo-
ple communicate.
Bonseyes will be used to leverage the increasing amount of compu-
tational capacity of mobile devices to develop real time multimodal
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CF’17, May 15-17, 2017, 2017, Siena, Italy T. Llewellynn et al.
applications. An emotional virtual agent will be implemented for
improving the communication between services and users through
an agent-based application that allows multimodal and emotional
interaction with the users through dierent channels: visual, oral
and written. A use case will be developed showing how multiple
sensing technologies can be combined with object detection to en-
hance consumer interaction in a more natural way. It will involve
the following AI systems: face recognition, multi-modal emotion
recognition, object recognition, and speech-to-text.
2.7.4 Healthcare Patient Monitoring. Patient tracking will be
used to optimise capacity utilisation in diagnostic departments
and reduce waiting times for patients. The vital sensor delivers
data like acceleration, pose, heart rate and others which will be
used to estimate the mobility of the patient and the time needed
to reach the diagnostic department [
3
], [
7
]. Personal recording of
vital parameters and the use of health apps is already widespread
not only in Europe. Hospitals started in the last years to monitor
patient beds, devices and patients by the use of RFID, however,
with the signicant drawback of limited range and necessary huge
installations for the RFID antennas in the corresponding areas. In
the future, it will be focused on patient tracking and monitoring of
dierent vital signals by use of smart low power devices in order
to plan and schedule further diagnostic procedures and calculate
expected stress and therapeutic options by use of deep learning
techniques. Patients scheduled for elective surgery will be equipped
during the diagnosis day with smart devices which track their
position and record and transmit vital signs (heart rate, breathing
rate, pose, skin conduction, etc.). Based on necessary diagnostics
patients will be sent to the respective diagnostic department. The
Deep Learning Toolbox will analyse vital signs data and predict
further diagnostics and stress levels which will be used to adjust
sedation prior to the surgical intervention. Postoperatively, vital
data from the sensors will be used to predict the earliest day of
discharge. It will involve the following AI systems: vital sensors,
and location tracking technologies.
3 CONCLUSIONS
The main challenge and contribution of the Bonseyes collaborative
project is to design and implement highly distributed and con-
nected digital technologies that are embedded in a multitude of
increasingly autonomous physical systems. These systems must
satisfy multiple critical constraints including safety, security, power
eciency, high performance, size and cost. Developing new model-
centric and predictive engineering methods and tools for CPS with
a high degree of autonomy, ensuring adaptability, scalability, com-
plexity management, security and safety providing trust to humans
in the loop. Driven by industrial needs and validated in at least
four complementary use cases in dierent application domains and
sectors. The results are intended to enable integration of broader
development environments and middleware. The merits of the con-
tribution should be made explicit.
4 ACKNOWLEDGMENTS
This project has received funding from the European Union’s Hori-
zon 2020 research and innovation programme under grant agree-
ment No 732204 (Bonseyes). This work is supported by the Swiss
State Secretariat for Education Research and Innovation (SERI)
under contract number 16.0159. The opinions expressed and argu-
ments employed herein do not necessarily reect the ocial views
of these funding bodies.
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