New interconnect modalities such as nodes, buttons, spheres, and pillars have surfaced to meet the limitations of wire diameters in wire wire bonding. New process like electroplating, electroless plating, screening, and in-situ have been developed, and involve new materials such as aluminum, gold, tungsten, titanium, nickel, copper, tin, lead, and silver. A new process tool is developed, which
... [Show full abstract] performs all steps in one controlled chamber without having to remove the wafer and transport it to other process steps. The system maintains a secure manufacturing environment by managing the process and the chemistry.