In so-called MID components, three dimensional components are combined with planar printed circuit boards. In order to form the tracks, two-component injection moulding is employed. In this process, the moulding is made with galvanisable and non-galvanisable plastics. The tracks are then created by metallising in the usual way, (but only the galvanisable plastics), chemical activation, e.g. with
... [Show full abstract] colloidal palladium, followed by electroless deposition and electrolytic copper plating.