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Metal Whiskers: A Discussion of Risks and Mitigation
... These growths are usually electrically conductive and can produce short-circuits in electronics components. Tin whiskers can grow in length from a few µm to several mm and typically have diameters between 1-5 µm [3]. In rare cases tin whiskers can reach lengths over 10 mm [2]. ...
Components soldered with Sn-based alloys are susceptible to the growth of whiskers. Tin whiskers have been proven to be responsible for equipment failures in a wide range of industries. In order to reduce defects in electronic components a new solder alloy is proposed based on the Sn-Cu alloys. The Sn-Cu-Ga alloy utilised in this study was fabricated as a ribbons using melt-spinning method. These ribbons were then soldered onto electroplated tin layers. Preliminary characterization of the solder alloy is presented in this paper, including scanning electron microscopy, EDX mapping and X-ray diffraction.
Qualification, which is the process of demonstrating that a product is capable of meeting specified requirements, is a costly and lengthy part of the product development process. This paper discusses the challenges that companies face when qualifying their products in an environment of abbreviated product development cycles, changing environmental regulations, which require the use of new materials or processes, and a complex and diffuse supply chain. A more comprehensive approach to product qualification involving the use of physics-of-failure principles, prognostics and health management techniques, and qualification at every stage of product development that builds on earlier work and industry standards is presented here.
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