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XIAOXIONG GU[SM] received his Ph.D. in electrical engineering
from the University of Washington in 2006. He joined IBM T. J.
Watson Research Center as a research staff member in January
2007. His current research activities are focused on design,
packaging, integration, and characterization of optoelectronic
and mmWave communication and computation subsystems.
He received SRC Mahboob Khan Outstanding Industry Liaison
Awards in 2012 and 2014, IBM Invention Plateau Awards in
2012 and 2013, a Best Paper Award at IEEE EMC Symposium
in 2013, the Best Conference Paper Award at IEEE EPEPS in
2011, DesignCon Paper Awards in 2008 and 2010, the Best
Session Paper Award at IEEE ECTC in 2007, and the Best Inter-
active Session Paper Award at IEEE DATE in 2008. He is the
chair of THE Professional Interest Community of Electrical Inter-
connect and Packaging at IBM. He currently serves on the
Technical Program Committees for EPEPS, ECTC, EDAPS, and
ALBERTO VALDES-GARCIA is currently a research staff member and
manager of the RF Circuits and Systems Group at IBM T. J.
Watson Research Center. He received his Ph.D. degree in elec-
trical engineering from Texas A&M University in 2006. His cur-
rent research work is on silicon-integrated millimeter-wave
systems for imaging and communications. From 2006 to 2009,
he served in the IEEE 802.15.3c 60GHz standardization com-
mittee. Since 2009 he served as a Technical Advisory Board
member with Semiconductor Research Corporation (SRC),
where he was Chair of the Integrated Circuits and Systems Sci-
ences Coordinating Committee in 2011 and 2012. He holds 17
U.S. patents and is a Co-Editor of the book 60GHz Technology
for Gbps WLAN and WPAN: From Theory to Practice (Wiley,
2011). He is was winner of the 2005 Best Doctoral Thesis
Award presented by the IEEE Test Technology Technical Coun-
cil (TTTC), the recipient of the 2007 National Youth Award for
Outstanding Academic Achievements, presented by the Presi-
dent of Mexico, and a co-recipient of the 2010 George Smith
Award presented by the IEEE Electron Devices Society. In 2013,
he was selected by the National Academy of Engineering for
its Frontiers of Engineering Symposium.
ARUN NATARAJAN received his B.Tech. degree in electrical
engineering from the Indian Institute of Technology,
Madras, in 2001, and his M.S. and Ph.D. degrees in electri-
cal engineering from the California Institute of Technology
(Caltech), Pasadena, in 2003 and 2007, respectively. From
2007 to 2012, he was a research staff member at IBM T. J.
Watson Research Center, and worked on mmWave phased
arrays for multi-Gb/s data links and airborne radar. In 2012
he joined Oregon State University as an assistant professor
in the School of Electrical Engineering and Computer Sci-
ence. His current research is focused on low-power RF
transceivers for IoT as well as mmWave and sub-mmWave
circuits and systems for wireless communication. He
received the National Talent Search Scholarship from the
Government of India (1995–2000), the Caltech Atwood Fel-
lowship in 2001, the Analog Devices Outstanding Student
IC Designer Award in 2004, the IBM Research Fellowship in
2005, and the 2011 Pat Goldberg Memorial Award for Best
Paper in CS/EE/Math in IBM Research.
BODHISATWA SADHU is currently a research staff member at IBM
T. J. Watson Research Center. He received his Ph.D. degree in
electrical engineering from the University of Minnesota, Min-
neapolis, in 2012. For his Ph.D., he worked on wideband cir-
cuits and architectures for software defined radio applications.
Since 2012, he has been working on frequency synthesizers
and mmWave transceivers in the RF/mm-wave Communica-
tions Circuits group at IBM Research. He has authored and co-
authored more than 30 papers, authored the book Cognitive
Radio Receiver Front-Ends — RF/Analog Circuit Techniques
(Springer, 2014), and holds 5 issued U.S. patents with 15+
pending. He was the recipient of the University of Minnesota
Graduate School Fellowship, 2007, 3M Science and Technology
Fellowship, 2009, and the University of Minnesota Doctoral
Dissertation Fellowship, 2011.
DUIXIAN LIU received his Ph.D. degree in electrical engineering
from the Ohio State University, Columbus, in 1990. From 1990
to 1996, he was with Valor Enterprises Inc., Piqua, Ohio, initial-
ly as an electrical engineer and then as chief engineer, during
which time he designed an antenna product line ranging from
3 MHz to 2.4 GHz for the company, a very important factor
for the prestigious Presidential “E” Award for Excellence in
Exporting in 1994. Since April 1996, he has been with the IBM
T. J. Watson Research Center as a research staff member. He
has received three IBM Outstanding Technical Achievement
Awards and one Corporate Award, IBM’s highest technical
award. He was named a Master Inventor in 2007. He has edit-
ed a book, Advanced Millimeter-Wave Technologies — Anten-
nas, Packaging and Circuits (Wiley, 2009) and is a Section
Editor for an upcoming Springer antenna handbook (2015). He
has authored or coauthored more than 100 journal and con-
ference papers. He received the 2012 S. A. Schelkunoff Prize
Paper Award of the IEEE Antennas and Propagation Society.
He has 71 patents issued or pending. His research interests are
antenna design, chip packaging, and communications tech-
SCOTT K. REYNOLDS received his Ph.D. degree in electrical engi-
neering from Stanford University, California, in January 1988.
He joined IBM in 1988, where he worked on a wide variety of
IBM products, including ICs for disk drive channels, electrical
and optical I/O, and RF communication. Beginning in 2003, he
was engaged in development of silicon millimeter-wave ICs
and packaging for high-data-rate wireless links and other
applications, including imaging. He has more than 30 U.S.
patents and many technical publications, including two papers
on 60 GHz wireless transceiver circuits that won the best paper
awards at ISSCC in 2004 and 2006. He went on to manage
the RF Circuits and Systems group at IBM Research from 2010
to 2013. In 2013, he left IBM to start his own business, Tavish
Design, LLC. He continues to consult for IBM on millimeter-
wave IC design and packaging.
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