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Epitaxial growth of Pd2Si films on Si(111) substrates by scanning electron‐beam annealing

AIP Publishing
Applied Physics Letters
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Abstract

Pd2Si films were grown epitaxially onto Si(111) substrates by scanning electron‐beam annealing of deposited Pd films. Single phase silicide formation and epitaxial growth were studied by Nomarski optical microscopy, x‐ray diffraction analysis, and Rutherford backscattering and channeling techniques. The crystalline quality of the electron‐beam‐annealed Pd2Si films was weakly dependent on annealing conditions and somewhat worse than that of furnace‐annealed films.
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Downloaded 07 Jun 2006 to 131.112.125.102. Redistribution subject to AIP license or copyright, see http://apl.aip.org/apl/copyright.jsp
Downloaded 07 Jun 2006 to 131.112.125.102. Redistribution subject to AIP license or copyright, see http://apl.aip.org/apl/copyright.jsp
Chapter
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Epitaxial growth of CoSi 2 films on Si substrates and the growth of Si films on the Si(111)/CoSi 2 structure are investigated. Solid phase epitaxy is used to grow both CoSi 2 and Si films. Molecular beam epitaxy is also used to grow the top Si films in the double heteroepitaxy. It has been found that two dominant factors required to obtain good epitaxial films are substrate cleaning by lamp heating before the film deposition and annealing of the deposited films without exposure to air. Excellent crystalline quality of the CoSi 2 films on (111) Si substrates and good quality of the Si films on the Si(111)/CoSi 2 structure have been demonstrated by ion channeling and backscattering techniques and reflection electron diffraction analysis. Uniformity of the grown films has also been examined by scanning electron microscopy.
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Transition metal silicides have, in the past, attracted attention because of their usefulness as high temperature materials and in integrated circuits as Schottky barrier and ohmic contacts. More recently, with the increasing silicon integrated circuits (SIC) packing density, the line widths get narrower and the sheet resistance contribution to the RC delay increases. The possibility of using low resistivity silicides, which can be formed directly on the polysilicon, makes these silicides highly attractive. The usefulness of a silicide metallization scheme for integrated circuits depends, not only on the desired low resistivity, but also on the ease with which the silicide can be formed and patterned and on the stability of the silicides throughout device processing and during actual device usage. In this paper, various properties and the formation techniques of the silicides have been reviewed. Correlations between the various properties and the metal or silicide electronic or crystallographic structure have been made to predict the more useful silicides for SIC applications. Special reference to the silicide resistivity, stress, and oxidizability during the formation and subsequent processing has been given. Various formation and etching techniques are discussed.
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Translation and revision of Der Aufbau der Zweistofflegierungen "Sponsored by the United States Air Force Through the Wright Air Development Center, Air Research and Development Command under Contract no. AF33(616)-193 with Armour Research Poundation of Illinois Institute of Technology, Chicago" "Suplemento anexo" Incluye bibliografía
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