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The U.S. Production of copper chemicals from secondary and by-product sources
Abstract and Figures
The escalating raw material costs for producing copper chemicals have accelerated efforts to procure inexpensive low-grade feedstocks from secondary and by-product sources. The major copper chemicals produced in the U.S., such as copper sulfate, cuprous and cupric oxide, copper hydroxide, and copper chloride are derived almost entirely from secondary sources. The classic secondary copper feedstocks include: wire choppings, mill scale, scrapped brass and bronze, auto radiators and air conditioner heat exchangers, shredder pickings, spent etchant and pickling solutions, circuit board manufacturing trim and populated boards; copper clad steel and aluminum, and spent catalyst, including metallic copper and copper-zinc oxide.
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... The diverse range of applications of copper in different alloys and products presents challenging problems for recycling. 9,176 Many of the recycling processes to recover copper from mixtures with other metals are based on hydrometallurgy using sulfate, chloride, or ammoniacal streams. Copper can be selectively extracted using phenolic oximes 169,[176][177][178][179][180] or diketones, 169,176,179 even when the aqueous feed contains Cu-complexing agents which have been used in etching processes to generate the waste stream. ...
... 9,176 Many of the recycling processes to recover copper from mixtures with other metals are based on hydrometallurgy using sulfate, chloride, or ammoniacal streams. Copper can be selectively extracted using phenolic oximes 169,[176][177][178][179][180] or diketones, 169,176,179 even when the aqueous feed contains Cu-complexing agents which have been used in etching processes to generate the waste stream. Where the small volumes of copper recovered by solvent extraction in such plants do not justify the capital investment of an electrowinning plant the strip solution can be evaporated to generate a copper salt. ...
... Old Bridge Chemicals (Old Bridge, NJ) leaches ball mill fines produced by milling and screening skimmings raked from the surface of brass melts used to produce sheet and rod [18,19]. Sulfuric acid leaching of these fines dissolves copper and zinc. ...
Most lead and zinc secondaries are recycled via pyrometallurgical
smelting processes. Many of the problems historically
encountered in secondary smelters have been
solved by the addition of physical concentration and/or
hydrometallurgical processing steps, with resulting notable
environmental benefits. During the past two decades, remarkable
advances have been achieved by recycling spent
lead-acid battery components. Interaction between primary
and secondary zinc producers, the fertilizer industry,
and the zinc chemical industry has substantially decreased
waste generation. In this paper, North American secondary
lead and zinc operations are described that include: conventional
smelters, EAF-dust processors, and zinc sulfate/
fertilizer producers. The descriptions cover plant capacities,
technologies, and outputs.
Keywords:
Lead – Zinc – Recycling – Feedstocks – Production
... This has caused severe depletion of the primary copper ore reserves. Thus, to meet the future worldwide growing demand of copper, there is no other option left than conserving the metal by maximum the recycling of secondaries and wastes in addition to the available primary resources of copper (Agrawal and Sahu, 2010;Amer, 2002;Queneau and Gruber, 1997;Tripathy et al., 2005). This has led the focus of many researchers to develop technologies for recycling the secondary resources such as mill scale, scrapped brass and bronze, auto radiators, shredder pickings from auto bodies, motors, and electrical components, spent etchant and pickling solutions, circuit boards, spent catalyst, slags, anode slimes, etc., for the recovery of copper (Amer, 2002). ...
The upshot of the presence of selenium in the electrolytic solution as an impurity over a concentration range of 0 to 1000 mg dm(-3) during the electrodeposition of copper from sulfate solutions has been investigated in the present study. Higher concentrations of selenium (>50 mg dm(-3)) in the copper sulfate solutions significantly reduce the current efficiency and quality of the copper electrodeposits and increase the energy consumption of the electrodeposition process. Cyclic voltammetric studies revealed that selenium, when present in the solution, affects the deposition and dissolution behavior of the cathodic copper significantly. The presence of selenium in the electrolytic bath polarizes the cathode and decreases the cathodic and anodic currents considerably. In the presence of higher concentrations of selenium (-1000 mg dm(-3)), the co-reduction of selenium was observed. The order of relative diffraction intensity was changed from (111) > (200) > (220) to (111) > (220) > (200) without affecting the preferred plane of crystal growth of copper (111). However, distinguished peaks of selenium were observed for the deposits obtained at an individual impurity concentration of 1000 mg dm(-3) in the solution in support of the observation made during polarization studies. Scanning electron micrographs revealed that the presence of selenium in the acidic copper sulfate bath develops a non-uniform and porous structure with indistinct grain boundaries instead of a compact and smooth deposit as obtained from pure solutions. At higher selenium concentrations, the copper deposits are induced with cracks and ultimately give rise to powdery deposits. The effect of selenium is worse when copper electrodeposition is carried out at 60 degrees C (c) 2014 Elsevier B.V. All rights reserved.
... On the other hand, copper cyanide plating is suitable for barrel plating, which can be plated directly on steel materials, its adhesion is superior to excellent covering power, and its plating speed is as fast as Cu + ions are extracted[15,16]. The major components of the copper cyanide plating solution for various applications are copper cyanide added with sodium cyanide or potassium cyanide (KCN)[17][18][19]. The variables that affect the throwing power most significantly are the charging quantity of the plating materials, plating voltage, barrel rotation speed and plating temperature. ...
Barrel plating is a method of coating small parts using a horizontal type barrel, which can be operated automatically. Nevertheless, barrel plating for a plating material with a complex geometry has a problem with deviations in the coating thickness due to the supply of the plating solution through the barrel and irregular contact of the plating material and cathode. Therefore, this study examined the relationship between the barrel pore size, number of pores and open pore ratio in copper cyanide barrel plating as well as the plating characteristics in accordance with the process variables, such as the barrel rotation speed, plating temperature, plating voltage, plating time, etc. An automobile wheel nut was selected as the plating material and barrel plating was carried out in a 4.7 L sized barrel. The optimal part charging quantity was found to be 40 ea, and the plating characteristics of the best quality for the optimal plating conditions of the barrel plating process were a plating temperature, plating voltage and rotation speed of 323K, 1V and 1.5rpm in a barrel with 22.5% of open pore ratio.
Introduction Regulatory Considerations Examples of Specialty Processors Successful Traits Conclusions
Introduction The Specialty Recycling Plants Conclusions
In this article, some theories on the properties of high-critical-temperature superconductors are briefly reviewed, with a
special emphasis on those theories based on pairing by antiferromagnetic fluctuations and the resonating-valence-bond scenarios.
Ideas linking the physics of the cuprates with those of the recently discovered ladder materials are presented. Possible explanations
for the spin gap in the high-critical-temperature materials using preformed pairs and stripes are briefly discussed. The goal
of this article is to provide simple explanations for the main ideas and concepts, while keeping the mathematical and computational
details to a minimum.
The main application of copper chemicals is in the production of fungicides in agriculture. However, there is a limited availability of documentation on copper chemical production technology. There are several reasons for this. First, the amount of copper used to produce copper chemicals is estimated to be only 1.0-1.5% of the total world copper production. Second, the technology to produce copper sulfate in the form of pentahydrate salts, which is the most commonly used chemical is relatively simple and inexpensive. Third, copper chemicals can be produced from a wide-variety of copper-bearing materials. Lastly, the most-effective operating procedures for achieving the desired chemical properties are frequently proprietary.
A comparative study of membrane extraction of copper using LIX54- or LIX84-impregnated supported liquid membrane (SLM) systems was carried out in this work to remove copper from ammoniacal wastewater. Experimental and computational characterizations of LIX54/Cu(II) and LIX84/Cu(II) complexes were performed and the results agreed well in the reaction mechanisms, complex geometries, and copper extraction strengths of these two carriers. Copper transmembrane fluxes at different conditions were compared and LIX54 was found to have slightly higher copper transmembrane flux in ammoniacal solution but much poorer copper loading in acidic media. Much higher selective separation performances of Cu(II) over Zn(II) and Cd(II) and no ammonia carryover provide LIX54 significant advantages over LIX84 for the treatment of ammoniacal copper solutions. In this work, an impedance spectroscopy technique and initial flux measurement were used to study the long-term stabilities of both LIX54- and LIX84-impregnated vertical flat membrane systems. The results reveal that the membrane stability of both LIX54- and LIX84-impregnated SLM in ammoniacal copper solutions is promising for practical industrial applications. (c) 2006 American Institute of Chemical Engineers.
Spent acidic cupric chloride etchant waste and tin stripping waste from printed circuit board (PCB) industry are classified as hazardous wastes. They contain significant amounts of metals and acid. Usually, spent cupric chloride and tin stripping solutions are shipped off-site for reclamation. At the moment, a large proportion of acidic cupric chloride etchant waste and tin stripping waste are treated by neutralization, resulting in metal-bearing sludge that often ends up in special landfills. This wastes valuable natural resources, which could otherwise be recycled. This paper presents a review of some patented methods developed for the regeneration of acidic cupric chloride etchant waste and tin stripping waste. These methods are based on electrowinning, cementation, solvent extraction, precipitation and membrane technology. The advantages and disadvantages of these developed processes are summarized. It can be seen that there is still a need to develop more efficient and economical processes for the regeneration of acidic cupric chloride etchant waste and tin stripping waste.
In the goethite process for the recovery of zinc from neutral leach residue, iron in the hot acid leach solution is removed by an oxidation-hydrolysis step. Results are presented of an in-plant pilot test using oxygen, instead of air, in a new type of gas-liquid reactor. Under flow conditions providing residence times comparable to plant operations, ferrous iron oxidation and goethite precipitation were achieved in one reactor which were equivalent to that attained in three of the plant’s tanks. Goethite precipitate formed during the program was found to filter as good as conventional plant product and to contain less zinc and copper. Based on these results, a commercial-scale system is expected to require only one-half the number of tanks compared to the existing operation using air, and to offer savings significant in both electrical and process steam energy.
This paper presents a solvent extraction process for the removal of copper from the ammoniacal spent etchant used in printed circuit board manufacturing. This process removes copper as copper sulphate crystals to regenerate the etchant and is thus environmentally and economically desirable. The feasibility of the process was demonstrated with automated solvent extraction equipment under a wide range of conditions. The operational parameters for optimum removal o f copper from the etchant were tested. The purity of the copper sulphate product was found to be 97% or better. The composition of the organic solvent remained unchanged after extensive use.
The Chemistry of Metals Recovery Using LIX| Reagents Minerals hldustry
- Henkel Corporation
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The Recovery of Copper from Spent Ammonfacal Etchant Solutions Utilizing UX| 84
- G A Kordosky
- C R Merigold
G.A. Kordosky and C.R. Merigold, The Recovery of Copper
from Spent Ammonfacal Etchant Solutions Utilizing UX| 84
A New Oxygen Reactor System for the Goethitc-Zine Leach Residue Pro-cess
- J M Boxall
- L M Li~
- M K Weise
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Production of Copper from the Ammine Carbonate System" (paper pre-sented at the 99th AIME Annual Meeting
- W Kunda
- H Veltman
- D J Evans
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Copper Sulfate Recovery Using Fluidized Bed Crystallization EPD CongressAmerican Chemet, Combining TQM and SPC for Total Customer Satisfaction
- M B Schranz
- R J Farrell
M.B. Schranz and R.J. Farrell, "Copper Sulfate Recovery
Using Fluidized Bed Crystallization," EPD Congress 1997,
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Copper Compounds,”Encyclopedia of Chemical Technology
- H Wayne Richardson
Growth in Some Chemical Markets
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