At the Packaging Research Center, research on a new MCM DL technology called “SLIM (Single Level Integrated Module)” is currently being pursued This consists of a multilayered substrate, which includes passive layers such as capacitor, inductor and resistor layers, in addition to the power, X-Y signal and ground layers. The present study focuses on predicting the substrate warpage and interfacial
... [Show full abstract] stress-strain distribution of this complex multilayered structure under uniform thermal loading. The effect of some key parameters such as base layer thickness, base layer material, interlayer dielectric material, and thermal load has been studied on an idealized model to understand the thermo-mechanical response of the substrate. Preliminary design/material recommendations are suggested for enhanced thermo-mechanical integrity of the integrated substrate
