In recent years, increasing environmental and health concerns about
the toxicity of lead combined with the strict legislation banning the use of
lead-based solders have created an inevitable driving force for the
development of lead-free solder alloys (Shen etal., 2005; Shen et al.,
2005; Wei et al., 2009; Shen et al., 2006; Torres et al., 2012; Flandorfer
et al., 2008; Çadırlı et al., 2011; Braga et al., 2007; Shalaby, 2013; Yang
et al., 2008; Awe and Oshakuade, 2014; Miric and Grusd, 1998; Morando
et al., 2014). The search for a global Pb-free replacement for Sn-Pb
eutectic alloy has been evolving as the threat of a regional lead ban
became a reality in July 2006. Over the twelve years from 1994 to 2006,
the manufacturing, performance, and reliability criteria for Pb-free solder
joints have become increasingly complex as relationships between the
solder alloy, the circuit board materials and construction, and the
component designs and materials have been revealed through widespread
experiments of the companies, industrial consortia, and university
researchers (Shen etal., 2005; Shen et al., 2005; Wei et al., 2009; Shen et
al., 2006; Torres et al., 2012; Flandorfer et al., 2008; Çadırlı et al., 2011;
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Braga et al., 2007; Shalaby, 2013; Yang et al., 2008; Awe and
Oshakuade, 2014; Miric and Grusd, 1998; Morando et al., 2014;
Manasijević et al., 2007). Researching and replacing conventional tinlead
(Sn-Pb) solders with Pb-free materials required examination of the
basic properties of these alloy systems. These include physical, chemical,
mechanical, and electrical features, as well as cost and manufacturability.
Among these, the physical properties, such as surface tension, interfacial
tension, copper as the base metal, and contact angles, are important
because of their direct correlation with the wettability of the solder
(Manasijević et al., 2007). A material's electrical conductivity is very
important for developing electronic materials and interconnection
technologies, especially in modern industry and microelectronics (Shen et
al., 2006). In most cases, high-level mechanical properties are required
for industrial applications. The hardness and strength of the alloys mainly
depend on their microstructure; thus, numerous work has been
accomplished on micromechanics to dissection the practice of these
alloys (Braga et al., 2007; Manasijević et al., 2007; Zhang et al., 2014;
Hu et al., 2009; Zou et al., 2009; Mei and Morris, 1992; Morris et al.,
1993) The melting temperature of the Sn-Zn eutectic alloy, which is
lead-free, is about to the Sn-Pb' melting point. Nevertheless, new solder
alloys must provide economic, physical, and chemical properties and
fulfil other conditions. The melting points of lead-free solder alloys
developed in this respect should be close to the conventional Sn-Pb
eutectic alloy; their strength and stability should be similar or superior.
Also, in terms of production cost, the costs of newly developed alloys
must be capable of competing with lead-containing alloys (Billah et al.,
2011; Frear et al., 1994).
This work aims to explore the thermal, electrical, mechanical, and
microstructure of Sn- 57 wt.% Bi, Bi-39 wt.% Sn-3 wt.% Sb and Bi-58.5
wt.% Sn-12.2 wt.% Zn eutectic alloys.