Conference Paper

Mode-matching analysis of substrate-integrated waveguide circuits

Dept. of Electr. & Comput. Eng., Univ. of Victoria, Victoria, BC, Canada
DOI: 10.1109/CCECE.2011.6030517 Conference: Electrical and Computer Engineering (CCECE), 2011 24th Canadian Conference on
Source: IEEE Xplore


A mode-matching approach is presented for the analysis of substrate-integrated waveguide (SIW) circuits. The numerical technique takes advantage of recently developed fabrication techniques employing rectangular-shaped via holes. Discontinuity models involving all-dielectric waveguides and sections with arbitrary numbers of vias are presented and combined into a powerful analysis tool which can be used straightforwardly for the design of SIW components. The influence of the overall substrate width on the circuit performance is investigated. It is found that the computational domain can be significantly reduced without impacting on the computed performances. A design example involving a back-to-back impedance transformer is presented. The results are verified by comparison with the commercially available field solver CST Microwave Studio.

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    • "The ridge WG analysis procedure is realized using a finite-difference frequency-domain (FDFD) strategy,[6] that can be applied both to scalar [14] [16] and vector,[17] problems. As a matter of fact, the FDFD approach, namely the direct discretization of the differential eigenvalue problem, is the simplest numerical strategy to compute eigenvalues and modes of metallic hollow WGs [18] and therefore it is well tailored to be used in PSO but it is useful also in procedure based on method of moments (MoM) [19] [20] or mode matching (MM).[21] The WG section is discretized with a regular grid of sampling points, and the differential eigenvalue problem is replaced by a finite difference one,[22] using suitable Taylor approximations of second [6] or fourth [23] order. "
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    ABSTRACT: A technique of automatic optimization for guiding structures at microwave range is presented. Geometrical parameters have been optimized taking into account conflicting requirements (high bandwidth, high power handling capability and low attenuation constant) with PSO algorithm. Propagation performances are computed with a FDFD technique.
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    • "Recently, new fabrication techniques have permitted the designing engineer to use via holes of different cross sections, e.g. [2], which has led to applications involving square via holes [13], [14] and a respective modeling technique based on the mode-matching technique (MMT) [15]. "
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    ABSTRACT: Five different models to determine the equivalent width of substrate-integrated waveguide (SIW) circuits are investigated. The reflection coefficients between all-dielectric waveguides of equivalent width and SIW circuits are analyzed by full-wave techniques. It is found that one of the models yields consistently inferior results while the others depend on the ratio of the via-hole diameter and the center-to-center spacing of the via holes. Moreover, the influence of the substrate's permittivity with respect to the via-hole diameter and spacing is demonstrated. Recommendations are derived as to the use of respective models for different via diameters and spacings.
    Preview · Conference Paper · Sep 2011
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    ABSTRACT: The substrate integrated waveguide (SIW) comprising rectangular via-holes is herein treated by a rigorous full-wave modal analysis using the moment method entailing Green's functions for rectangular cavities and planar multilayer structures in the spectral domain. Modal dispersion graphs generated by this solution approach are compared with those obtained by an independent commercial full-wave solver. The ability of the modal solution in treating SIW junctions and discontinuities is demonstrated by the treatment of an interconnection between a conventional waveguide and a SIW using the mode-matching technique. Inhomogeneities within SIWs can also be accommodated by the technique, as showcased by a specific example of the so-called hard sidewalled SIW. Three avenues of losses, namely, dielectric, side-leakage, and conductor losses, are also investigated, thereby elucidating a tradeoff between the latter two.
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