Packages With Integrated 60-GHz Aperture-Coupled Patch Antennas

IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
IEEE Transactions on Antennas and Propagation (Impact Factor: 2.18). 11/2011; 59(10):3607 - 3616. DOI: 10.1109/TAP.2011.2163760
Source: IEEE Xplore


This paper presents balanced-fed and fork-fed aperture-coupled patch antennas and 16-element arrays suitable for broadband millimeter-wave communications. The antennas are realized in a multi-layer organic package structure, to which RF integrated circuits can be integrated. To improve antenna bandwidth and radiation efficiency, an air cavity is used, resulting in a superstrate planar patch-antenna structure. Additionally, resonating apertures are used to further increase the antenna bandwidth. Measured results at 60 GHz for the antennas show good performance in terms of peak gain (about 8 dBi for a single element and 17 dBi for a 16-element array), bandwidth ( >; 10 GHz for 10-dB return loss bandwidths are achievable), and radiation efficiency (80% for single-element from simulation).

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    • "In order to provide a cost-effective packaging technology in-line with WiGig requirements in terms of antenna performance, the Antenna-in-Package is the industrial's preferred approach. MmW state-of-the-art prototypes are based on HTCC [5], LTCC [6], high-resistivity silicon [7] or organic materials [8]. In this context, a MmW HDI packaging technology using low-loss organic materials has been developed [9]. "

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    • "Recent developments in microelectronic technology have created a probability for system-on-package (SOP) antennas [1] [2] [3] [4] [5] [6] [7] [8] in a more compact size. As a result, low temperature cofired ceramic (LTCC) package technology [9] [10] is becoming more and more popular for the production of highly integrated, specifically complicated multilayer modules and antennas, both in the military and commercial sectors. "
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