Conference Paper

A high density small size RF test module for high throughput multiple resource testing

ADVANTEST Corp., Gunma, Japan
DOI: 10.1109/TEST.2010.5699232 Conference: Test Conference (ITC), 2010 IEEE International
Source: IEEE Xplore


This paper describes a drastically downsized RF test module with multiple resources and high throughput for RF ATE systems. The major factor in downsizing is RF circuit technology in the form of RF functional systems in package (RF-SiPs), making it possible to construct RF front-end without both RF cables and RF connectors. Besides the above downsizing, high-speed RF switching operations are also achieved. Consequently, installation of multiple resources and higher throughput for RF testing has been accomplished, resulting in reduced RF test costs.

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