Conference Paper

Simul-EMI II: An Application to Simulate Electric and Magnetic Phenomena in PCB Designs

DOI: 10.1007/978-3-642-13022-9_49 Conference: Trends in Applied Intelligent Systems - 23rd International Conference on Industrial Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2010, Cordoba, Spain, June 1-4, 2010, Proceedings, Part I
Source: DBLP

ABSTRACT

In this work, an application to simulate electric and magnetic phenomena during design of printed circuit boards (PCB) is presented. The commercial schematic simulation software currently uses advanced models of components, but not of connections. However, with Simul-EMI II it is possible to get results very close to physical reality of the electronic circuits, in the same environment of schematic simulation. The parasitic effects considered are: connection resistance (traces, solder pads and vias), insulation resistance (prepreg, air, solder mask, etc.), self inductance and capacity (traces, solder pads and vias) and mutual inductances and capacities. For that, several applications of data mining, parametric model extraction and knowledge management have been developed in the MATLAB™ environment. Finally, the results of a PCB simulation with PSPICE™ before and after Simul-EMI II application, together with the electronics laboratory validation tests, are shown.

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    ABSTRACT: In this Chapter, the planar and multi-level transitions between different transmission lines are considered. Among them are the ones realized using the viaholes, the EM coupling or combinations of both means. The most attention is paid to the millimeter-wave or ultra-wide bandwidth solutions for silicon technology. An EM theory of grounding via-holes for millimeter-wave packages is considered. Contemporary state of modeling of multilayer motherboards shorted by multiple through-via-holes is reviewed as well. References -104. Figures -16. Pages -34.
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