Wenhui Yang

Wenhui Yang
Kyushu University | Kyudai · Department of Applied Quantum Physics and Nuclear Engineering

Doctor of Engineering

About

17
Publications
1,268
Reads
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65
Citations
Citations since 2017
16 Research Items
65 Citations
20172018201920202021202220230510152025
20172018201920202021202220230510152025
20172018201920202021202220230510152025
20172018201920202021202220230510152025
Introduction

Publications

Publications (17)
Article
Full-text available
The Cu6Sn5 intermetallic, which commonly forms at the solder interconnects, is a critical component contributing to the reliability of today's electronic products. It has been established that the structural control of its hexagonal η-Cu6Sn5 polymorph can be achieved over a wide temperature range of service conditions via chemical doping with Ni or...
Article
Sn-based anodes are potential replacements for commercial carbon-based lithium-ion battery anodes. Moreover, alloying with Cu improves the cyclability of Sn. This study directly grows Cu6Sn5 crystals on polycrystalline Cu current collectors via a solid-liquid reaction with molten Sn alloys. The Cu6Sn5 crystals grown when a molten Sn-Cu alloy was us...
Article
Sn-based compounds are promising candidates for application as anodes in lithium-ion batteries (LIBs) due to the favourable storage capacity of Sn at 993 mAh g-1 compared to carbon at 372 mAh g-1. The use of Sn-based anodes also avoids some of the safety concerns associated with carbon anodes. However, the large volume changes during lithiation and...
Article
Full-text available
Chemical modification using only small amounts of elements such as Zn, In, Sb, or Ni has proven to be an effective means to control the desirable crystal structure of hexagonal η−Cu6Sn5 over a wide thermally operating window, typically found in Pb-free Sn-based soldering or Li-ion battery anode applications. Though appealing, the underlying mechani...
Article
Ga alloys have been attracting significant renewed attention for low temperature bonding applications in electronic packaging. This study systematically investigates the interfacial reaction between liquid Ga and Cu-10Ni substrates at 30°C. In addition to CuGa2 formed from binary Ga/Cu couples, a layer of nanocrystalline Ga5Ni and CuGa2 formed betw...
Article
Intermetallics like Cu6Sn5, NiSi2, CuGa2 etc. are promising candidate materials to replace carbon-based lithium-ion battery anodes. However, the lithiation reactions of these anodes often involves the separation of the inactive phases, a slow process that retards the lithiation kinetics and deactivates their role as a stress buffer. This research v...
Article
Full-text available
The polymorphic transformation in interfacial intermetallic compounds in three lead-free solder joints was investigated using in situ heating/isothermal/cooling observation techniques in high-voltage transmission electron microscopy (HVTEM). Here, the hexagonal η- to monoclinic η′-Cu6Sn5 polymorphic transformation was visualised systematically thro...
Article
Ga and Ga-based alloys have received significant attention due to their potential applications as liquid metals and also for the bonding of materials in microelectronics near room temperature. This study investigates the phase stability of CuGa2 phase as a product of the interfacial reaction between liquid Ga and Cu-10Ni substrates at room temperat...
Article
A hypoeutectic 60Te–40Bi alloy in mass percent was designed as a tellurium atom evaporation source instead of pure tellurium for an ultraviolet detection photocathode. The alloy was prepared by slow solidification at about 10−2 K·s−1. The microstructure, crystal structure, chemical composition, and crystallographic orientation of each phase in the...
Article
Cu 6 Sn 5 is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal...
Article
As a key tellurium atoms evaporation source for ultraviolet detection photocathode, the hypoeutectic Te75In25 alloy was prepared by employing a slow solidification speed of about 10⁻² K/s. The microstructure and chemical composition of the equilibrium phases formed in the as-prepared alloy were studied in this research work. The experimental result...
Article
A new process to prepare the electroformed nickel without chloride ion activating the anode in the solution is employed in this study, where the sulfur nickel is used as anode. The concentration of nickel sulfamate and boric acid and the pH value were measured during the electroforming process, as well as the anodic passivation curve. The microstru...

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