Suabsakul Gururatana

Kasetsart University at Si Racha · Department of Mechanical Engineering

The aim of the experiment was to explore the thermal and fluid flow characteristics inside the tube heat exchanger. To produce and enhance the flow circulations and longitudinal vortex within the tube, an improved NACA0024 vortex generator (VG) was mounted at the top of the aluminum tape inside the tube. These presented vortex generators were made...

The improved vortex generation insert for heat exchanger is measured in this research paper. The wavy insert is adopted to enhance the performance of heat transfer in the tube. The wavy fin is produced by 3D printing and Acrylonitrile Butadiene Styrene (ABS) is used to be the fin's material. The experiment is performed to determine the thermal and...

In this present study, the novel insert for heat exchanger is presented. The airfoil-shaped insert, Modified NACA0024, is chosen to improve the heat transfer performance in the tube. This experiment is performed to study and investigate the thermal and fluid flow behaviors. The straight tape which Modified NACA0024 are mounted on the both sides gen...

Heat sinks are widely adopted in electronics cooling together with different technologies to enhance the cooling process. For the small electronics application, the small scale pin fins heat sinks are extensively used to dissipate heat in electronics devices. Due to the limit of space in the small devices, it is impossible to increase heat transfer...

Problem statement: The performance of electronic devices has been improving along with the rapid technology development. Cooling of electronic systems is consequently essential in controlling the component temperature and avoiding any hot spot. The study aims to review the present electronic cooling methods which are widely used in electronic devic...

The power density of electronic devices has been increasing along with the rapid technology development. Cooling of electronic systems is therefore essential in controlling the component temperature and avoiding any hot spot. Heat sinks are commonly adopted in electronics cooling together with different technologies to enhance heat transfer process...

Extended surfaces (fins) have been used to enhance heat transfer in many applications. In electronics cooling, fin-based heat sinks are commonly designed so that coolants (gas or liquid) are forced to pass through the narrow straight channel. To improve the overall heat sink performance, this study investigated numerically the details of heat sinks...

A Reynolds-stress expression used in a non-linear eddyviscosity turbulence model is developed based on the Direct Numerical Simulation (DNS) data of fully developed turbulent channel flow of Kim et al. (1987) for both Re T = 180 and 395. The data are initially used to analyze the accuracy of various Reynolds-stress expressions used in the non-linea...

The characteristics of flow field in the internal passage of turbine blade cooling are affected by the combined effects of the secondary flows and the rotation of the blade. These secondary flows occur in the near wall regions and have the great effect on the characteristics of the primary flow and the cooling rate. Accurate modeling of the flow in...