Shang Wang

Harbin Institute of Technology | HIT · School of Materials Science and Engineering

SiOx anode has a more durable cycle life than Si, being considered competitive to replace the conventional graphite. SiOx usually serves as composites with carbon to achieve more extended cycle life. However, the carbon microstructure dependent Li-ion storage behaviors in SiOx /C anode have received insufficient attention. Herein, this work demonst...

Silver nanowires (AgNWs) are important materials to fabricate flexible transparent conductors (FTCs) for next-generation wearable electronics. However, the electrochemical instability still limits their practical applications in electrochemical devices. Herein, highly...

Electrochromic devices (ECDs) as smart windows can modulate transmittance of sunlight under an electric potential. There is significant research interest in applying the design principles of ECDs to flexible systems. Herein, we report a smart, self-powered, flexible electrochromic system with self-regulating features and state-of-the-art stability...

Flexible electrochromic supercapacitors (FECSCs) for powering wearable electronics have attracted considerable attention. Silver nanowires (AgNWs) are one kind of the most potential flexible transparent electrodes (FTEs) materials for the emerging flexible devices. Currently, fabricating FECSC based on AgNWs FTEs is still hindered by their intrinsi...

Due to the intrinsically high ionic conductivity and good interfacial stability towards lithium, garnet-type solid electrolytes are usually introduced into polymer electrolytes as fillers to prepare polymer/garnet composite electrolytes, which can improve the ionic conductivity and enhance the mechanical strength to suppress Li dendrites. However,...

Tin chalcogenides are regarded as promising anode materials for potassium ion batteries (PIBs) due to their considerable specific capacity. However, the severe volume effect, limited electronic conductivity, and the shuttle effect of the potassiation product restrict the application prospect. Herein, based on the metal evaporation reaction, a facil...

The high quality of 3D integrated circuit technology is in need of solder alloy with high reliability. To optimize the performance of solder alloys, the conception of high entropy alloy is introduced into the design of solder alloy. In this study, a new-style high entropy alloy SnPbInBiSb was prepared and investigated. This high entropy alloy has a...

With the rapid development of electronic packaging technology, the high reliability of 3D integrated circuit packaging calls for new functional solder. In this study, a novel high entropy alloy SnPbInBiSb with a low melting point of 112.8 °C was fabricated and investigated. The low melting point and excellent wettability of SnPbInBiSb alloy prove i...

As a key component of active phased array radar, the size and performance of T/R (Transmitter and Receiver) components determine the weight and function of the equipment. Wire bonding is one of the commonly used interconnection technologies in T/R components. With the improvement of component integration, it is necessary to develop corresponding hi...

Micro-nano joining process is a key technique in the manufacturing, packaging, assembly and functionalization of electronic products. Because of its unique optical, electrical and thermal properties, nanowires are playing an increasingly important role in miniaturized and multifunctional micro-nano electronic devices. Therefore, the research on nan...

Flexible electrochromic energy storage (EES) systems have attracted tremendous attention because of their combined advantages of color-changing and energy-storing. Although copper nanowires (Cu NWs) flexible transparent electrodes (FTEs) have been considered as one of the most promising candidates for next-generation flexible electronics, its insti...

Printed flexible electrical heaters with excellent heating performance and mechanical durability are highly desirable for deicing and wearable thermotherapy devices. However, the performance of the conventional heaters is stilled limited by low-resolution fabrication methods when applied in high-precision heating in desirable regions. Moreover, the...

Micro resistance bonding is an essential method to bond micro metal wire and pad for the manufacturing of ever-miniaturized electronic components. However, the bonding quality is unstable due to the limited understanding of the interfacial phases. Nano-scale interfacial details of micro resistance bonding Al wire to an Au/Cu pad were investigated b...

Silver nanowire (Ag NW) ink has attracted significant attention due to its excellent conductivity for flexible electronics. However, the junctions of Ag NWs are unstable without a post-treatment process. In this paper, high-dispersibility Ag NWs/graphene oxide (GO)/polyvinyl pyrrolidone (PVP) composite ink has been synthesized. The mixing of PVP ca...

Copper nanowire (CuNW) has been considered as one of the most promising materials to replace ITO for transparent electrode (TE). However, the loose connections and oxidation problem limited its practical usage. Herein, we introduced a facile and simple electrodeposition method to solve these problems, which can effectively join the stacked NWs toge...

Reliable bonding of thick Al wires and plated Au pad is important for the packaging of power modules. The interfacial phases of the Al/Au/Cu joint after parallel gap micro-resistance welding were observed by transmission electron microscopy (TEM). Obvious Al, Au and Cu elemental interdiffusion can be observed by energy dispersive spectrometer (EDS)...

Welding between an AuNi9 microwire and Au microlayer is of great importance for fabricating electrical contact structures for high precision inertial devices, satellite slip ring brushes, robots, etc. In this paper, the achievement of parallel micro-gap resistance welding (PMRW) with 200-μm AuNi9 microwires on a 3-μm Au layer was presented. The stu...

Transparent conductive films（TCFs） have attracted intense attention in many electronic products, such as flexible devices, organic light-emitting diodes and stretchable electronics. Indium tin oxide（ITO） is the most commonly used transparent conductive material. However, the instinct brittleness, low reserves and high manufacturing costs associated...

Copper nanowire (CuNW) is one of the most promising materials for next-generation flexible transparent electrodes (FTEs). Currently, large-scale applications of CuNW in FTEs are still hindered by their poor resistance against oxidation, chemical, and electrochemical corrosion. To simultaneously improve these stabilities, [email protected] alloy cor...

Copper nanowire (CuNW) is one of the most promising candidates for next-generation transparent conductive film (TCF). However, practical applications of CuNW are still limited by several drawbacks, including loose wire to wire junctions, poor resistance against oxidation, chemical and thermal damage. To concurrently address these urgent issues, hig...

Copper nanowires (Cu NWs) are considered an excellent alternative to indium tin oxide (ITO) in flexible transparency electrodes (FTEs). However, the mixed particles and surface oxidation of Cu NWs degrade the transmittance and conductivity of the electrodes. Therefore, highly purified Cu NWs without oxidation are vital for high-performance FTEs. He...

Silver nanowires (Ag NWs) are key materials to fabricate next-generation flexible transparent electrodes (FTEs). Currently, the applications of Ag NWs are impeded by the large wire-wire contact resistance. Herein, a self-limited nanosoldering method is proposed to reduce the contact resistance by epitaxially depositing silver nanosolders at the Ag...

By using pulse electrodeposition, a coppernanopillar array (CuNPA) wasfilled into porous anodizedaluminum oxide (AAO)films to achieve a highly thermalconductive interconnector with anisotropic property. After120 min pulse deposition, CuNPA uniformlyfilled the poresof AAO with a pore-filling percentage of 99.4%, as the ionconcentration in AAO pores...

Silver nanowires (AgNWs) are the most promising materials to fabricate flexible transparent electrodes (FTEs) used in next-generation electronics. However, there are several bottlenecks for AgNWs-based FTEs to achieve large-scale applications, which are the thermal instability and rough surface topography of AgNWs and the poor interfacial adhesion...

Nano-sized silver nanowires (Ag NWs) always suffer from chemical and thermal instability for their high surface energy. To address these issues, a tri-layer structure, consisting of reduced graphene oxide (rGO) top-layer, Ag NW mid-layer and graphene oxide (GO) bottom-layer, is designed and fabricated by convenient spray and pressure transfer proce...

Large-scale industrialization of flexible printed electronics will thrive on advanced functional conductive pastes with excellent properties in high electrical conductivity and mechanical stability. Herein we develop an effective method to simultaneously decrease the electrical resistivity and improve the mechanical stability of silver-resin-based...

Temperatures during ultrafast microwelding processes are very difficult to be measured timely and accurately. Here, we develop a self-contained temperature sensing approach using thermoelectric voltages between dissimilar welded materials. This approach can offer response speeds ranging from kilohertz to megahertz (temporal resolution of sub-millis...

A facile method for producing high-performance nickel enhanced silver nanowire (Ag NW) transparent electrodes on a flexible substrate is reported. The modified electroplating method called enhanced nickel ion bridge joining of Ag NWs, which provides a new route for improving the loose junctions in bare Ag NW networks. The sheet resistance of Ag NW...

Nanomaterials based flexible transparent electrodes (FTEs) are important components of flexible electronics. However, the contact resistance is the major challenge for low-dimensional materials application in FTEs. In this paper, [email protected] NW networks are successfully prepared by a facile chronopotentiometry method, which could improve the...

Graphene has lots of attractive properties. However, most of its optimal properties are only associated with individual sheets. Producing a colloidal form of graphene can effectively avoid graphene aggregation and thus maintain its original performance. In this paper, an electrolytic method was utilized to prepare graphene colloids. Initially, grap...

Ultra-long silver nanowires (AgNWs) could be an ideal material to replace the commercial used indium tin oxide in highly conductive and transparent electrodes field. In this report, AgNWs with mean length of 102 μm and even 268 μmhave been synthesized through a rapid and one-step polyol method within only 40 min. The effective synthesis was contrib...

In this work, ultra-long silver nanowires (AgNWs) were successfully synthesized by a novel polyol method that reducing the silver nitride by ethylene glycol (EG), and the polyvinylpyrrolidone (PVP) was used as a cap agent. After that, a serials of AgNWs were produced by different molar ratios of PVP and AgNO3. The results indicated that the pure Ag...

A new approach of rapid fabrication of intermetallic compounds (IMCs) solder joints at ambient temperature was investigated in this work. The high share strength Cu/Sn/Cu solder joints were obtained by using different strong electric currents 0.8KA, 0.9KA, 1.0KA, and 1.2KA for only about 0.2s. The Sn foils with the thickness of 10ȝm were used as so...

This paper manages to obtain the technological parameter by studying the parallel gap resistance bonding of thick wire. Then the connection mechanism of copper and nickel wire on the tin coated copper solder is explored. Thirdly, the temperature field distribution during the process of bonding is also achieved by building the three-dimensional heat...

In recent years, the reliability under vibration loading has become a very important problem of modern electronic devices. And existing researches have shown that the results of natural frequencies and modal shapes by FEA (Finite Element Analysis) fit that of modal test well. But it is challengeable to execute the vibration fatigue life analysis ra...