Rui Zhang

Rui Zhang
Auburn University | AU

About

8
Publications
916
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46
Citations

Publications

Publications (8)
Article
Geothermal well logging and instrumentation applications require high-temperature logging tools and sensors with long-term operation capability at 300°C. Advanced SiC technology has enabled high-temperature electronics. To build functional systems operating at high temperatures, an interconnection and packaging technology must be developed to inter...
Article
Geothermal well logging and instrumentation applications require electronics capable of operation at 300 degrees C. SiC device technology enables the design and fabrication of analog circuits that can operate at these temperatures. However, to build functional systems that can operate at high temperatures, an interconnection and packaging technolog...
Conference Paper
Full-text available
Digital silicon carbide integrated circuits provide enhanced functionality for electronics in geothermal, aircraft and other high temperature applications. A multilayer thin film substrate technology has been developed to interconnect multiple SiC devices along with passive components. The conductor is vacuum deposited Ti/Ti:W/Au followed by an ele...
Article
With the transition to lead–free, the electronics industry has widely adopted matte Sn for use component surface finishes. However, it is well know that plated Sn finishes can result in Sn whisker formation. After significant work by numerous researchers, the exact mechanism for Sn whisker growth is still unknown. While industry standard test have...
Article
Highly accelerated life testing (HALT) is used to quickly assess the reliability of passive components for geothermal applications operating at 300°C ambient temperatures. The HALT methodology uses combined stresses to accelerate the failure of capacitors and resistors. This paper describes the test methodology and results on capacitors and resisto...
Article
In this paper, a heat spreader attachment with indium solder for high-power flip chip-in-package application was investigated. The Cu heat spreader was metallized with Ni/Au and the flip chip die backside metallization was Ti/Au. A low voiding attachment process was achieved with vacuum soldering. The Au thin film was converted into AuIn<sub>2</sub...
Article
Geothermal well logging and instrumentation applications require electronics capable of 300°C operation. SiC device technology enables the design and fabrication of analog circuits that can operate at these temperatures. However, to build functional circuits, an interconnection and packaging technology must be demonstrated to provide interconnectiv...
Article
Highly accelerated life testing (HALT) is used to quickly assess the reliability of passive components for geothermal applications operating at 300°C ambient temperature. The HALT methodology uses combined stresses to accelerate the failure of capacitors and resistors. This paper describes the test methodology, special fixture designed, and results...

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