Reinhardt Seidel

Friedrich-Alexander-University Erlangen-Nürnberg | FAU · Department of Mechanical Engineering

Electronics manufacturing is a global industry and key to innovation in the virtual world because it is the physical backbone. The cost-effective development and manufacture of such electronic modules are critical to maintaining the competitiveness of high-wage manufacturing countries. Therefore, two approaches suggest themselves: Design for Manufa...

Higher functional integration and increased electrical and reliability requirements are leading to increasingly complex printed circuit board (PCB) designs. Highly integrated PCBs with mixed SMT/THT assembly cause difficulties in soldering processes due to the thermal mismatch between heat demand and heat supply during soldering and the limited acc...

The design phase of products decides about a large portion of their costs. Both applied manufacturing technologies and systems are ultimately defined by the products that have to be assembled. Due to global trends towards e-mobility and regenerative energy, electronic printed circuit boards with high copper content and mixed SMT/THT assembly is the...

Mini wave soldering is a common method for soldering through-hole components on printed circuit boards (PCB). With PCB design becoming increasingly complex and copper layer thickness rising, the vertical hole fill of through-hole solder joints becomes a serious problem during manufacturing. At the same time, the process window is limited by limited...

This paper introduces an improved method of measuring thermal impedance in power modules. It is based on the common VCE(T)-method for fast recording of the junction temperature but uses an infrared camera for detecting the baseplate temperature of the power module instead of a slow thermocouple. The measurement setup neither requires an additional...

Selective wave soldering is a common method for soldering through hole components on PCB boards. With PCB design becoming increasingly more complex and copper layer thickness rises, the solderability becomes difficult due to high heat losses. Hence, the design phase and parametrisation of machines on the shopfloor is time consuming because the choi...

Reliable temperature measurement is important for the definition of robust process parame-ters in industrial soldering of electronics components. At the same time thermal damage of the compo-nents has to be averted and high soldering quality has to be provided. The temperature measurement is commonly done by attaching thermocouples to the substrate...

Recent trends like autonomous driving, natural language processing, service robotics or Industry 4.0 are mainly based on the tremendous progress made in the field of machine learning (ML). The increased data availability coupled with affordable computing power and easy-to-use software tools have laid the foundation for using such algorithms in a wi...

High quality and low costs are main drivers in electronics production. Regardless of the application, the trend towards batch size 1 heavily challenges current production systems. With higher data availability, the application of machine learning (ML) has great potential for the future of electronics production. Therefore, this paper gives an overv...