Peishan Tu

Peishan Tu
The Chinese University of Hong Kong | CUHK · Department of Computer Science and Engineering

About

10
Publications
254
Reads
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89
Citations
Citations since 2017
7 Research Items
85 Citations
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2017201820192020202120222023051015
2017201820192020202120222023051015

Publications

Publications (10)
Conference Paper
Dummy fill insertion is a mandatory step in modern semiconductor manufacturing process to reduce dielectric thickness variation, and provide nearly uniform pattern density for the chemical mechanical planarization (CMP) process. However, with the continuous shrinking of the VLSI technology nodes, the coupling effects between the inserted metal fill...
Article
In global routing, both timing and routability are critical criteria to measure the performance of a design. However, these two objectives naturally conflict with each other during routing. In this work, we proposed reconnection approaches to fix timing. We first formulated a quadratic program (QP), which adjusts routing topologies of all the nets...
Conference Paper
In global routing, both timing and routability are critical criterions to measure the performance of a design. However, these two objectives naturally conflict with each other during routing. In this paper, a tree surgery technique is presented to adjust routing tree topologies in global routing to fix timing. We formulate the problem as a quadrati...
Conference Paper
As the complexity and scale of FPGA circuits grows, resolving routing congestion becomes more important in FPGA placement. In this paper, we propose a routability-driven placement algorithm for large-scale heterogeneous FPGAs. Our proposed algorithm consists of (1) partitioning, (2) packing, (3) global placement with congestion estimation, (4) wind...
Article
To reduce chip-scale topography variation, dummy fill is commonly used to improve the layout density uniformity. Previous works either sought the most uniform density distribution or sought to minimize the inserted dummy fills while satisfying certain density uniformity constraint. However, due to more stringent manufacturing challenges, more crite...

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