Nils Thielen

Friedrich-Alexander-University Erlangen-Nürnberg | FAU · Department of Mechanical Engineering

Künstliche Intelligenz (KI) bietet erhebliche Potentiale zur Optimierung von Prozessen und Geschäftsmodellen entlang der Wertschöpfungskette von produzierenden Unternehmen. Dennoch zögern viele Betriebe bei der Umsetzung von KI-Projekten.

Electronics manufacturing is a global industry and key to innovation in the virtual world because it is the physical backbone. The cost-effective development and manufacture of such electronic modules are critical to maintaining the competitiveness of high-wage manufacturing countries. Therefore, two approaches suggest themselves: Design for Manufa...

The design phase of products decides about a large portion of their costs. Both applied manufacturing technologies and systems are ultimately defined by the products that have to be assembled. Due to global trends towards e-mobility and regenerative energy, electronic printed circuit boards with high copper content and mixed SMT/THT assembly is the...

Selective wave soldering is a common method for soldering through hole components on PCB boards. With PCB design becoming increasingly more complex and copper layer thickness rises, the solderability becomes difficult due to high heat losses. Hence, the design phase and parametrisation of machines on the shopfloor is time consuming because the choi...

Reliable temperature measurement is important for the definition of robust process parame-ters in industrial soldering of electronics components. At the same time thermal damage of the compo-nents has to be averted and high soldering quality has to be provided. The temperature measurement is commonly done by attaching thermocouples to the substrate...

The success factors of modern, global competition are changing the framework conditions of industrial production in a sustainable way. The optimization of the manufacturing process of electronic assemblies must ensure that they meet the requirements for adapted strategies and new design concepts, in particular in the field of digitization. Due to t...

To simulate the bow of wafers with integrated capacitors in the form of pit arrays, various approaches were pursued. After unfruitful attempts to reliably obtain the wafer bow directly from simulating part of the wafer, a multi-scale approach was used. In this approach, the layer with the integrated capacitors was replaced by a homogeneous material...