Nashrah Hani Jamadon

Nashrah Hani Jamadon
Universiti Kebangsaan Malaysia | ukm · Department of Mechanical and Manufacturing Engineering

Doctor of Engineering

About

20
Publications
7,181
Reads
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57
Citations
Citations since 2016
16 Research Items
55 Citations
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201620172018201920202021202205101520
Introduction
My research interests are in bonding technology, which primarily focuses on joining mechanism of materials. Currently, I am now conducting research on metallurgical bonding, ceramic bonding behaviour, and microjoining of different materials through different manufacturing processes such as laser joint, injection moulding, additive manufacturing and so on. I am looking forward to collaborate with researcher/industries in joining technology and materials processing.
Additional affiliations
October 2018 - present
Universiti Kebangsaan Malaysia
Position
  • Lecturer

Publications

Publications (20)
Article
Full-text available
In this study, the effect of phase, microstructure, and porosity in Selective Laser Melting (SLM) on hardness, tensile, and fracture behavior of 17-4 PH was investigated. The increasing interest in SLM in producing complex parts has encouraged the industry to produce performance parts, such as martensitic 17-4 PH stainless steel. However, the micro...
Article
Full-text available
Natural fibers have emerged as an effective replacement for synthetic fibers in the fabrication of green composites to be used for producing various components in automotive, aerospace, and other applications. In this proposed study, the mechanical properties of banana and coir fiber-based green composites have been optimized by using a hybrid AHP-...
Chapter
The combination of poly-lactic acid/magnesium hydroxide (PLA/Mg(OH)2) with low weight, biodegradability, and favorable mechanical properties make it an ideal material for a biomedical application. In this work, the combination of these two materials was carried out using the injection molding method. Different parameters of 100% PLA, 99% PLA/1% Mg(...
Article
Full-text available
The effect of co-doping of titania and manganese oxide at different weight percentages (0.5–5 wt.%) on sintering behaviour and mechanical properties of alumina were evaluated. The undoped and doped alumina were prepared through pressure-less sintering which was carried out at different temperatures (1000 °C–1500 °C) and were characterized through X...
Article
Full-text available
In this research, we investigated the influence of the sintering temperature on the physical and mechanical properties of micro-sized bi-material components of 17-4PH stainless steel and 3 mol% yttria-stabilized zirconia fabricated using a two-component micro-powder injection molding (2C-μPIM) process. First, 17-4PH and zirconia powders were separa...
Article
Full-text available
Porous aluminum (Al) composites are lightweight and high-strength materials composing of Al as a matrix material with some strengthening reinforcements and pore-forming agents that result in the formation of new material with superior physical properties and energy absorption capacities. This work gives an overview of the porous Al-foams developed...
Article
Two-component micro-powder injection molding (2C-μPIM) is a promising technique to produce bi-material micro-sized components of 3 mol% yttria-stabilized zirconia (3YSZ) and 17-4PH stainless steel (SS 17-4PH). In this research, the solvent and thermal debinding mechanisms of the green 3YSZ/SS 17-4PH micro-parts were investigated using a systematic...
Article
Full-text available
Palm oil mill effluent (POME) is a hazardous wastewater which contains high organic constituents and salt concentrations. The ultrafiltration (UF) process is a promising treatment design used for secondary treatment such as POME. However, membrane fouling is the major problem which limits the performance of the UF. This paper describes a detailed i...
Article
Powder injection molding (PIM) is a well-known manufacturing technique for the production of complex, net-shaped macro-parts using a broad range of materials and alloys. Eventually, the PIM method has been modified into micro-powder injection molding (μPIM) because of the increasing demand of micro-parts in global market. Now-a-days PIM and μPIM pr...
Article
Full-text available
From the micro-powder injection molding (μPIM) process, a two-component micro-powder injection molding (2C-μPIM) process has evolved due to the growing demand for multi-functional micro-components in avant-garde applications. 2C-μPIM technology provides the opportunity to conjugate distinct materials within one part. Stainless steel (SS 17-4PH) and...
Article
Full-text available
In recent years, production of biohydrogen and biomethane (or a mixture of these; biohythane) from organic wastes using two-stage bioreactor have been implemented by developing countries such as Germany, USA and the United Kingdom using the anaerobic digestion (AD) process. In Thailand, biohythane production in a two-stage process has been widely s...
Article
In this work, brazing of porous copper foam (PCF) to copper (Cu) using amorphous Cu-9.7Sn-5.7Ni-7.0P (in weight, wt%) filler metal has been performed. PCF with different pore densities of 15 pore per inch (PPI), 25 PPI, and 50 PPI were sandwiched in between amorphous Cu-9.7Sn-5.7Ni-7.0P filler/Cu based plate. A brazed joint of Cu/Cu using amorphous...
Chapter
The performance of Pb-free SAC305 solder joint added with porous Cu interlayer was investigated. The porous Cu interlayer was placed in a sandwich-like layer between SAC305 solder alloy and rod Cu as the substrate metal. Two different pores, 15 ppi (pore per inch, P15) and 25 ppi (P25) with the pore size approximately ϕ1.7 and ϕ1.0 mm, respectively...
Article
Full-text available
This paper investigates the growth and formation of intermetallic compound when a porous copper interlayer is added into the soldering of 96.5Sn-3.0Ag-0.5Cu (in wt%) solder alloy and copper substrate. Porous copper interlayers with two different porosities, P15 (15 pores per inch, ppi) and P25 (25 ppi), were selected as interlayers to be placed in...
Article
Full-text available
The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi—pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and...
Conference Paper
Full-text available
The microstructural and mechanical properties of Sn-3.0Ag-0.5Cu lead-free solders added with a porous Cu interlayer were investigated. Two types of porous Cu, P15 and P25 with the diameter of φ1.7 mm and φ1.0mm respectively were used in this study. The porous Cu was arranged in a sandwich-liked layer in between Sn-3.0Ag-0.5Cu solder alloys with rod...
Conference Paper
Full-text available
The morphology and growth of interfacial intermetallic compound (IMC) between Sn-3.0Ag-0.5Cu solder alloy and Cu substrate metal of solder joint is reported. The IMC morphology and IMC thickness layer were observed at three different porosities of porous Cu interlayer. The results revealed that during soldering process, Cu6Sn5 compound with scallop...
Article
In this paper, effect of adding porous Cu interlayer into Sn-0.3Ag-0.5Cu lead-free solder joint on the microstructure and the tensile strength were investigated Porous Cu interlayer with different porosities of 15, 25 and 35 ppi were applied to join with Cu substrates by using Sn-0 3Ag-0 5Cu lead-free solder alloy Soldering was conducted in a furna...
Conference Paper
Full-text available
In this paper, the effect of adding porous Cu to Sn-based solder on the joint strength of the solder alloy was investigated. The porous Cu was arranged in a sandwich-liked layer with Sn-based solder alloys. The soldering process involved different soldering temperature and time. Shear test was also performed to evaluate the joint strength of the so...

Questions

Question (1)
Question
Dear all,
Could anyone please kindly sent me of the solution manual for following book
Mechanical vibrations:Theory and Applications (CengageLearning_S. GRAHAM KELLY)
Thank you in advanced.

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