Muhammad Hassan Malik

• Master of Science
• Sciantist at SAL Silicon Austria Labs

Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing me...

The growing demand for sustainable and efficient environmental monitoring systems has driven the development of innovative sensor technologies. This study presents a hybrid ultra high frequency radio-frequency identification (UHF RFID) sensor tag fabricated on uncoated paper substrate, which constitutes approximately 87% of the tag's mass thereby m...

In this study, we explored the morphological and electrochemical properties of carbon-based electrodes derived from laser-induced graphene (LIG) and compared them to commercially available graphene-sheet screen-printed electrodes (GS-SPEs). By optimizing the laser parameters (average laser power, speed, and focus) using a design of experiments resp...

Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver electrodes and antennas on a bio-based, biocompatible, and biodegradable Polylactic Acid foil...

This article introduces a methodology to increase the integration density of functional electronic features on fibers/threads/wires through additive deposition of functional materials via printed electronics. It opens the possibility to create a multifunctional intelligent system on a single fiber/thread/wire while combining the advantages of exist...

The hybrid integration of electronics in flexible substrates using fanned-out, wafer-level packaging (FOWLP) has recently gained significant attention, with numerous applications in wearable electronics, foldable displays, robotics, medical implants, and healthcare monitoring. In this study, a fully additive and scalable manufacturing process flow...

Multifunctional Biface Sensor Tag In article number 2200027, Lukas Rauter and co‐workers show that the fastest‐growing waste stream in the world is electronic waste. The number of sensors deployed increases rapidly, which raises the urgent demand for sustainable sensor solutions. Addressing this challenge, Silicon Austria Labs present a Multifuncti...

Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-machine interfaces, and healthcare monitoring. Stretchable hybrid systems (SHS) leverage the benefits of low-cost fabrication of printed electronics with high-performance silicon technologies. However, direct...

In this article, a sustainable, multifunctional, low‐cost, wireless sensor tag is presented. The sensor tag combines three different environmental sensors in one single platform for the dedicated purpose of wireless structural health monitoring of a variety of applications. However, the adaptive design allows the integration of different sensors de...

Paper-based electronics is an emerging concept with the prospect of developing recyclable, low cost, flexible, and green products such as paper displays, smart labels, RFID tags, smart packages, electronic magazines, biological and medical devices. Compared to conventional printed circuit board (PCB) materials, utilizing paper as an electronics sub...

Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced...

As the demand for flexible hybrid electronics has increased extensively e.g. for the internet of things (IoT), electronic skin and wearables applications, the implementation of devices based on low-cost materials such as PET, paper, and unpackaged bare dies have become crucial for economical mass production. To facilitate flexibility for instance i...

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed in...

In light of the necessity to introduce reliable interconnection technologies for the development of disposable diagnostic kits, fine-pitch flip-chip integration of bare silicon dies on the paper and polyethylene terephthalate (PET)-based substrates have gained increasing importance. As the key-enabler of a hybrid electronic system, the interconnect...