Muhammad Hassan Malik

Muhammad Hassan Malik
SAL Silicon Austria Labs · Hetrogenous integration Technology

Master of Science

About

7
Publications
959
Reads
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16
Citations
Additional affiliations
January 2020 - present
SAL Silicon Austria Labs
Position
  • PhD Student
Description
  • Plastic electronics, thin-film-transistors on foil and ultra-thin chips (UTC) on foil are technologies currently pursued to support the strongly emerging flexible electronics market. To achieve this, the development of autonomous multi-sensory systems also requires strategy for integrate various sensing and electronic components on flexible packages which are suitable for water quality monitoring and easy to manufacture. This project will develop conductive structures on various flexible substra
April 2019 - October 2020
SAL Silicon Austria Labs
Position
  • Master's Student
Description
  • Master Thesis (Heterogeneous Integration Technology). Grade: 1.8 Characterization and aid in design of Process control Monitor PCM. *Literature research and analysis of State-of-the-art techniques *Feasibility analysis of existing approaches and deriving of suitable approach * Sample preparation. Coating (Beam Evaporation) * Analyzing Material characteristics on different temperature and pressure. * Determining the Coefficient of thermal expansion using Interferometer. * Young's modulus and hard
April 2019 - October 2019
SAL Silicon Austria Labs
Position
  • Master's Student
Description
  • Characterization and aid in design of Process control Monitor PCM. *Literature research and analysis of State-of-the-art techniques *Feasibility analysis of existing approaches and deriving of suitable approach * Sample preparation. Coating (Beam Evaporation) * Analyzing Material characteristics on different temperature and pressure. * Determining the Coefficient of thermal expansion using Interferometer. * Young's modulus and hardness.
Education
December 2015 - October 2019
Technische Universität Chemnitz
Field of study
  • Micro and Nano Systems

Publications

Publications (7)
Article
Full-text available
Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing me...
Article
Full-text available
Paper-based electronics is an emerging concept with the prospect of developing recyclable, low cost, flexible, and green products such as paper displays, smart labels, RFID tags, smart packages, electronic magazines, biological and medical devices. Compared to conventional printed circuit board (PCB) materials, utilizing paper as an electronics sub...
Conference Paper
Full-text available
Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced...
Article
Full-text available
As the demand for flexible hybrid electronics has increased extensively e.g. for the internet of things (IoT), electronic skin and wearables applications, the implementation of devices based on low-cost materials such as PET, paper, and unpackaged bare dies have become crucial for economical mass production. To facilitate flexibility for instance i...
Article
Full-text available
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed in...
Article
Full-text available
In light of the necessity to introduce reliable interconnection technologies for the development of disposable diagnostic kits, fine-pitch flip-chip integration of bare silicon dies on the paper and polyethylene terephthalate (PET)-based substrates have gained increasing importance. As the key-enabler of a hybrid electronic system, the interconnect...

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Projects

Project (1)
Project
Plastic electronics, thin-film-transistors on foil and ultra-thin chips (UTC) on foil are technologies currently pursued to support the strongly emerging flexible electronics market. To achieve this, the development of autonomous multi-sensory systems also requires strategy for integrate various sensing and electronic components on flexible packages which are suitable for water quality monitoring and easy to manufacture. This project will develop conductive structures on various flexible substrates, ink-jet printing of functional layers, UV-curing processes of metal inks and metal layers on low temperature substrates, as well as the bonding and accurate placement of UTCs and sensors.