Muhammad Hassan MalikAlpen-Adria-Universität Klagenfurt · Institute for Intelligent System Technologies
Muhammad Hassan Malik
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Ultra-Thin Chip Integration Flexible electronics
January 2020 - November 2022
- PhD Student
- Plastic electronics, thin-film-transistors on foil and ultra-thin chips (UTC) on foil are technologies currently pursued to support the strongly emerging flexible electronics market. To achieve this, the development of autonomous multi-sensory systems also requires strategy for integrate various sensing and electronic components on flexible packages which are suitable for water quality monitoring and easy to manufacture. This project will develop conductive structures on flexible substra
April 2019 - October 2019
- Master's Student
- Characterization and aid in design of Process control Monitor PCM. *Literature research and analysis of State-of-the-art techniques *Feasibility analysis of existing approaches and deriving of suitable approach * Sample preparation. Coating (Beam Evaporation) * Analyzing Material characteristics on different temperature and pressure. * Determining the Coefficient of thermal expansion using Interferometer. * Young's modulus and hardness.
Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing me...
Hybrid integration of electronics in flexible substrates using Fan out wafer-level packaging (FOWLP) has recently gained significant attention with numerous applications in wearable electronics, foldable displays, robotics, medical implants, and healthcare monitoring. In this study, a fully additive and scalable manufacturing process flow to realiz...
Multifunctional Biface Sensor Tag In article number 2200027, Lukas Rauter and co‐workers show that the fastest‐growing waste stream in the world is electronic waste. The number of sensors deployed increases rapidly, which raises the urgent demand for sustainable sensor solutions. Addressing this challenge, Silicon Austria Labs present a Multifuncti...
Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-machine interfaces, and healthcare monitoring. Stretchable Hybrid systems (SHS) leverage the benefits of low-cost fabrication of printed electronics with high-performance silicon technologies. However, direct...
In this article, a sustainable, multifunctional, low‐cost, wireless sensor tag is presented. The sensor tag combines three different environmental sensors in one single platform for the dedicated purpose of wireless structural health monitoring of a variety of applications. However, the adaptive design allows the integration of different sensors de...
Paper-based electronics is an emerging concept with the prospect of developing recyclable, low cost, flexible, and green products such as paper displays, smart labels, RFID tags, smart packages, electronic magazines, biological and medical devices. Compared to conventional printed circuit board (PCB) materials, utilizing paper as an electronics sub...
Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced...
As the demand for flexible hybrid electronics has increased extensively e.g. for the internet of things (IoT), electronic skin and wearables applications, the implementation of devices based on low-cost materials such as PET, paper, and unpackaged bare dies have become crucial for economical mass production. To facilitate flexibility for instance i...
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed in...
In light of the necessity to introduce reliable interconnection technologies for the development of disposable diagnostic kits, fine-pitch flip-chip integration of bare silicon dies on the paper and polyethylene terephthalate (PET)-based substrates have gained increasing importance. As the key-enabler of a hybrid electronic system, the interconnect...