Muhammad Hassan Malik

Muhammad Hassan Malik
  • Master of Science
  • Sciantist at SAL Silicon Austria Labs

Semiconductor Packaging, Flexible electronics, Wafer level packaging, die level packaging

About

16
Publications
4,936
Reads
How we measure 'reads'
A 'read' is counted each time someone views a publication summary (such as the title, abstract, and list of authors), clicks on a figure, or views or downloads the full-text. Learn more
83
Citations
Current institution
SAL Silicon Austria Labs
Current position
  • Sciantist
Additional affiliations
September 2020 - present
Alpen-Adria-Universität Klagenfurt
Position
  • PhD Student
January 2020 - November 2022
SAL Silicon Austria Labs
Position
  • PhD Student
Description
  • Plastic electronics, thin-film-transistors on foil and ultra-thin chips (UTC) on foil are technologies currently pursued to support the strongly emerging flexible electronics market. To achieve this, the development of autonomous multi-sensory systems also requires strategy for integrate various sensing and electronic components on flexible packages which are suitable for water quality monitoring and easy to manufacture. This project will develop conductive structures on flexible substra
April 2019 - October 2019
SAL Silicon Austria Labs
Position
  • Master's Student
Description
  • Characterization and aid in design of Process control Monitor PCM. *Literature research and analysis of State-of-the-art techniques *Feasibility analysis of existing approaches and deriving of suitable approach * Sample preparation. Coating (Beam Evaporation) * Analyzing Material characteristics on different temperature and pressure. * Determining the Coefficient of thermal expansion using Interferometer. * Young's modulus and hardness.
Education
September 2020
December 2015 - October 2019
Chemnitz University of Technology
Field of study
  • Micro and Nano Systems

Publications

Publications (16)
Article
Full-text available
Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing me...
Article
The growing demand for sustainable and efficient environmental monitoring systems has driven the development of innovative sensor technologies. This study presents a hybrid ultra high frequency radio-frequency identification (UHF RFID) sensor tag fabricated on uncoated paper substrate, which constitutes approximately 87% of the tag's mass thereby m...
Article
In this study, we explored the morphological and electrochemical properties of carbon-based electrodes derived from laser-induced graphene (LIG) and compared them to commercially available graphene-sheet screen-printed electrodes (GS-SPEs). By optimizing the laser parameters (average laser power, speed, and focus) using a design of experiments resp...
Article
Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver electrodes and antennas on a bio-based, biocompatible, and biodegradable Polylactic Acid foil...
Article
This article introduces a methodology to increase the integration density of functional electronic features on fibers/threads/wires through additive deposition of functional materials via printed electronics. It opens the possibility to create a multifunctional intelligent system on a single fiber/thread/wire while combining the advantages of exist...
Article
Full-text available
The hybrid integration of electronics in flexible substrates using fanned-out, wafer-level packaging (FOWLP) has recently gained significant attention, with numerous applications in wearable electronics, foldable displays, robotics, medical implants, and healthcare monitoring. In this study, a fully additive and scalable manufacturing process flow...
Article
Multifunctional Biface Sensor Tag In article number 2200027, Lukas Rauter and co‐workers show that the fastest‐growing waste stream in the world is electronic waste. The number of sensors deployed increases rapidly, which raises the urgent demand for sustainable sensor solutions. Addressing this challenge, Silicon Austria Labs present a Multifuncti...
Article
Full-text available
Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-machine interfaces, and healthcare monitoring. Stretchable hybrid systems (SHS) leverage the benefits of low-cost fabrication of printed electronics with high-performance silicon technologies. However, direct...
Article
Full-text available
In this article, a sustainable, multifunctional, low‐cost, wireless sensor tag is presented. The sensor tag combines three different environmental sensors in one single platform for the dedicated purpose of wireless structural health monitoring of a variety of applications. However, the adaptive design allows the integration of different sensors de...
Article
Full-text available
Paper-based electronics is an emerging concept with the prospect of developing recyclable, low cost, flexible, and green products such as paper displays, smart labels, RFID tags, smart packages, electronic magazines, biological and medical devices. Compared to conventional printed circuit board (PCB) materials, utilizing paper as an electronics sub...
Conference Paper
Paper as a substrate for electronic circuits with inkjet printing of conductors and insulators offers advantages such as low-cost, flexibility, eco-friendliness, and recyclability. To realize circuitry on papers, inkjet printing is one of the standard methodologies. However, heterogeneous integration of components on inkjet printed papers has faced...
Article
Full-text available
As the demand for flexible hybrid electronics has increased extensively e.g. for the internet of things (IoT), electronic skin and wearables applications, the implementation of devices based on low-cost materials such as PET, paper, and unpackaged bare dies have become crucial for economical mass production. To facilitate flexibility for instance i...
Article
Full-text available
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed in...
Article
Full-text available
In light of the necessity to introduce reliable interconnection technologies for the development of disposable diagnostic kits, fine-pitch flip-chip integration of bare silicon dies on the paper and polyethylene terephthalate (PET)-based substrates have gained increasing importance. As the key-enabler of a hybrid electronic system, the interconnect...

Network

Cited By