Michal Hejduk

Michal Hejduk
Charles University in Prague | CUNI · Faculty of Mathematics and Physics

PhD

About

38
Publications
2,689
Reads
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280
Citations
Introduction
I am interested in ultracold interactions between ions and electrons in gas phase. I am building a cryogenic radio-frequency trap, in which we will store laser-cooled ions with electrons.
Additional affiliations
February 2021 - present
Charles University in Prague
Position
  • Principal Investigator
Description
  • Leading the research in ultra-cold plasma physics.
May 2020 - January 2021
Valeo autoklimatizace k.s.
Position
  • Engineer
Description
  • Developing new optical imaging technologies.
April 2017 - April 2020
University of Oxford
Position
  • PostDoc Position
Description
  • Zeeman deceleration of magnetic particles
Education
October 2009 - September 2013
Charles University in Prague
Field of study
  • Physics of plasma and ionised media

Questions

Questions (3)
Question
I am looking for a producer or a seller of copper plated glass wafers for making a microwave device. The copper thickness should be around 50 microns and the adhesion should be pretty good to survive repetitive cooling and heating cycles. It should be ultra-high vacuum compatible. I will need only few of them, on the order of 10. Diameter shall be less than 50 mm. Is there any such maker in Europe? So far, I have seen only research papers about the topic of making copper layers but they were pretty old. The industry seems to have adopted the glass wafers but I see no companies offering them... Any ideas about where to ask?
Question
Is there a reason why nobody performed Doppler cooling of Y III (Y^{2+}) ions? It seems that transitions are similar to those in Ca+ ions (three level system). Y III ions could be produced by laser ablation, which was the method used for getting optical spectra of these ions in past.
Question
I am thinking about putting a PCB with a SMD resistor chain on a surface cooled down to 20 K. While there are enough resistors that would survive such environment, I am not sure how many thermal cycles the connections between the resistors and the PCB can survive. Does anyone have a relevant experience?

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