Luca Zanotti

Luca Zanotti
  • STMicroelectronics

Analog, MEMS and Sensor Product Group

About

85
Publications
12,080
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433
Citations
Current institution
STMicroelectronics

Publications

Publications (85)
Presentation
Full-text available
Elementi matematici nella religione (una proposta programmatica per una modellizzazione matematica del messaggio evangelico) Caffè filosofico, Crema, 14 ottobre 2024 ...... https://www.prolococrema.it/event-details/caffe-filosofico-elementi-matematici-nella-religione?lang=en .......... https://www.caffefilosoficocrema.it/news/elementi-matematici-n...
Patent
METHOD OF FABRICATION OF AN INTEGRATED THERMOELECTRIC CONVERTER, AND INTEGRATED THERMOELECTRIC CONVERTER THUS OBTAINED
Poster
Full-text available
MEMS Micromirror and SPAD for a LIDAR Module https://www.nanoinnovation2021.eu/home/poster/TERZI_Davide.pdf ***************************************************************************************** ........... To my Mother ........Luca
Presentation
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TEINVEIN, Tecnologie Innovative per Veicoli Intelligenti
Poster
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Innovative Technologies for Intelligent Vehicles http://festival2019.festivalscienza.it/site/home/programma-2019/movimenti-alla-microscala.html
Presentation
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The MEMS Evolution: Materials, Sensors, and Actuators https://www.nanoinnovation2019.eu/index.php/joint-events-2/school-on-silicon-micro-and-nano-technologies-je
Presentation
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TEcnologie INnovative per VEicoli INtelligenti
Presentation
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Introduction of Smart Materials in ST-MEMS Vision http://www.vo2actuators.spin.cnr.it/news-events
Poster
Full-text available
Microelectronics photodetectors, innovative ADAS, vehicle actuators, algorithms for Autonomous Driving, sensor fusion, IoT systems concerning V2V and V2I communication and Human-Machine interaction are the main goals to achieve Universities and Industrial partners are working together to design intelligent vehicles capable of improving driving safe...
Presentation
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Technological Application Fields for MEMS Sensors and Actuators
Poster
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Lab4MEMS II
Presentation
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Technological Application Fields for MEMS Sensors and Actuators
Presentation
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Motori del micromondo tra presente e futuro http://www.vo2actuators.spin.cnr.it/news-events/10-news-3
Conference Paper
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Micro electromechanical system (MEMS) micromirrors are interesting devices to be adopted in pico projector application. In fact, together with laser sources, they can be adopted to obtain an always in focus projected image. The reliability of these devices is not yet been addressed. In this paper, we investigate the reliability of micromirrors subj...
Conference Paper
Full-text available
In this paper we present the development of a resonant asymmetric micro mirror. In particular, we prove the possibility of using an Electro Active Polymer as actuation material. The working principle of the micro mirror and the design retained is first presented. Then the technological realization is summarized. We obtain micro mirror demonstrators...
Poster
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Lab4MEMS II ENIAC/ECSEL Project Description
Presentation
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Recent Advancements and Perspectives in MEMS and MOEMS Technologies
Poster
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Lab4MEMS LAB FAB for smart sensors and actuators MEMS
Poster
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LAB4MEMS II Micro-Optical MEMS, micro-mirrors and pico-projectors
Presentation
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MOEMS Global and Next Future Scenarios
Presentation
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Actual Trends in MEMS and MOEMS Applications
Presentation
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Nanometric Scale in Solid State Integrated Circuits: Features and Analytical Techniques
Presentation
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I Principi dei Principii https://www.cralst2001.it/cral/2016/02/incontro-sez-autori-cultura/ https://www.researchgate.net/publication/307175424_I_Principi_dei_Principii_Riflessioni_sulle_Leggi_di_Natura_-_-_-_-_-_The_Princes_of_Principles_Thoughts_about_Nature_Laws_DISPONIBILE_LA_VERSIONE_ITALIANA_E_INGLESE
Article
In the present study, the bifiller system incorporating various amount of multiwalled carbon nanotubes (MWCNTs) and 3 wt% clay in polypropylene is investigated to obtain composites with multifunctional performance. The dispersion state of two nanofillers in the polypropylene matrix was characterized by applying TEM and Raman spectroscopy. Both comp...
Poster
Full-text available
LAB4MEMS II Micro-Optical MEMS, micro-mirrors and pico-projectors
Poster
Full-text available
Lab4MEMS LAB FAB for smart sensors and actuators MEMS
Technical Report
Compact X-ray computed tomography system for nondestructive characterization of nano materials
Presentation
Full-text available
Key Enabling Technologies for Next Generation MEMS Sensors and Actuators
Patent
PROCEDIMENTO PER LA REALIZZAZIONE DI UN DISPOSITIVO A MICROAGHI, IN PARTICOLARE PER USO SENSORISTICO
Presentation
Full-text available
I Principi dei Principii (Riflessioni sulle Leggi di Natura) - - - - - The Princes of Principles (Thoughts about Nature Laws); VERSIONE ITALIANA E INGLESE DISPONIBILI; ENGLISH AND ITALIAN VERSIONS ARE AVAILABLE.
Conference Paper
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Diabetes is a chronic condition that occurs when the pancreas does not produce enough insulin or when the body cannot effectively use the insulin it produces. Several medical devices are commonly used to inject insulin into the patients: syringes, pens, conventional pumps. The presentation deals with a new insulin pump concept, based on MEMS techno...
Poster
Full-text available
Infusion Micro-Pump Development Using MEMS Technology
Chapter
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Hand-handled, wireless world represents the most challenging environment for package technology where all the system performances must be densely stacked. Chip scale package (CSP) is the generic term for packages approaching chip size, and the fine-pitch versions of BGA have become the most widely used kind of CSP for system miniaturization. With t...
Presentation
Full-text available
Multi-Function and Application Integration by Thin Silicon Die Packaging
Patent
Circuit structure integrated on a semiconductor substrate and relevant manufacturing method
Article
Wafer thinning process before dicing, die attach, wire bonding, and in resin molding package operations requires the protection of the silicon wafer surface by means of a sticking grinding tape. The adhesive layer between this tape and wafer front side can leave glue residuals both in terms of “macroscopic” particles and organic ultra-thin layer. T...
Article
The random formation of micrometric crystals on Al bonding pads can be an issue affecting wire bonding metal pad quality. The dry etch chemistry used to remove final passivation dielectric layers from the top of the bonding Al pad area is in fact based mainly on fluorine-containing gases (such as CF4, CHF3, etc.) which can leave fluorine as a resid...
Presentation
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Industrial Requirements for Thin Silicon Die Manufacturing and Packaging
Conference Paper
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Borophosphosilicate glass (BPSG) films produced by Sub-Atmospheric Pressure Chemical Vapor Deposition (SACVD) with different B and P concentrations have been investigated by ultra-violet (UV) Raman and electron paramagnetic resonance (EPR) spectroscopies. We observe a correlation between the main feature of the UV-Raman spectra in the as deposited...
Conference Paper
Full-text available
Thermally stimulated luminescence (TSL) and current (TSC) measurements above room temperature were performed on 1150 nm borophosphosilicate glass films obtained by sub-atmospheric chemical vapour deposition. Several concentrations of B and P ions were considered, in the range 2–5% and 4–9% in weight, respectively. A TSC peak of ionic character at 9...
Thesis
Full-text available
Studio di films dielettrici di pre-metallizzazione per circuiti integrati Flash-EEPROM in tecnologia ULSI
Poster
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Application study of PDM technique to PECVD dielectric film
Article
In microelectronics the thermal conductivity of dielectric films such as SiO2 is of concern because, as dimensions shrink, heat removal from devices becomes a critical problem. A scanning thermal microscope was used to image thermal properties of silicon dioxide films deposited on silicon by plasma enhanced chemical vapor deposition. Thermal conduc...
Article
Paramagnetic centers were studied in different SiOx:N,H films deposited by plasma-enhanced chemical vapor deposition in a wide composition range. The total dangling-bond concentration is detected to be proportional to the oxygen content. Moreover, sample irradiation by ultraviolet light revealed also that nitrogen impurities play some role. In part...
Conference Paper
2.2 MeV 4He+ and 7 MeV 15N2+ ion beams have been used to investigate, by in situ measurements, the hydrogen desorption processes in SiO2 thin films deposited by plasma enhanced chemical vapor deposition (PECVD). An effective cross-section of 3 × 10−16 cm2 for He and 17 × 10−16 cm2 for N has been measured for the ion-thin-film interaction phenomena....
Article
A single chamber system for plasma-enhanced chemical vapor deposition was employed to deposit different films of SiO x :N,H with 0.85⩽x⩽1.91, which are studied here by Fourier transform infrared transmission spectroscopy. The sample composition was determined by Rutherford backscattering spectrometry, nuclear reaction, and elastic recoil detection...
Article
A detailed study performed by means of infrared spectroscopy on Si-H stretching in silicon-rich silicon oxide films deposited by chemical vapor deposition is presented. The experimental spectra of as-deposited and annealed samples are interpreted on the basis of a generalization of the random bonding model. The results indicate that two kinds of Si...
Article
Quantitative in‐depth distribution of the elements contained in silicon‐rich oxide thin films deposited on single‐crystal silicon by low temperature plasma‐assisted deposition has been performed by a combination of various MeV ion beam techniques. The quantity of oxygen and nitrogen has been measured by nuclear reactions, the silicon content has be...
Conference Paper
A high inter-metal dielectric (IMD) planarization degree is requested in VLSI device manufacturing to avoid process degradation with increasing number of interconnection layers.In this work an IMD planarization process based on the use of spin on glass (SOG) for gap filling followed by SOG partial etch back (PEB) is presented.The main advantage of...
Conference Paper
Silicon oxynitride samples deposited by plasma-enhanced chemical vapour deposition are characterized by different techniques to obtain their stoichiometry and density. From these data and applying the tetrahedron model, the optical functions in the range from 0.23 to 0.90 μm are calculated and compared with the results of spectroscopic ellipsometry...
Article
Optical characterization of dielectric films used in integrated circuit device manu- facturing can give information on their optical behavior as well as on their structural properties and composition. The results obtained on several undoped and doped silicon oxides, silicon oxynitrides, and silicon nitrides usually employed for microelectronic appl...
Conference Paper
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Chemical bond analysis of Hydrogen-rich silicon oxynitride
Presentation
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Silicon Oxynitride Study by the Tetrahedron Model and by Spectroscopic Ellipsometry
Article
Silicate glasses, both undoped and lightly doped with phosphorus, prepared by a low pressure plasma enhanced chemical vapor deposition (PECVD) system using tetraethylorthosilicate or silane as silicon sources and atmospheric pressure chemical vapor deposition technique using silane, were evaluated. The three analyzed phosphosilicate films were nomi...
Conference Paper
In this work an inter-metal dielectric (IMD) planarization process, developed for multimetal submicron technology devices, is presented. The feasibility to build up to five metal levels with W blanket-etch back stacked plug interconnections is shown, using a new Spin On Glass (SOG) material and a semi-integrated planarization process in which a bak...
Conference Paper
Process characterization of 400 nm thick LPCVD-SiO2 films based on TEOS-Ozone chemistry was performed. Films were deposited on six inch silicon wafers using a single wafer cluster system. The process characterization was carried out starting from a standard process taken as reference, around which the main process parameters, temperature (300-430-d...
Conference Paper
A semi-integrated SOG/TEOS planarization process for intermetal dielectric (ILD) has been developed in the CVD cluster system Precision 5000 (Applied Materials). The process consists of SOG etch back performed in one chamber immediately followed by plasma TEOS deposition in another chamber of the system, to reduce particle contamination and moistur...
Article
Oxynitride optical properties in the visible-ultraviolet spectral range are very interesting, due to their use in electronic device manufacturing. This paper presents spectra of refractive index and extinction coefficient of oxynitride films deposited on silicon with different composition, as derived from spectroscopic ellipsometry measurements on...
Article
Borophosphosilicate glass films prepared by chemical vapor deposition techniques based on atmospheric pressure, low pressure with liquid and gaseous sources, and low pressure plasma enhanced processes in the temperature range of 390–680 °C have been studied. Films with low B (1.5 wt %) and high P (9.0 wt %) content were used for this study. To eval...
Presentation
Full-text available
Properties of Doped and Undoped Silicate Glass Films Based on TEOS and Silane Chemistry
Thesis
Studio microfotoelettrochimico della superficie di un semiconduttore

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